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Optical Mirrors

Mirrors are optical components that reflect light from their reflective surfaces. Reflectivity can be achieved using metallic substrates or by applying HR dielectric or metallic coatings to otherwise transmissive materials (usually glass).

Product	Wavelength Range	Substrate	Dimensions	Availability	Price (USD)
Wafer	632 nm (Metrology, Center Wavelength)	Fused Silica	Ø 209.55 mm	In stock	$ 2256.00
Product Code Manufacturer Corning Wavelength Range 632 nm (Metrology, Center Wavelength) Center Wavelength 632 nm (Metrology) Diameter 209.55 mm Dimensions Ø 209.55 mm Thickness 5 mm Substrate Fused Silica Thickness Tolerance ±0.25 mm Weight 907.18 g Laser Cutting Standard Semi-Flat Diameter Tolerance +0/-0.25 mm Shape Round Surface Quality 60-40 scratch-dig Laser Cut & Quality Levels As is. C of C only Laser Engraving None Material Grade 0G Transmitted Wavefront Error < λ/4 -3 to 5λ/2 < λ/10 (RMS) Edge Finish Fine Edge Ground Supplier Location New York, USA Selected Product Option Laser Cutting: Standard Semi-Flat Laser Cut & Engraving: None Laser Cut & Quality Level: As is. C of C only See product details More from Sydor
Wafer	633 nm (Metrology, Center Wavelength)	Suprasil 3001	Ø 150 mm (Specify Laser Cutting Rectangle)	In stock	$ 5228.00
Product Code Wavelength Range 633 nm (Metrology, Center Wavelength) Center Wavelength 633 nm (Metrology) Diameter 150 mm Dimensions Ø 150 mm (Specify Laser Cutting Rectangle) Thickness 3 mm Parallelism < 10'' Substrate Suprasil 3001 Clear Aperture 3 mm Thickness Tolerance ±0.05 mm Weight 198.45 g Laser Cutting Rectangle Diameter Tolerance ±0.2 mm Shape Round (Specify Laser Cut Rectangle) Surface Quality 40-20 scratch-dig Surface Roughness < 800 pm (RMS) Laser Cut & Quality Levels As is. C of C only Laser Engraving None Transmitted Wavefront Error 2λ (633 nm) Edge Finish Fine ground Supplier Location New York, USA Selected Product Option Laser Cutting: Rectangle Laser Cut & Engraving: None Laser Cut & Quality Levels: As is. C of C only See product details More from Sydor
Wafer	-	ArF, Fused Silica	Ø 125 mm	In stock	$ 2290.00
Product Code Manufacturer Corning Diameter 125 mm Dimensions Ø 125 mm Thickness 2.34 mm Parallelism < 10'' Substrate ArF, Fused Silica Clear Aperture 106.25 mm Thickness Tolerance ±0.05 mm Weight 141.75 g Laser Cutting Standard Semi-Flat Diameter Tolerance ±0.1 mm Shape Round Surface Quality 60-40 scratch-dig Surface Roughness < 700 pm (RMS) Laser Cut & Quality Levels As is. C of C only Laser Engraving Individual Optic Material Grade 1F Bevels >0.5mm, stoned to lessen fracture point Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Standard Semi-Flat Laser Cut & Engraving: Individual Optic Laser Cut & Quality Levels: As is. C of C only See product details More from Sydor
Wafer	632.8 nm (Metrology, Center Wavelength)	Fused Silica	Ø 150 mm	In stock	$ 661.00
Product Code Manufacturer Corning Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 150 mm Dimensions Ø 150 mm Thickness 0.381 mm Substrate Fused Silica Clear Aperture 3 mm Thickness Tolerance ±0.01 mm Weight 68.04 g Laser Cutting None Diameter Tolerance ±0.2 mm Shape Round Surface Quality 20-10 scratch-dig Laser Cut & Quality Levels As is. C of C only Laser Engraving Individual Optic Material Grade 0F Transmitted Wavefront Error < λ/5 (6 mm) Bevels C-Bevel Edge Finish Fine Ground Supplier Location New York, USA Selected Product Option Laser Cutting: None Laser Engraving: Individual Optic Laser Cut & Quality Levels: As is. C of C only See product details More from Sydor
Wafer	632.8 nm (Metrology, Center Wavelength)	Fused Silica	Ø 100 mm (Specify Laser Cutting Rectangle)	In stock	$ 824.00
Product Code Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 100 mm Dimensions Ø 100 mm (Specify Laser Cutting Rectangle) Thickness 1 mm Substrate Fused Silica Clear Aperture 90 mm Thickness Tolerance ±0.05 mm Weight 198.45 g Laser Cutting Rectangle Diameter Tolerance ±0.1 mm Shape Round (Specify Laser Cut Rectangle) Surface Quality 20-10 scratch-dig Surface Roughness < 1 nm Laser Cut & Quality Levels As is. C of C only Laser Engraving None Bevels 0.3mm - 0.5mm FW @ 45° Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Rectangle Laser Cut & Engraving: None Laser Cut & Quality Levels: As is. C of C only See product details More from Sydor
Wafer	632 nm (Metrology, Center Wavelength)	Fused Silica	Ø 200 mm	In stock	$ 445.00
Product Code Wavelength Range 632 nm (Metrology, Center Wavelength) Center Wavelength 632 nm (Metrology) Diameter 200 mm Dimensions Ø 200 mm Thickness 0.7 mm Substrate Fused Silica Clear Aperture 170 mm Thickness Tolerance ±0.1 mm Weight 141.75 g Laser Cutting None Diameter Tolerance ±0.2 mm Shape Round Surface Quality 40-20 scratch-dig Surface Roughness < 1 nm Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving Individual Optic Warp < 0.025 mm Bow < 0.025 mm Bevels Saftey Bevel Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: None Laser Engraving: Individual Optic Laser Cut & Quality Level: Full inspection with interferograms See product details More from Sydor
Wafer	632 nm (Metrology, Center Wavelength)	Fused Silica	Ø 200 mm	In stock	$ 395.00
Product Code Wavelength Range 632 nm (Metrology, Center Wavelength) Center Wavelength 632 nm (Metrology) Diameter 200 mm Dimensions Ø 200 mm Thickness 0.7 mm Substrate Fused Silica Clear Aperture 170 mm Thickness Tolerance ±0.1 mm Weight 141.75 g Laser Cutting Semi-Notch Diameter Tolerance ±0.2 mm Shape Round Surface Quality 40-20 scratch-dig Surface Roughness < 1 nm Laser Cut & Quality Levels As is. C of C only Laser Engraving None Warp < 0.025 mm Bow < 0.025 mm Bevels Saftey Bevel Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Semi-Notch Laser Cut & Engraving: None Laser Cut & Quality Level: As is. C of C only See product details More from Sydor
Wafer	632 nm (Metrology, Center Wavelength)	Fused Silica	Ø 100 mm	In stock	$ 207.00
Product Code Manufacturer Corning Wavelength Range 632 nm (Metrology, Center Wavelength) Center Wavelength 632 nm (Metrology) Diameter 100 mm Dimensions Ø 100 mm Thickness 1 mm Substrate Fused Silica Clear Aperture 85 mm Thickness Tolerance ±0.05 mm Weight 68.04 g Laser Cutting Standard Semi-Flat Diameter Tolerance ±0.1 mm Shape Round Surface Quality 40-20 scratch-dig Surface Roughness < 1.3 nm (RMS) Laser Cut & Quality Levels As is. C of C only Laser Engraving None Material Grade 0F Warp 0.015 mm Bow 0.01 mm Bevels C-Bevel Edge Finish Fine Ground Supplier Location New York, USA Selected Product Option Laser Cutting: Standard Semi-Flat Laser Cut & Engraving: None Laser Cut & Quality Levels: As is. C of C only See product details More from Sydor
Wafer	632.8 nm (Metrology, Center Wavelength)	Fused Silica	Ø 100 mm (Specify Laser Cutting Diameter)	In stock	$ 630.00
Product Code Manufacturer Corning Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 100 mm Dimensions Ø 100 mm (Specify Laser Cutting Diameter) Thickness 1.879 mm Parallelism < 1' 22.2'' Substrate Fused Silica Clear Aperture 92 mm Thickness Tolerance ±0.025 mm Weight 141.75 g Laser Cutting Diameter Diameter Tolerance +0.1/-0.2 mm Shape Round Surface Quality 60-40 scratch-dig Surface Roughness < 700 pm Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving None Bevels Visible to 0.30mm max LW Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Diameter Laser Cut & Engraving: None Laser Cut & Quality Levels: Full inspection with interferograms See product details More from Sydor
Wafer	632.8 nm (Metrology, Center Wavelength)	ArF, Fused Silica	Ø 150 mm	In stock	$ 1197.00
Product Code Manufacturer Corning Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 150 mm Dimensions Ø 150 mm Thickness 1 mm Parallelism < 10'' Substrate ArF, Fused Silica Clear Aperture 127.5 mm Thickness Tolerance ±0.1 mm Weight 226.8 g Laser Cutting Standard Semi-Flat Diameter Tolerance ±0.2 mm Shape Round Surface Quality 20-10 scratch-dig Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving Individual Optic Material Grade 0F Bevels 0.30mm MAX FW @ 45 degrees, all edges Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Standard Semi-Flat Laser Cut & Engraving: Individual Optic Laser Cut & Quality Levels: Full inspection with interferograms See product details More from Sydor
Wafer	632.8 nm (Metrology, Center Wavelength)	Fused Silica	Ø 100 mm	In stock	$ 233.00
Product Code Manufacturer Corning Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 100 mm Dimensions Ø 100 mm Thickness 0.965 mm Parallelism < 1' Substrate Fused Silica Clear Aperture 92 mm Thickness Tolerance ±0.012 mm Weight 68.04 g Laser Cutting Semi-Notch Diameter Tolerance ±0.1 mm Shape Round Surface Quality 40-20 scratch-dig Surface Roughness < 700 pm Laser Cut & Quality Levels As is. C of C only Laser Engraving Individual Optic Material Grade 0F Transmitted Wavefront Error < 3λ/4 Bevels Visible to 0.30mm max leg dimension Edge Finish Fine Ground Supplier Location New York, USA Selected Product Option Laser Cutting: Semi-Notch Laser Cut & Engraving: Individual Optic Laser Cut & Quality Levels: As is. C of C only See product details More from Sydor
Wafer	632 nm (Metrology, Center Wavelength)	Fused Silica	Ø 200 mm (Specify Laser Cutting Diameter)	In stock	$ 785.00
Product Code Wavelength Range 632 nm (Metrology, Center Wavelength) Center Wavelength 632 nm (Metrology) Diameter 200 mm Dimensions Ø 200 mm (Specify Laser Cutting Diameter) Thickness 0.5 mm Substrate Fused Silica Clear Aperture 170 mm Thickness Tolerance ±0.1 mm Weight 141.75 g Laser Cutting Diameter Diameter Tolerance ±0.1 mm Shape Round Surface Quality 40-20 scratch-dig Surface Roughness < 1 nm Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving Individual Optic Warp < 0.025 mm Bow < 0.025 mm Bevels Saftey Bevel Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Diameter Laser Cut & Engraving: Individual Optic Laser Cut & Quality Level: Full inspection with interferograms See product details More from Sydor
Wafer	632 nm (Metrology, Center Wavelength)	Borofloat	Ø 100 mm	In stock	$ 53.00
Product Code Wavelength Range 632 nm (Metrology, Center Wavelength) Center Wavelength 632 nm (Metrology) Diameter 100 mm Dimensions Ø 100 mm Thickness 0.5 mm Substrate Borofloat Thickness Tolerance ±0.05 mm Weight 68.04 g Laser Cutting None Diameter Tolerance ±0.1 mm Shape Round Surface Quality 40-20 scratch-dig Laser Cut & Quality Levels As is. C of C only Laser Engraving None Warp 0.025 mm Bow 0.02 mm Bevels C-Bevel Edge Finish Fine Ground Supplier Location New York, USA Selected Product Option Laser Cutting: None Laser Engraving: None Laser Cut & Quality Levels: As is. C of C only See product details More from Sydor
Wafer	632.8 nm (Metrology, Center Wavelength)	Fused Silica	Ø 110 mm	In stock	$ 241.00
Product Code Manufacturer Corning Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 110 mm Dimensions Ø 110 mm Thickness 3 mm Parallelism < 5' Substrate Fused Silica Clear Aperture 93.5 mm Thickness Tolerance ±0.5 mm Weight 68.04 g Laser Cutting Standard Semi-Flat Diameter Tolerance ±0.075 mm Shape Round Surface Quality 60-40 scratch-dig Surface Roughness 1.5 nm (2.5 μm²) Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving None Material Grade 2C Transmitted Wavefront Error λ/2 (per inch) Bevels Break Edge Safety Edge Finish Fine Ground Supplier Location New York, USA Selected Product Option Laser Cutting: Standard Semi-Flat Laser Cut & Engraving: None Laser Cut & Quality Levels: Full inspection with interferograms See product details More from Sydor
Wafer	632 nm (Metrology, Center Wavelength)	Fused Silica	Ø 100 mm	In stock	$ 220.00
Product Code Wavelength Range 632 nm (Metrology, Center Wavelength) Center Wavelength 632 nm (Metrology) Diameter 100 mm Dimensions Ø 100 mm Thickness 0.51 mm Parallelism < 10'' Substrate Fused Silica Clear Aperture 85 mm Thickness Tolerance ±0.05 mm Weight 141.75 g Laser Cutting Standard Semi-Flat Diameter Tolerance ±0.1 mm Shape Round Surface Quality 40-20 scratch-dig Surface Roughness < 700 pm (RMS) Laser Cut & Quality Levels As is. C of C only Laser Engraving None Material Grade 0F Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Standard Semi-Flat Laser Cut & Engraving: None Laser Cut & Quality Levels: As is. C of C only See product details More from Sydor
Wafer	632 nm (Metrology, Center Wavelength)	Fused Silica	63.5 x 63.5 mm (2.5 x 2.5")	In stock	$ 161.00
Product Code Manufacturer Corning Wavelength Range 632 nm (Metrology, Center Wavelength) Center Wavelength 632 nm (Metrology) Dimensions 63.5 x 63.5 mm (2.5 x 2.5") Thickness 1.96 mm Substrate Fused Silica Clear Aperture 57.15 x 57.15 mm Thickness Tolerance ±0.02 mm Weight 226.8 g Laser Cutting Standard Semi-Flat Shape Square Surface Quality 40-20 scratch-dig Surface Roughness < 1 nm (RMS) Laser Cut & Quality Levels As is. C of C only Laser Engraving Individual Optic Material Grade 0A Reflected Wavefront Error λ/4 Length 63.5 mm (2.5") Width Tolerance +0/-0.25 mm Width 63.5 mm (2.5") Length Tolerance +0/-0.25 mm Edge Finish Fine Edge Ground Supplier Location New York, USA Selected Product Option Laser Cutting: Standard Semi-Flat Laser Cut & Engraving: Individual Optic Laser Cut & Quality Levels: As is. C of C only See product details More from Sydor
Wafer	632.8 nm (Metrology, Center Wavelength)	Fused Silica	Ø 200 mm (Specify Laser Cutting Diameter)	In stock	$ 1230.00
Product Code Manufacturer Corning Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 200 mm Dimensions Ø 200 mm (Specify Laser Cutting Diameter) Thickness 0.725 mm Parallelism < 5'' Substrate Fused Silica Clear Aperture 5 mm Thickness Tolerance ±0.05 mm Weight 283.5 g Laser Cutting Diameter Diameter Tolerance ±0.1 mm Shape Round Surface Quality 20-10 scratch-dig Surface Roughness < 100 μm - 1 mm (0.1 mm, 1.5 nm, 0.5 nm, RMS, RMS) Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving None Material Grade 0C Transmitted Wavefront Error < λ/4 (RMS) Bevels C-bevel Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Diameter Laser Cut & Engraving: None Laser Cut & Quality Level: Full inspection with interferograms See product details More from Sydor
Wafer	632.8 nm (Metrology, Center Wavelength)	Fused Silica	Ø 200 mm	In stock	$ 1315.00
Product Code Manufacturer Corning Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 200 mm Dimensions Ø 200 mm Thickness 5.25 mm Substrate Fused Silica Clear Aperture 185 mm Thickness Tolerance ±0.05 mm Weight 283.5 g Laser Cutting None Diameter Tolerance ±0.1 mm Shape Round Surface Quality 20-10 scratch-dig Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving Individual Optic Reflected Wavefront Error < 20λ Bevels 0.50mm MAX FW @ 45° Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: None Laser Engraving: Individual Optic Laser Cut & Quality Level: Full inspection with interferograms See product details More from Sydor
Wafer	195 - 2100 nm	UV Fused Silica	Ø 203 mm (Specify Laser Cutting Rectangle)	In stock	$ 1160.00
Product Code Wavelength Range 195 - 2100 nm Diameter 203 mm Dimensions Ø 203 mm (Specify Laser Cutting Rectangle) Thickness 1 mm Parallelism < 5'' Substrate UV Fused Silica Clear Aperture 191 mm Thickness Tolerance +0/-0.1 mm Weight 141.75 g Laser Cutting Rectangle Diameter Tolerance ±0.12 mm Shape Round (Specify Laser Cut Rectangle) Surface Quality 40-20 scratch-dig Surface Roughness < 2 - 180 μm (5 A, RMS) Laser Cut & Quality Levels As is. C of C only Laser Engraving None Bevels 0.5mm MAX @ 45° FW Edge Finish Fine ground Supplier Location New York, USA Selected Product Option Laser Cutting: Rectangle Laser Cut & Engraving: None Laser Cut & Quality Level: As is. C of C only See product details More from Sydor
Wafer	632.8 nm (Metrology, Center Wavelength)	Fused Silica	Ø 100 mm	In stock	$ 296.00
Product Code Manufacturer Corning Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 100 mm Dimensions Ø 100 mm Thickness 0.4 mm Parallelism < 5'' Substrate Fused Silica Clear Aperture 90 mm Thickness Tolerance ±0.05 mm Weight 141.75 g Laser Cutting Semi-Notch Diameter Tolerance ±0.2 mm Shape Round Surface Quality 40-20 scratch-dig Laser Cut & Quality Levels As is. C of C only Laser Engraving None Material Grade 0F Warp < 0.04 mm Bow < 0.04 mm Bevels Safety Break Edge Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Semi-Notch Laser Cut & Engraving: None Laser Cut & Quality Levels: As is. C of C only See product details More from Sydor