Mirror Blanks

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Also known as flats, blanks are optical components made of bare substrates which will be coated with reflective coatings to create front-surface flat mirrors. Learn More

Product	Dimensions	Shape	Substrate	Availability	Price (USD)
Wafer	Ø 150 mm	Round	Suprasil 3001	In stock	$ 4978.00
Product Code Wavelength Range 633 nm (Metrology, Center Wavelength) Center Wavelength 633 nm (Metrology) Diameter 150 mm Dimensions Ø 150 mm Thickness 3 mm Parallelism < 10'' Shape Round Substrate Suprasil 3001 Clear Aperture 3 mm Weight 198.45 g Surface Quality 40-20 scratch-dig Thickness Tolerance ±0.05 mm Laser Cut & Quality Levels As is. C of C only Laser Cutting Semi-Notch Laser Engraving Individual Optic Diameter Tolerance ±0.2 mm Surface Roughness < 800 pm (RMS) Transmitted Wavefront Error 2λ (633 nm) Edge Finish Fine ground Supplier Location New York, USA Selected Product Option Laser Cutting: Semi-Notch Laser Cut & Engraving: Individual Optic Laser Cut & Quality Levels: As is. C of C only See product details More from Sydor
Wafer	-	-	Silicon Carbide	1 - 2 weeks	$ 1065.00
Product Code Substrate Silicon Carbide Supplier Location New Jersey, USA See product details More from Avantier Inc.
Wafer	304.8 x 304.8 mm	Square	N-BK7	In stock	$ 1380.00
Product Code Manufacturer SCHOTT Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Dimensions 304.8 x 304.8 mm Thickness 2.286 mm Shape Square Substrate N-BK7 Clear Aperture 259.08 x 259.08 mm Weight 453.59 g Surface Quality 60-40 scratch-dig Thickness Tolerance ±0.127 mm Reflected Wavefront Error 2λ Length 304.8 mm Width Tolerance ±0.127 mm Width 304.8 mm Length Tolerance ±0.127 mm Quality Full inspection with interferograms Bevels Break Edge Supplier Location New York, USA Selected Product Option Quality Levels: Full inspection with interferograms See product details More from Sydor
Wafer	10 x 10 mm	Square	Silicon Carbide	1 - 2 weeks	Add to cart to request quote
Product Code Dimensions 10 x 10 mm Shape Square Substrate Silicon Carbide Supplier Location New Jersey, USA See product details More from Avantier Inc.
Wafer	Ø 250 mm (Specify Laser Cutting Rectangle)	Round (Specify Laser Cut Rectangle)	Fused Silica	In stock	$ 625.00
Product Code Wavelength Range 632 nm (Metrology, Center Wavelength) Center Wavelength 632 nm (Metrology) Diameter 250 mm Dimensions Ø 250 mm (Specify Laser Cutting Rectangle) Thickness 1.04 mm Parallelism < 3'' (1", 25.4 mm) Shape Round (Specify Laser Cut Rectangle) Substrate Fused Silica Clear Aperture 237.5 mm Weight 226.8 g Surface Quality 40-20 scratch-dig Thickness Tolerance ±0.04 mm Laser Cut & Quality Levels Full Inspection with Interferograms Laser Cutting Rectangle Laser Engraving None Diameter Tolerance +0/-0.25 mm Transmitted Wavefront Error < λ/10 (RMS) Reflected Wavefront Error < λ/10 (RMS) Edge Finish Fine ground Supplier Location New York, USA Selected Product Option Laser Cutting: Rectangle Laser Cut & Engraving: None Laser Cut & Quality Level: Full inspection with interferograms See product details More from Sydor
Wafer	5 x 5 mm	Square	Silicon Carbide	1 - 2 weeks	Add to cart to request quote
Product Code Dimensions 5 x 5 mm Shape Square Substrate Silicon Carbide Supplier Location New Jersey, USA See product details More from Avantier Inc.
Wafer	Ø 150 mm (Specify Laser Cutting Rectangle)	Round (Specify Laser Cut Rectangle)	Fused Silica	In stock	$ 556.00
Product Code Manufacturer Corning Wavelength Range 632 nm (Metrology, Center Wavelength) Center Wavelength 632 nm (Metrology) Diameter 150 mm Dimensions Ø 150 mm (Specify Laser Cutting Rectangle) Thickness 1 mm Shape Round (Specify Laser Cut Rectangle) Substrate Fused Silica Clear Aperture 140 mm, 139.27 mm Weight 141.75 g Surface Quality 60-40 scratch-dig Thickness Tolerance ±0.01 mm Laser Cut & Quality Levels Full Inspection with Interferograms Laser Cutting Rectangle Laser Engraving Individual Optic Diameter Tolerance ±0.2 mm Material Grade 0G Bevels 0.5mm Radius "C" Bevel Edge Finish Fine Edge Ground Supplier Location New York, USA Selected Product Option Laser Cutting: Rectangle Laser Cut & Engraving: Individual Optic Laser Cut & Quality Levels: Full inspection with interferograms See product details More from Sydor
Wafer	10 x 10 mm	Square	Silicon Carbide	1 - 2 weeks	Add to cart to request quote
Product Code Dimensions 10 x 10 mm Shape Square Substrate Silicon Carbide Supplier Location New Jersey, USA See product details More from Avantier Inc.
Wafer	-	-	Silicon Carbide	1 - 2 weeks	Add to cart to request quote
Product Code Substrate Silicon Carbide Supplier Location New Jersey, USA See product details More from Avantier Inc.
Wafer	Ø 100 mm (Specify Laser Cutting Diameter)	Round	Fused Silica	In stock	$ 383.00
Product Code Manufacturer Corning Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 100 mm Dimensions Ø 100 mm (Specify Laser Cutting Diameter) Thickness 0.965 mm Parallelism < 1' Shape Round Substrate Fused Silica Clear Aperture 92 mm Weight 68.04 g Surface Quality 40-20 scratch-dig Thickness Tolerance ±0.012 mm Laser Cut & Quality Levels As is. C of C only Laser Cutting Diameter Laser Engraving None Diameter Tolerance ±0.1 mm Surface Roughness < 700 pm Material Grade 0F Transmitted Wavefront Error < 3λ/4 Bevels Visible to 0.30mm max leg dimension Edge Finish Fine Ground Supplier Location New York, USA Selected Product Option Laser Cutting: Diameter Laser Cut & Engraving: None Laser Cut & Quality Levels: As is. C of C only See product details More from Sydor
Wafer	160 x 160 mm (Specify Laser Cutting Rectangle)	Square	Borofloat	In stock	$ 558.00
Product Code Manufacturer SCHOTT Wavelength Range 633 nm (Metrology, Center Wavelength) Center Wavelength 633 nm (Metrology) Dimensions 160 x 160 mm (Specify Laser Cutting Rectangle) Thickness 2 mm Shape Square Substrate Borofloat Clear Aperture 156 mm Weight 226.8 g Surface Quality 40-20 scratch-dig Thickness Tolerance ±0.035 mm Laser Cut & Quality Levels Full Inspection with Interferograms Laser Cutting Rectangle Laser Engraving None Length 160 mm Width Tolerance ±1 mm Width 160 mm Length Tolerance ±1 mm Bevels 0.3mm ±0.2mm LW @ 45° ±5° Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Rectangle Laser Cut & Engraving: None Laser Cut & Quality Level: Full inspection with interferograms See product details More from Sydor
Wafer	-	-	Silicon Carbide	1 - 2 weeks	Add to cart to request quote
Product Code Substrate Silicon Carbide Supplier Location New Jersey, USA See product details More from Avantier Inc.
Wafer	-	-	Silicon Carbide	1 - 2 weeks	$ 1275.00
Product Code Substrate Silicon Carbide Supplier Location New Jersey, USA See product details More from Avantier Inc.
Wafer	Ø 250 mm (Specify Laser Cutting Diameter)	Round	-	In stock	$ 3898.00
Product Code Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 250 mm Dimensions Ø 250 mm (Specify Laser Cutting Diameter) Thickness 3 mm Shape Round Clear Aperture 216 mm Weight 141.75 g Surface Quality 60-40 scratch-dig Thickness Tolerance ±0.1 mm Laser Cut & Quality Levels Full Inspection with Interferograms Laser Cutting Diameter Laser Engraving None Diameter Tolerance +0/-0.1 mm Surface Roughness < 1 nm (RMS) Quality Full inspection with interferograms Bevels 0.30mm to 1.00mm FW @ 45° Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Diameter Laser Cut & Engraving: None Laser Cut & Quality Level: Full inspection with interferograms Quality Levels: Full inspection with interferograms See product details More from Sydor
Wafer	-	-	Silicon Carbide	1 - 2 weeks	$ 640.00
Product Code Substrate Silicon Carbide Supplier Location New Jersey, USA See product details More from Avantier Inc.
Wafer	Ø 100 mm (Specify Laser Cutting Diameter)	Round	Fused Silica	In stock	$ 425.00
Product Code Wavelength Range 633 nm (Metrology, Center Wavelength) Center Wavelength 633 nm (Metrology) Diameter 100 mm Dimensions Ø 100 mm (Specify Laser Cutting Diameter) Thickness 1.5 mm Parallelism < 10'' Shape Round Substrate Fused Silica Clear Aperture 90 mm Weight 85.05 g Surface Quality 60-40 scratch-dig Thickness Tolerance ±0.05 mm Laser Cut & Quality Levels As is. C of C only Laser Cutting Diameter Laser Engraving None Diameter Tolerance ±0.1 mm Bevels C-bevel Edge Finish Fine ground Supplier Location New York, USA Selected Product Option Laser Cutting: Diameter Laser Cut & Engraving: None Laser Cut & Quality Levels: As is. C of C only See product details More from Sydor
Wafer	101.6 x 101.6 mm (Specify Laser Cutting Rectangle)	Square	Fused Silica	In stock	$ 623.00
Product Code Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Dimensions 101.6 x 101.6 mm (Specify Laser Cutting Rectangle) Shape Square Substrate Fused Silica Clear Aperture 91.44 x 91.44 mm Weight 141.75 g Surface Quality 60-40 scratch-dig Laser Cut & Quality Levels Full Inspection with Interferograms Laser Cutting Rectangle Laser Engraving Individual Optic Transmitted Wavefront Error < λ (per inch) Length 101.6 mm (4") Width Tolerance +0/-0.1 mm Width 101.6 mm (4") Length Tolerance +0/-0.1 mm Quality Full inspection with interferograms Bevels Break Edge, Safety Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Rectangle Laser Cut & Engraving: Individual Optic Laser Cut & Quality Levels: Full inspection with interferograms Quality Levels: Full inspection with interferograms See product details More from Sydor
Wafer	5 x 5 mm	Square	Silicon Carbide	1 - 2 weeks	Add to cart to request quote
Product Code Dimensions 5 x 5 mm Shape Square Substrate Silicon Carbide Supplier Location New Jersey, USA See product details More from Avantier Inc.
Wafer	Ø 250 mm	Round	Fused Silica	In stock	$ 285.00
Product Code Wavelength Range 632 nm (Metrology, Center Wavelength) Center Wavelength 632 nm (Metrology) Diameter 250 mm Dimensions Ø 250 mm Thickness 1.04 mm Parallelism < 3'' (1", 25.4 mm) Shape Round Substrate Fused Silica Clear Aperture 237.5 mm Weight 226.8 g Surface Quality 40-20 scratch-dig Thickness Tolerance ±0.04 mm Laser Cut & Quality Levels As is. C of C only Laser Cutting Semi-Notch Laser Engraving None Diameter Tolerance +0/-0.25 mm Transmitted Wavefront Error < λ/10 (RMS) Reflected Wavefront Error < λ/10 (RMS) Edge Finish Fine ground Supplier Location New York, USA Selected Product Option Laser Cutting: Semi-Notch Laser Cut & Engraving: None Laser Cut & Quality Level: As is. C of C only See product details More from Sydor
Wafer	-	-	Silicon Carbide	1 - 2 weeks	Add to cart to request quote
Product Code Substrate Silicon Carbide Supplier Location New Jersey, USA See product details More from Avantier Inc.