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Optical Mirrors

Mirrors are optical components that reflect light from their reflective surfaces. Reflectivity can be achieved using metallic substrates or by applying HR dielectric or metallic coatings to otherwise transmissive materials (usually glass).

Product	Wavelength Range	Substrate	Dimensions	Availability	Price (USD)
Wafer	632.8 nm (Metrology, Center Wavelength)	Fused Silica	Ø 100 mm	In stock	$ 181.00
Product Code Manufacturer Corning Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 100 mm Dimensions Ø 100 mm Thickness 0.35 mm Substrate Fused Silica Clear Aperture 85 mm Thickness Tolerance ±0.005 mm Weight 68.04 g Shape Round Surface Quality 60-40 scratch-dig Laser Cutting None Diameter Tolerance ±0.2 mm Laser Cut & Quality Levels As is. C of C only Laser Engraving None Material Grade 0F Bevels C-Bevel Edge Finish Fine Ground Supplier Location New York, USA Selected Product Option Laser Cutting: None Laser Engraving: None Laser Cut & Quality Levels: As is. C of C only See product details More from Sydor
Wafer	632.8 nm (Metrology, Center Wavelength)	Fused Silica	101.6 x 101.6 mm	In stock	$ 243.00
Product Code Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Dimensions 101.6 x 101.6 mm Substrate Fused Silica Clear Aperture 91.44 x 91.44 mm Weight 141.75 g Shape Square Surface Quality 60-40 scratch-dig Laser Cutting Semi-Notch Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving None Transmitted Wavefront Error < λ (per inch) Length 101.6 mm (4") Width Tolerance +0/-0.1 mm Width 101.6 mm (4") Length Tolerance +0/-0.1 mm Quality As is. C of C only Bevels Break Edge, Safety Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Semi-Notch Laser Cut & Engraving: None Laser Cut & Quality Levels: Full inspection with interferograms Quality Levels: As is. C of C only See product details More from Sydor
Wafer	632.8 nm (Metrology, Center Wavelength)	ArF	Ø 150 mm (Specify Laser Cutting Rectangle)	In stock	$ 1429.00
Product Code Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 150 mm Dimensions Ø 150 mm (Specify Laser Cutting Rectangle) Thickness 1 mm Parallelism < 20'' Substrate ArF Clear Aperture Ø 125 mm (S1) Thickness Tolerance +0.05/-0 mm Weight 85.05 g Shape Round (Specify Laser Cut Rectangle) Surface Quality 40-20 scratch-dig Laser Cutting Rectangle Diameter Tolerance ±0.2 mm Laser Cut & Quality Levels As is. C of C only Laser Engraving Individual Optic Surface Roughness < 1 nm (RMS) Bevels 0.25mm ± 0.10mm FW @ 45° Edge Finish Fine ground Supplier Location New York, USA Selected Product Option Laser Cutting: Rectangle Laser Cut & Engraving: Individual Optic Laser Cut & Quality Levels: As is. C of C only See product details More from Sydor
Wafer	632.8 nm (Metrology, Center Wavelength)	Fused Silica	101.6 x 101.6 mm (Specify Laser Cutting Diameter)	In stock	$ 573.00
Product Code Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Dimensions 101.6 x 101.6 mm (Specify Laser Cutting Diameter) Substrate Fused Silica Clear Aperture 91.44 x 91.44 mm Weight 141.75 g Shape Square (Specify Laser Cut Circle Diameter) Surface Quality 60-40 scratch-dig Laser Cutting Diameter Laser Cut & Quality Levels As is. C of C only Laser Engraving Individual Optic Transmitted Wavefront Error < λ (per inch) Length 101.6 mm (4") Width Tolerance +0/-0.1 mm Width 101.6 mm (4") Length Tolerance +0/-0.1 mm Quality Full inspection with interferograms Bevels Break Edge, Safety Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Diameter Laser Cut & Engraving: Individual Optic Laser Cut & Quality Levels: As is. C of C only Quality Levels: Full inspection with interferograms See product details More from Sydor
Wafer	632.8 nm (Metrology, Center Wavelength)	-	Ø 250 mm	In stock	$ 3578.00
Product Code Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 250 mm Dimensions Ø 250 mm Thickness 3 mm Clear Aperture 216 mm Thickness Tolerance ±0.1 mm Weight 141.75 g Shape Round Surface Quality 60-40 scratch-dig Laser Cutting Standard Semi-Flat Diameter Tolerance +0/-0.1 mm Laser Cut & Quality Levels As is. C of C only Laser Engraving Individual Optic Surface Roughness < 1 nm (RMS) Quality As is. C of C only Bevels 0.30mm to 1.00mm FW @ 45° Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Standard Semi-Flat Laser Cut & Engraving: Individual Optic Laser Cut & Quality Level: As is. C of C only Quality Levels: As is. C of C only See product details More from Sydor
Wafer	632.8 nm (Metrology, Center Wavelength)	Fused Silica	126.62 x 126.62 mm	In stock	$ 298.00
Product Code Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Dimensions 126.62 x 126.62 mm Thickness 1 mm Substrate Fused Silica Clear Aperture 107.6 x 107.6 mm Thickness Tolerance ±0.1 mm Weight 141.75 g Shape Square Surface Quality 20-10 scratch-dig Length 126.62 mm Width Tolerance ±0.1 mm Width 126.62 mm Length Tolerance ±0.1 mm Quality As is. C of C only Bevels Laser Blended or Safety Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Quality Levels: As is. C of C only See product details More from Sydor
Wafer	632 nm (Metrology, Center Wavelength)	Borofloat	Ø 100 mm	In stock	$ 118.00
Product Code Wavelength Range 632 nm (Metrology, Center Wavelength) Center Wavelength 632 nm (Metrology) Diameter 100 mm Dimensions Ø 100 mm Thickness 0.5 mm Substrate Borofloat Thickness Tolerance ±0.05 mm Weight 68.04 g Shape Round Surface Quality 40-20 scratch-dig Laser Cutting Standard Semi-Flat Diameter Tolerance ±0.1 mm Laser Cut & Quality Levels As is. C of C only Laser Engraving Individual Optic Warp 0.025 mm Bow 0.02 mm Bevels C-Bevel Edge Finish Fine Ground Supplier Location New York, USA Selected Product Option Laser Cutting: Standard Semi-Flat Laser Cut & Engraving: Individual Optic Laser Cut & Quality Levels: As is. C of C only See product details More from Sydor
Wafer	-	Fused Silica Ultra Low Expansion Glass	36 x 60 mm	In stock	$ 2235.00
Product Code Manufacturer Corning Dimensions 36 x 60 mm Thickness 4 mm Parallelism < 30'' Substrate Fused Silica Ultra Low Expansion Glass Clear Aperture 34.2 x 57 mm Thickness Tolerance ±0.2 mm Weight 340.19 g Shape Rectangular Surface Quality 20-10 scratch-dig (S1) Laser Cutting Semi-Notch Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving Individual Optic Surface Roughness < 440 pm (RMS) Reflected Wavefront Error < λ/40 (Surface 1) Length 60 mm Width Tolerance ±0.13 mm Width 36 mm Length Tolerance ±0.13 mm Bevels Break Edge Saftey Supplier Location New York, USA Selected Product Option Laser Cutting: Semi-Notch Laser Cut & Engraving: Individual Optic Laser Cut & Quality Levels: Full inspection with interferograms See product details More from Sydor
Wafer	632.8 nm (Metrology, Center Wavelength)	Fused Silica	Ø 142 mm	In stock	$ 543.00
Product Code Manufacturer Corning Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 142 mm Dimensions Ø 142 mm Thickness 6 mm Parallelism < 2' Substrate Fused Silica Clear Aperture 128 mm Thickness Tolerance +0/-0.15 mm Weight 68.04 g Shape Round Surface Quality 40-20 scratch-dig Laser Cutting Standard Semi-Flat Diameter Tolerance +0/-0.15 mm Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving None Material Grade 0G Transmitted Wavefront Error < λ/4 (per inch) Bevels 1.00mm Max FW @ 45° Edge Finish Fine Ground Supplier Location New York, USA Selected Product Option Laser Cutting: Standard Semi-Flat Laser Cut & Engraving: None Laser Cut & Quality Levels: Full inspection with interferograms See product details More from Sydor
Wafer	632 nm (Metrology, Center Wavelength)	Fused Silica	Ø 100 mm	In stock	$ 263.00
Product Code Wavelength Range 632 nm (Metrology, Center Wavelength) Center Wavelength 632 nm (Metrology) Diameter 100 mm Dimensions Ø 100 mm Thickness 2 mm Substrate Fused Silica Clear Aperture 85 mm Thickness Tolerance ±0.1 mm Weight 141.75 g Shape Round Surface Quality 40-20 scratch-dig Laser Cutting Standard Semi-Flat Diameter Tolerance ±0.2 mm Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving None Surface Roughness < 1 nm Transmitted Wavefront Error < λ/4 (per inch) Reflected Wavefront Error < λ Bevels Saftey Bevel Supplier Location New York, USA Selected Product Option Laser Cutting: Standard Semi-Flat Laser Cut & Engraving: None Laser Cut & Quality Levels: Full inspection with interferograms See product details More from Sydor
Wafer	632 nm (Metrology, Center Wavelength)	Fused Silica	Ø 150 mm	In stock	$ 237.00
Product Code Wavelength Range 632 nm (Metrology, Center Wavelength) Center Wavelength 632 nm (Metrology) Diameter 150 mm Dimensions Ø 150 mm Thickness 1.5 mm Substrate Fused Silica Clear Aperture 140 mm (S1) Thickness Tolerance ±0.01 mm Weight 68.04 g Shape Round Surface Quality 60-40 scratch-dig Laser Cutting Semi-Notch Diameter Tolerance ±0.2 mm Laser Cut & Quality Levels As is. C of C only Laser Engraving Individual Optic Bevels 0.750mm Radius C-bevel Edge Finish Fine Ground Supplier Location New York, USA Selected Product Option Laser Cutting: Semi-Notch Laser Cut & Engraving: Individual Optic Laser Cut & Quality Levels: As is. C of C only See product details More from Sydor
Wafer	632.8 nm (Metrology, Center Wavelength)	Fused Silica	Ø 200 mm	In stock	$ 610.00
Product Code Manufacturer Corning Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 200 mm Dimensions Ø 200 mm Thickness 3 mm Substrate Fused Silica Clear Aperture 170 mm Thickness Tolerance ±0.1 mm Weight 68.04 g Shape Round Surface Quality 40-20 scratch-dig Laser Cutting None Diameter Tolerance ±0.1 mm Laser Cut & Quality Levels As is. C of C only Laser Engraving None Material Grade 0F Bevels Safety Break Edge Edge Finish Fine Ground Supplier Location New York, USA Selected Product Option Laser Cutting: None Laser Engraving: None Laser Cut & Quality Level: As is. C of C only See product details More from Sydor
Wafer	632 nm (Metrology, Center Wavelength)	Fused Silica	Ø 200 mm	In stock	$ 445.00
Product Code Wavelength Range 632 nm (Metrology, Center Wavelength) Center Wavelength 632 nm (Metrology) Diameter 200 mm Dimensions Ø 200 mm Thickness 0.5 mm Substrate Fused Silica Clear Aperture 170 mm Thickness Tolerance ±0.1 mm Weight 141.75 g Shape Round Surface Quality 40-20 scratch-dig Laser Cutting Semi-Notch Diameter Tolerance ±0.1 mm Laser Cut & Quality Levels As is. C of C only Laser Engraving Individual Optic Surface Roughness < 1 nm Warp < 0.025 mm Bow < 0.025 mm Bevels Saftey Bevel Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Semi-Notch Laser Cut & Engraving: Individual Optic Laser Cut & Quality Level: As is. C of C only See product details More from Sydor
Wafer	632.8 nm (Metrology, Center Wavelength)	D 263	Ø 100 mm	In stock	$ 277.00
Product Code Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 100 mm Dimensions Ø 100 mm Thickness 0.3 mm Substrate D 263 Clear Aperture 95 mm Thickness Tolerance +0/-0.05 mm Weight 68.04 g Shape Round Surface Quality 40-20 scratch-dig Diameter Tolerance +0/-0.25 mm Quality Full inspection with interferograms Bevels Safety Break Edge Edge Finish Fine Ground Supplier Location New York, USA Selected Product Option Quality Levels: Full inspection with interferograms See product details More from Sydor
Wafer	632.8 nm (Metrology, Center Wavelength)	N-BK7	Ø 127 mm (5")	In stock	$ 407.00
Product Code Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 127 mm (5") Dimensions Ø 127 mm (5") Thickness 4 mm Parallelism < 1' Substrate N-BK7 Clear Aperture 116.84 mm (Minimum) Thickness Tolerance +0/-0.15 mm Weight 141.75 g Shape Round Surface Quality 60-40 scratch-dig Diameter Tolerance ±0.051 mm Transmitted Wavefront Error < λ/4, < λ/8 Reflected Wavefront Error < 3λ/2 Quality As is. C of C only Bevels 0.25mm - 0.5mm x 45° FW Edge Finish Fine Edge Ground Supplier Location New York, USA Selected Product Option Quality Levels: As is. C of C only See product details More from Sydor
Wafer	632 nm (Metrology, Center Wavelength)	Fused Silica	Ø 209.55 mm (Specify Laser Cutting Diameter)	In stock	$ 2556.00
Product Code Manufacturer Corning Wavelength Range 632 nm (Metrology, Center Wavelength) Center Wavelength 632 nm (Metrology) Diameter 209.55 mm Dimensions Ø 209.55 mm (Specify Laser Cutting Diameter) Thickness 5 mm Substrate Fused Silica Thickness Tolerance ±0.25 mm Weight 907.18 g Shape Round Surface Quality 60-40 scratch-dig Laser Cutting Diameter Diameter Tolerance +0/-0.25 mm Laser Cut & Quality Levels As is. C of C only Laser Engraving Individual Optic Material Grade 0G Transmitted Wavefront Error < λ/4 -3 to 5λ/2 < λ/10 (RMS) Edge Finish Fine Edge Ground Supplier Location New York, USA Selected Product Option Laser Cutting: Diameter Laser Cut & Engraving: Individual Optic Laser Cut & Quality Level: As is. C of C only See product details More from Sydor
Wafer	632 nm (Metrology, Center Wavelength)	Borofloat	Ø 200 mm (Specify Laser Cutting Rectangle)	In stock	$ 557.00
Product Code Wavelength Range 632 nm (Metrology, Center Wavelength) Center Wavelength 632 nm (Metrology) Diameter 200 mm Dimensions Ø 200 mm (Specify Laser Cutting Rectangle) Thickness 0.75 mm Substrate Borofloat Clear Aperture 170 mm Thickness Tolerance ±0.05 mm Weight 68.04 g Shape Round (Specify Laser Cut Rectangle) Surface Quality 20-10 scratch-dig Laser Cutting Rectangle Diameter Tolerance ±0.1 mm Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving Individual Optic Bevels Break Edge Safety Edge Finish Fine Ground Supplier Location New York, USA Selected Product Option Laser Cutting: Rectangle Laser Cut & Engraving: Individual Optic Laser Cut & Quality Level: Full inspection with interferograms See product details More from Sydor
Wafer	-	S-BSL7	36.125 x 84.89 mm	In stock	$ 1007.00
Product Code Manufacturer Ohara Dimensions 36.125 x 84.89 mm Substrate S-BSL7 Clear Aperture 36.125 x 84.89 mm Weight 141.75 g Shape Rectangular Surface Quality 80-50 scratch-dig Length 84.89 mm Width Tolerance +0/-0.1 mm Width 36.125 mm Quality Full inspection with interferograms Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Quality Levels: Full inspection with interferograms See product details More from Sydor
Wafer	632.8 nm (Metrology, Center Wavelength)	Fused Silica	Ø 150 mm	In stock	$ 328.00
Product Code Manufacturer Corning Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 150 mm Dimensions Ø 150 mm Thickness 1.324 mm Parallelism < 10'' Substrate Fused Silica Clear Aperture Ø 140 mm Thickness Tolerance ±0.015 mm Weight 198.45 g Shape Round Surface Quality 60-40 scratch-dig Laser Cutting Semi-Notch Diameter Tolerance ±0.1 mm Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving None Surface Roughness < 700 pm (RMS) Material Grade 0F Transmitted Wavefront Error 2λ (per inch) Bevels Safety break edge Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Semi-Notch Laser Cut & Engraving: None Laser Cut & Quality Levels: Full inspection with interferograms See product details More from Sydor
Wafer	633 nm (Metrology, Center Wavelength)	Borofloat	160 x 160 mm	In stock	$ 268.00
Product Code Manufacturer SCHOTT Wavelength Range 633 nm (Metrology, Center Wavelength) Center Wavelength 633 nm (Metrology) Dimensions 160 x 160 mm Thickness 2 mm Substrate Borofloat Clear Aperture 156 mm Thickness Tolerance ±0.035 mm Weight 226.8 g Shape Square Surface Quality 40-20 scratch-dig Laser Cutting Semi-Notch Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving None Length 160 mm Width Tolerance ±1 mm Width 160 mm Length Tolerance ±1 mm Bevels 0.3mm ±0.2mm LW @ 45° ±5° Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Semi-Notch Laser Cut & Engraving: None Laser Cut & Quality Level: Full inspection with interferograms See product details More from Sydor