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Optics

Optics are used to alter the state of an incident beam of light. Optical components can transmit, reflect, focus, defocus, polarize or change the path of a beam.

Product	Wavelength Range	Substrate	Dimensions	Availability	Price (USD)
Wafer	-	Fused Silica Ultra Low Expansion Glass	36 x 60 mm	In stock	$ 2185.00
Product Code Manufacturer Corning Dimensions 36 x 60 mm Thickness 4 mm Parallelism < 30'' Substrate Fused Silica Ultra Low Expansion Glass Shape Rectangular Clear Aperture 34.2 x 57 mm Weight 340.19 g Thickness Tolerance ±0.2 mm Surface Quality 20-10 scratch-dig (S1) Laser Cutting None Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving None Surface Roughness < 440 pm (RMS) Reflected Wavefront Error < λ/40 (Surface 1) Length 60 mm Width Tolerance ±0.13 mm Width 36 mm Length Tolerance ±0.13 mm Bevels Break Edge Saftey Supplier Location New York, USA Selected Product Option Laser Cutting: None Laser Engraving: None Laser Cut & Quality Levels: Full inspection with interferograms See product details More from Sydor
Wafer	632.8 nm (Metrology, Center Wavelength)	Fused Silica	Ø 300 mm (Specify Laser Cutting Rectangle)	In stock	$ 1300.00
Product Code Manufacturer Corning Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 300 mm Dimensions Ø 300 mm (Specify Laser Cutting Rectangle) Thickness 2 mm Parallelism < 3'' Substrate Fused Silica Shape Round (Specify Laser Cut Rectangle) Clear Aperture 285 mm Weight 283.5 g Thickness Tolerance ±0.2 mm Surface Quality 60-40 scratch-dig Laser Cutting Rectangle Diameter Tolerance ±0.2 mm Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving Individual Optic Material Grade 0G Reflected Wavefront Error < λ/10 (1", 25.4 mm, 632.8 nm, RMS) Bevels 0.10mm - 0.40mm face width @ 45° Edge Finish Fine Edge Ground Supplier Location New York, USA Selected Product Option Laser Cutting: Rectangle Laser Cut & Engraving: Individual Optic Laser Cut & Quality Level: Full inspection with interferograms See product details More from Sydor
Wafer	632 nm (Metrology, Center Wavelength)	Fused Silica	Ø 150 mm	In stock	$ 501.00
Product Code Manufacturer Corning Wavelength Range 632 nm (Metrology, Center Wavelength) Center Wavelength 632 nm (Metrology) Diameter 150 mm Dimensions Ø 150 mm Thickness 1.025 mm Substrate Fused Silica Shape Round Clear Aperture 3 mm Weight 141.75 g Thickness Tolerance ±0.025 mm Surface Quality 20-10 scratch-dig Laser Cutting Standard Semi-Flat Diameter Tolerance ±0.2 mm Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving Individual Optic Surface Roughness < 1 nm (RMS) Material Grade 0A Bevels Polished c-bevel Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Standard Semi-Flat Laser Cut & Engraving: Individual Optic Laser Cut & Quality Levels: Full inspection with interferograms See product details More from Sydor
Wafer	632 nm (Metrology, Center Wavelength)	Fused Silica	Ø 200 mm	In stock	$ 445.00
Product Code Wavelength Range 632 nm (Metrology, Center Wavelength) Center Wavelength 632 nm (Metrology) Diameter 200 mm Dimensions Ø 200 mm Thickness 0.5 mm Substrate Fused Silica Shape Round Clear Aperture 170 mm Weight 141.75 g Thickness Tolerance ±0.1 mm Surface Quality 40-20 scratch-dig Laser Cutting Semi-Notch Diameter Tolerance ±0.1 mm Laser Cut & Quality Levels As is. C of C only Laser Engraving Individual Optic Surface Roughness < 1 nm Warp < 0.025 mm Bow < 0.025 mm Bevels Saftey Bevel Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Semi-Notch Laser Cut & Engraving: Individual Optic Laser Cut & Quality Level: As is. C of C only See product details More from Sydor
Wafer	632.8 nm (Metrology, Center Wavelength)	Fused Silica	Ø 250 mm	In stock	$ 3750.00
Product Code Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 250 mm Dimensions Ø 250 mm Thickness 6.35 mm (0.25") Substrate Fused Silica Shape Round Clear Aperture 216 mm Weight 453.59 g Thickness Tolerance ±0.1 mm Surface Quality 60-40 scratch-dig Laser Cutting Semi-Notch Diameter Tolerance +0/-0.1 mm Laser Cut & Quality Levels As is. C of C only Laser Engraving None Surface Roughness < 1 nm (RMS) Bevels 0.30mm to 1.00mm FW @ 45° Edge Finish Fine Edge Ground Supplier Location New York, USA Selected Product Option Laser Cutting: Semi-Notch Laser Cut & Engraving: None Laser Cut & Quality Levels: As is. C of C only See product details More from Sydor
Wafer	632.8 nm (Metrology, Center Wavelength)	Fused Silica	Ø 150 mm	In stock	$ 299.00
Product Code Manufacturer Corning Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 150 mm Dimensions Ø 150 mm Thickness 0.2 mm Substrate Fused Silica Shape Round Clear Aperture 140 mm, 139.27 mm Weight 198.45 g Thickness Tolerance ±0.05 mm Surface Quality 60-40 scratch-dig Laser Cutting Standard Semi-Flat Diameter Tolerance ±0.2 mm Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving None Material Grade 0G Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Standard Semi-Flat Laser Cut & Engraving: None Laser Cut & Quality Levels: Full inspection with interferograms See product details More from Sydor
Wafer	632.8 nm (Metrology, Center Wavelength)	Fused Silica	Ø 150 mm	In stock	$ 328.00
Product Code Manufacturer Corning Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 150 mm Dimensions Ø 150 mm Thickness 1.324 mm Parallelism < 10'' Substrate Fused Silica Shape Round Clear Aperture Ø 140 mm Weight 198.45 g Thickness Tolerance ±0.015 mm Surface Quality 60-40 scratch-dig Laser Cutting Semi-Notch Diameter Tolerance ±0.1 mm Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving None Surface Roughness < 700 pm (RMS) Material Grade 0F Transmitted Wavefront Error 2λ (per inch) Bevels Safety break edge Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Semi-Notch Laser Cut & Engraving: None Laser Cut & Quality Levels: Full inspection with interferograms See product details More from Sydor
Wafer	632.8 nm (Metrology, Center Wavelength)	Fused Silica	Ø 152.4 mm (Specify Laser Cutting Diameter)	In stock	$ 1522.00
Product Code Manufacturer Corning Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 152.4 mm Dimensions Ø 152.4 mm (Specify Laser Cutting Diameter) Thickness 25.4 mm (1") Parallelism < 3' Substrate Fused Silica Shape Round Clear Aperture 137.2 mm Weight 453.59 g Thickness Tolerance ±2 mm Surface Quality 60-40 scratch-dig (S1) 80-50 scratch-dig (S2) Laser Cutting Diameter Diameter Tolerance +0/-1 mm Laser Cut & Quality Levels As is. C of C only Laser Engraving Individual Optic Material Grade 0G Reflected Wavefront Error λ/10 Bevels 1.00mm Max FW @ 45° Edge Finish Fine Edge Ground Supplier Location New York, USA Selected Product Option Laser Cutting: Diameter Laser Cut & Engraving: Individual Optic Laser Cut & Quality Level: As is. C of C only See product details More from Sydor
Wafer	632 nm (Metrology, Center Wavelength)	Borofloat	Ø 200 mm (Specify Laser Cutting Rectangle)	In stock	$ 653.00
Product Code Wavelength Range 632 nm (Metrology, Center Wavelength) Center Wavelength 632 nm (Metrology) Diameter 200 mm Dimensions Ø 200 mm (Specify Laser Cutting Rectangle) Thickness 0.5 mm Substrate Borofloat Shape Round (Specify Laser Cut Rectangle) Clear Aperture 170 mm Weight 141.75 g Thickness Tolerance ±0.1 mm Surface Quality 40-20 scratch-dig Laser Cutting Rectangle Diameter Tolerance ±0.2 mm Laser Cut & Quality Levels As is. C of C only Laser Engraving Individual Optic Surface Roughness < 1 nm Warp 0.025 mm Bow 0.025 mm Bevels C-Bevel Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Rectangle Laser Cut & Engraving: Individual Optic Laser Cut & Quality Level: As is. C of C only See product details More from Sydor
Wafer	632.8 nm (Metrology, Center Wavelength)	Borofloat	Ø 200 mm	In stock	$ 280.00
Product Code Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 200 mm Dimensions Ø 200 mm Thickness 2.85 mm Substrate Borofloat Shape Round Clear Aperture 170 mm Weight 68.04 g Thickness Tolerance ±0.01 mm Surface Quality 60-40 scratch-dig Laser Cutting Semi-Notch Diameter Tolerance ±0.1 mm Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving Individual Optic Bevels C-Bevel Edge Finish Fine Ground Supplier Location New York, USA Selected Product Option Laser Cutting: Semi-Notch Laser Cut & Engraving: Individual Optic Laser Cut & Quality Level: Full inspection with interferograms See product details More from Sydor
Wafer	632.8 nm (Metrology, Center Wavelength)	Fused Silica	Ø 165 mm	In stock	$ 243.00
Product Code Manufacturer Corning Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 165 mm Dimensions Ø 165 mm Thickness 1.935 mm Substrate Fused Silica Shape Round Clear Aperture 156.75 mm Weight 68.04 g Thickness Tolerance ±0.025 mm Surface Quality 20-10 scratch-dig Laser Cutting Semi-Notch Laser Cut & Quality Levels As is. C of C only Laser Engraving Individual Optic Material Grade 0F Reflected Wavefront Error < 5λ (RMS) Bevels Break Edge Safety Edge Finish Fine Ground Supplier Location New York, USA Selected Product Option Laser Cutting: Semi-Notch Laser Cut & Engraving: Individual Optic Laser Cut & Quality Level: As is. C of C only See product details More from Sydor
Wafer	632.8 nm (Metrology, Center Wavelength)	Fused Silica	Ø 150 mm	In stock	$ 268.00
Product Code Manufacturer Corning Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 150 mm Dimensions Ø 150 mm Thickness 1.324 mm Parallelism < 10'' Substrate Fused Silica Shape Round Clear Aperture Ø 140 mm Weight 198.45 g Thickness Tolerance ±0.015 mm Surface Quality 60-40 scratch-dig Laser Cutting None Diameter Tolerance ±0.1 mm Laser Cut & Quality Levels As is. C of C only Laser Engraving None Surface Roughness < 700 pm (RMS) Material Grade 0F Transmitted Wavefront Error 2λ (per inch) Bevels Safety break edge Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: None Laser Engraving: None Laser Cut & Quality Levels: As is. C of C only See product details More from Sydor
Wafer	632 nm (Metrology, Center Wavelength)	Fused Silica	Ø 200 mm (Specify Laser Cutting Diameter)	In stock	$ 798.00
Product Code Wavelength Range 632 nm (Metrology, Center Wavelength) Center Wavelength 632 nm (Metrology) Diameter 200 mm Dimensions Ø 200 mm (Specify Laser Cutting Diameter) Thickness 3 mm Substrate Fused Silica Shape Round Clear Aperture 170 mm Weight 226.8 g Thickness Tolerance ±0.2 mm Surface Quality 40-20 scratch-dig Laser Cutting Diameter Diameter Tolerance ±0.2 mm Laser Cut & Quality Levels As is. C of C only Laser Engraving None Surface Roughness < 1 nm Transmitted Wavefront Error < λ/4 (per inch) Reflected Wavefront Error < λ Bevels Saftey Bevel Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Diameter Laser Cut & Engraving: None Laser Cut & Quality Level: As is. C of C only See product details More from Sydor
Wafer	633 nm (Metrology, Center Wavelength)	Fused Silica	Ø 200 mm	In stock	$ 422.00
Product Code Wavelength Range 633 nm (Metrology, Center Wavelength) Center Wavelength 633 nm (Metrology) Diameter 200 mm Dimensions Ø 200 mm Thickness 1 mm Substrate Fused Silica Shape Round Clear Aperture 5 mm Weight 14.17 g Thickness Tolerance ±0.025 mm Surface Quality 40-20 scratch-dig Laser Cutting Semi-Notch Diameter Tolerance ±0.2 mm Laser Cut & Quality Levels As is. C of C only Laser Engraving Individual Optic Bow < 0.03 mm Quality Full inspection with interferograms Bevels Break edges FW @ 45° Supplier Location New York, USA Selected Product Option Laser Cutting: Semi-Notch Laser Cut & Engraving: Individual Optic Laser Cut & Quality Level: As is. C of C only Quality Levels: Full inspection with interferograms See product details More from Sydor
Wafer	633 nm (Metrology, Center Wavelength)	Fused Silica	Ø 100 mm (Specify Laser Cutting Rectangle)	In stock	$ 488.00
Product Code Wavelength Range 633 nm (Metrology, Center Wavelength) Center Wavelength 633 nm (Metrology) Diameter 100 mm Dimensions Ø 100 mm (Specify Laser Cutting Rectangle) Thickness 1 mm Substrate Fused Silica Shape Round (Specify Laser Cut Rectangle) Clear Aperture 3 mm Weight 14.17 g Thickness Tolerance ±0.025 mm Surface Quality 40-20 scratch-dig Laser Cutting Rectangle Diameter Tolerance ±0.2 mm Laser Cut & Quality Levels As is. C of C only Laser Engraving Individual Optic Surface Roughness < 1 nm (RMS) Bow < 0.02 mm Quality Full inspection with interferograms Bevels Break edge FW @ 45 degrees Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Rectangle Laser Cut & Engraving: Individual Optic Laser Cut & Quality Levels: As is. C of C only Quality Levels: Full inspection with interferograms See product details More from Sydor
Wafer	632.8 nm (Metrology, Center Wavelength)	Fused Silica	Ø 200 mm (Specify Laser Cutting Rectangle)	In stock	$ 1270.00
Product Code Manufacturer Corning Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 200 mm Dimensions Ø 200 mm (Specify Laser Cutting Rectangle) Thickness 0.725 mm Parallelism < 5'' Substrate Fused Silica Shape Round (Specify Laser Cut Rectangle) Clear Aperture 5 mm Weight 283.5 g Thickness Tolerance ±0.05 mm Surface Quality 20-10 scratch-dig Laser Cutting Rectangle Diameter Tolerance ±0.1 mm Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving Individual Optic Surface Roughness < 100 μm - 1 mm (0.1 mm, 1.5 nm, 0.5 nm, RMS, RMS) Material Grade 0C Transmitted Wavefront Error < λ/4 (RMS) Bevels C-bevel Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Rectangle Laser Cut & Engraving: Individual Optic Laser Cut & Quality Level: Full inspection with interferograms See product details More from Sydor
Wafer	632 nm (Metrology, Center Wavelength)	Borofloat	Ø 200 mm	In stock	$ 267.00
Product Code Wavelength Range 632 nm (Metrology, Center Wavelength) Center Wavelength 632 nm (Metrology) Diameter 200 mm Dimensions Ø 200 mm Thickness 0.75 mm Substrate Borofloat Shape Round Clear Aperture 170 mm Weight 68.04 g Thickness Tolerance ±0.05 mm Surface Quality 20-10 scratch-dig Laser Cutting Semi-Notch Diameter Tolerance ±0.1 mm Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving Individual Optic Bevels Break Edge Safety Edge Finish Fine Ground Supplier Location New York, USA Selected Product Option Laser Cutting: Semi-Notch Laser Cut & Engraving: Individual Optic Laser Cut & Quality Level: Full inspection with interferograms See product details More from Sydor
Wafer	632.8 nm (Metrology, Center Wavelength)	Fused Silica	Ø 292 mm	In stock	$ 2298.00
Product Code Manufacturer Corning Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 292 mm Dimensions Ø 292 mm Thickness 5.3 mm Substrate Fused Silica Shape Round Clear Aperture 248.2 mm Weight 68.04 g Thickness Tolerance ±0.05 mm Surface Quality 60-40 scratch-dig Laser Cutting Semi-Notch Diameter Tolerance ±0.25 mm Laser Cut & Quality Levels As is. C of C only Laser Engraving Individual Optic Material Grade 0F Transmitted Wavefront Error λ/10 (RMS) Bevels Safety bevels & corner safety chamfers Edge Finish Fine Ground Supplier Location New York, USA Selected Product Option Laser Cutting: Semi-Notch Laser Cut & Engraving: Individual Optic Laser Cut & Quality Level: As is. C of C only See product details More from Sydor
Wafer	632 nm (Metrology, Center Wavelength)	Fused Silica	Ø 125 mm	In stock	$ 286.00
Product Code Manufacturer Corning Wavelength Range 632 nm (Metrology, Center Wavelength) Center Wavelength 632 nm (Metrology) Diameter 125 mm Dimensions Ø 125 mm Thickness 1 mm Parallelism < 10'' Substrate Fused Silica Shape Round Clear Aperture 106.25 mm Weight 198.45 g Thickness Tolerance ±0.01 mm Surface Quality 60-40 scratch-dig Laser Cutting Semi-Notch Diameter Tolerance ±0.1 mm Laser Cut & Quality Levels As is. C of C only Laser Engraving Individual Optic Surface Roughness < 700 pm (RMS) Transmitted Wavefront Error < 2λ (per inch) Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Semi-Notch Laser Cut & Engraving: Individual Optic Laser Cut & Quality Levels: As is. C of C only See product details More from Sydor
Wafer	633 nm (Metrology, Center Wavelength)	Fused Silica	Ø 100 mm (Specify Laser Cutting Diameter)	In stock	$ 505.00
Product Code Wavelength Range 633 nm (Metrology, Center Wavelength) Center Wavelength 633 nm (Metrology) Diameter 100 mm Dimensions Ø 100 mm (Specify Laser Cutting Diameter) Thickness 1.5 mm Parallelism < 10'' Substrate Fused Silica Shape Round Clear Aperture 90 mm Weight 85.05 g Thickness Tolerance ±0.05 mm Surface Quality 60-40 scratch-dig Laser Cutting Diameter Diameter Tolerance ±0.1 mm Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving Individual Optic Bevels C-bevel Edge Finish Fine ground Supplier Location New York, USA Selected Product Option Laser Cutting: Diameter Laser Cut & Engraving: Individual Optic Laser Cut & Quality Levels: Full inspection with interferograms See product details More from Sydor