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Optics

Optics are used to alter the state of an incident beam of light. Optical components can transmit, reflect, focus, defocus, polarize or change the path of a beam.

Product	Wavelength Range	Substrate	Dimensions	Availability	Price (USD)
Wafer	632 nm (Metrology, Center Wavelength)	Fused Silica	63.5 x 63.5 mm (2.5 x 2.5")	In stock	$ 186.00
Product Code Wavelength Range 632 nm (Metrology, Center Wavelength) Center Wavelength 632 nm (Metrology) Dimensions 63.5 x 63.5 mm (2.5 x 2.5") Thickness 1.96 mm Substrate Fused Silica Shape Square Clear Aperture 57.15 x 57.15 mm Weight 226.8 g Thickness Tolerance ±0.02 mm Laser Cutting Semi-Notch Surface Quality 40-20 scratch-dig Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving Individual Optic Surface Roughness < 1 nm (RMS) Material Grade 0A Reflected Wavefront Error λ/4 Length 63.5 mm (2.5") Width Tolerance +0/-0.25 mm Width 63.5 mm (2.5") Length Tolerance +0/-0.25 mm Edge Finish Fine Edge Ground Supplier Location New York, USA Selected Product Option Laser Cutting: Semi-Notch Laser Cut & Engraving: Individual Optic Laser Cut & Quality Levels: Full inspection with interferograms See product details More from Sydor
Wafer	632 nm (Metrology, Center Wavelength)	Fused Silica	Ø 200 mm (Specify Laser Cutting Rectangle)	In stock	$ 589.00
Product Code Wavelength Range 632 nm (Metrology, Center Wavelength) Center Wavelength 632 nm (Metrology) Diameter 200 mm Dimensions Ø 200 mm (Specify Laser Cutting Rectangle) Thickness 1 mm Substrate Fused Silica Shape Round (Specify Laser Cut Rectangle) Clear Aperture 170 mm Weight 170.1 g Thickness Tolerance ±0.1 mm Laser Cutting Rectangle Surface Quality 40-20 scratch-dig Laser Cut & Quality Levels As is. C of C only Laser Engraving None Diameter Tolerance ±0.2 mm Surface Roughness < 1 nm Transmitted Wavefront Error < λ/4 (per inch) Reflected Wavefront Error < λ Bevels Safety Bevel Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Rectangle Laser Cut & Engraving: None Laser Cut & Quality Level: As is. C of C only See product details More from Sydor
Wafer	632.8 nm (Metrology, Center Wavelength)	Fused Silica	Ø 200 mm (Specify Laser Cutting Diameter)	In stock	$ 652.00
Product Code Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 200 mm Dimensions Ø 200 mm (Specify Laser Cutting Diameter) Thickness 2 mm Parallelism < 5'' Substrate Fused Silica Shape Round Clear Aperture 170 mm Weight 283.5 g Thickness Tolerance ±0.1 mm Laser Cutting Diameter Surface Quality 60-40 scratch-dig Laser Cut & Quality Levels As is. C of C only Laser Engraving None Diameter Tolerance ±0.5 mm Material Grade 0F Transmitted Wavefront Error < λ Bevels C-bevel Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Diameter Laser Cut & Engraving: None Laser Cut & Quality Level: As is. C of C only See product details More from Sydor
Wafer	632.8 nm (Metrology, Center Wavelength)	Fused Silica	101 x 101 mm	In stock	$ 355.00
Product Code Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Dimensions 101 x 101 mm Thickness 1.1 mm Parallelism < 5'' Substrate Fused Silica Shape Square Clear Aperture 1 mm Weight 141.75 g Thickness Tolerance ±0.02 mm Laser Cutting None Surface Quality 20-10 scratch-dig Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving Individual Optic Surface Roughness < 1.5 nm (RMS) Transmitted Wavefront Error < λ/40 (RMS) Length 101 mm Width Tolerance ±0.1 mm Width 101 mm Length Tolerance ±0.1 mm Quality Full inspection with interferograms Bevels Break Edge, Safety Supplier Location New York, USA Selected Product Option Laser Cutting: None Laser Engraving: Individual Optic Laser Cut & Quality Levels: Full inspection with interferograms Quality Levels: Full inspection with interferograms See product details More from Sydor
Wafer	632 nm (Metrology, Center Wavelength)	Fused Silica	Ø 158 mm (Specify Laser Cutting Rectangle)	In stock	$ 513.00
Product Code Wavelength Range 632 nm (Metrology, Center Wavelength) Center Wavelength 632 nm (Metrology) Diameter 158 mm Dimensions Ø 158 mm (Specify Laser Cutting Rectangle) Thickness 2.325 mm Substrate Fused Silica Shape Round (Specify Laser Cut Rectangle) Clear Aperture 134.3 mm Weight 68.04 g Thickness Tolerance ±0.05 mm Laser Cutting Rectangle Surface Quality 20-10 scratch-dig Laser Cut & Quality Levels As is. C of C only Laser Engraving Individual Optic Diameter Tolerance ±0.2 mm Surface Roughness < 1 nm (RMS) Material Grade 0G Reflected Wavefront Error λ/2 (25 mm, 12 mm) Warp < 0.02 mm Bow < 0.015 mm Bevels Break Edge Safety Edge Finish Fine Ground Supplier Location New York, USA Selected Product Option Laser Cutting: Rectangle Laser Cut & Engraving: Individual Optic Laser Cut & Quality Level: As is. C of C only See product details More from Sydor
Wafer	632.8 nm (Metrology, Center Wavelength)	Fused Silica	Ø 100 mm (Specify Laser Cutting Rectangle)	In stock	$ 398.00
Product Code Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 100 mm Dimensions Ø 100 mm (Specify Laser Cutting Rectangle) Thickness 0.3 mm Substrate Fused Silica Shape Round (Specify Laser Cut Rectangle) Clear Aperture 85 mm Weight 68.04 g Thickness Tolerance ±0.025 mm Laser Cutting Rectangle Surface Quality 60-40 scratch-dig Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving None Diameter Tolerance ±0.2 mm Surface Roughness < 1.3 nm (RMS) Material Grade 0F Warp < 0.04 mm Bow < 0.035 mm Bevels C-bevel radius edges Edge Finish Fine Ground Supplier Location New York, USA Selected Product Option Laser Cutting: Rectangle Laser Cut & Engraving: None Laser Cut & Quality Levels: Full inspection with interferograms See product details More from Sydor
Wafer	632 nm (Metrology, Center Wavelength)	Fused Silica	Ø 100 mm (Specify Laser Cutting Diameter)	In stock	$ 398.00
Product Code Wavelength Range 632 nm (Metrology, Center Wavelength) Center Wavelength 632 nm (Metrology) Diameter 100 mm Dimensions Ø 100 mm (Specify Laser Cutting Diameter) Thickness 2 mm Substrate Fused Silica Shape Round Clear Aperture 85 mm Weight 141.75 g Thickness Tolerance ±0.1 mm Laser Cutting Diameter Surface Quality 40-20 scratch-dig Laser Cut & Quality Levels As is. C of C only Laser Engraving None Diameter Tolerance ±0.2 mm Surface Roughness < 1 nm Transmitted Wavefront Error < λ/4 (per inch) Reflected Wavefront Error < λ Bevels Saftey Bevel Supplier Location New York, USA Selected Product Option Laser Cutting: Diameter Laser Cut & Engraving: None Laser Cut & Quality Levels: As is. C of C only See product details More from Sydor
Wafer	632 nm (Metrology, Center Wavelength)	Borofloat	254 x 254 mm (10 x 10")	In stock	$ 341.00
Product Code Wavelength Range 632 nm (Metrology, Center Wavelength) Center Wavelength 632 nm (Metrology) Dimensions 254 x 254 mm (10 x 10") Thickness 4 mm Substrate Borofloat Shape Square Clear Aperture 10 mm Weight 68.04 g Thickness Tolerance ±0.1 mm Laser Cutting Standard Semi-Flat Surface Quality 60-40 scratch-dig Laser Cut & Quality Levels As is. C of C only Laser Engraving Individual Optic Length 254 mm (10") Width Tolerance ±0.127 mm Width 254 mm (10") Length Tolerance ±0.127 mm Warp < 0.015 mm Bevels Safety - all edges Edge Finish Fine Ground Supplier Location New York, USA Selected Product Option Laser Cutting: Standard Semi-Flat Laser Cut & Engraving: Individual Optic Laser Cut & Quality Level: As is. C of C only See product details More from Sydor
Wafer	632.8 nm (Metrology, Center Wavelength)	Fused Silica	Ø 165 mm (Specify Laser Cutting Diameter)	In stock	$ 543.00
Product Code Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 165 mm Dimensions Ø 165 mm (Specify Laser Cutting Diameter) Thickness 1.935 mm Substrate Fused Silica Shape Round Clear Aperture 156.75 mm Weight 68.04 g Thickness Tolerance ±0.025 mm Laser Cutting Diameter Surface Quality 20-10 scratch-dig Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving None Material Grade 0F Reflected Wavefront Error < 5λ (RMS) Bevels Break Edge Safety Edge Finish Fine Ground Supplier Location New York, USA Selected Product Option Laser Cutting: Diameter Laser Cut & Engraving: None Laser Cut & Quality Level: Full inspection with interferograms See product details More from Sydor
Wafer	633 nm (Metrology, Center Wavelength)	Fused Silica	Ø 100 mm (Specify Laser Cutting Diameter)	In stock	$ 398.00
Product Code Wavelength Range 633 nm (Metrology, Center Wavelength) Center Wavelength 633 nm (Metrology) Diameter 100 mm Dimensions Ø 100 mm (Specify Laser Cutting Diameter) Thickness 1 mm Substrate Fused Silica Shape Round Clear Aperture 3 mm Weight 14.17 g Thickness Tolerance ±0.025 mm Laser Cutting Diameter Surface Quality 40-20 scratch-dig Laser Cut & Quality Levels As is. C of C only Laser Engraving None Diameter Tolerance ±0.2 mm Surface Roughness < 1 nm (RMS) Bow < 0.02 mm Quality As is. C of C only Bevels Break edge FW @ 45 degrees Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Diameter Laser Cut & Engraving: None Laser Cut & Quality Levels: As is. C of C only Quality Levels: As is. C of C only See product details More from Sydor
Wafer	632.8 nm (Metrology, Center Wavelength)	D 263	Ø 200 mm	In stock	$ 377.00
Product Code Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 200 mm Dimensions Ø 200 mm Thickness 0.384 mm Parallelism < 3'' (1", 25.4 mm) Substrate D 263 Shape Round Clear Aperture 190 mm Weight 141.75 g Thickness Tolerance ±0.01 mm Surface Quality 40-20 scratch-dig Transmitted Wavefront Error < λ/10 (1", 25.4 mm, 632.8 nm, RMS) Quality Full inspection with interferograms Bevels Break Edge Edge Finish Fine Edge Ground Supplier Location New York, USA Selected Product Option Quality Levels: Full inspection with interferograms See product details More from Sydor
Wafer	632 nm (Metrology, Center Wavelength)	Borofloat	Ø 200 mm	In stock	$ 286.00
Product Code Wavelength Range 632 nm (Metrology, Center Wavelength) Center Wavelength 632 nm (Metrology) Diameter 200 mm Dimensions Ø 200 mm Thickness 1 mm Substrate Borofloat Shape Round Clear Aperture 170 mm Weight 141.75 g Thickness Tolerance ±0.1 mm Laser Cutting Standard Semi-Flat Surface Quality 40-20 scratch-dig Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving None Diameter Tolerance ±0.2 mm Surface Roughness < 1 nm Transmitted Wavefront Error < λ/4 (per inch) Reflected Wavefront Error < λ Bevels Saftey Bevel Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Standard Semi-Flat Laser Cut & Engraving: None Laser Cut & Quality Level: Full inspection with interferograms See product details More from Sydor
Wafer	632 nm (Metrology, Center Wavelength)	Fused Silica	Ø 200 mm	In stock	$ 349.00
Product Code Wavelength Range 632 nm (Metrology, Center Wavelength) Center Wavelength 632 nm (Metrology) Diameter 200 mm Dimensions Ø 200 mm Thickness 1 mm Substrate Fused Silica Shape Round Clear Aperture 170 mm Weight 170.1 g Thickness Tolerance ±0.1 mm Laser Cutting None Surface Quality 40-20 scratch-dig Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving Individual Optic Diameter Tolerance ±0.2 mm Surface Roughness < 1 nm Transmitted Wavefront Error < λ/4 (per inch) Reflected Wavefront Error < λ Bevels Safety Bevel Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: None Laser Engraving: Individual Optic Laser Cut & Quality Level: Full inspection with interferograms See product details More from Sydor
Wafer	632.8 nm (Metrology, Center Wavelength)	Fused Silica	101.6 x 101.6 mm	In stock	$ 293.00
Product Code Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Dimensions 101.6 x 101.6 mm Substrate Fused Silica Shape Square Clear Aperture 91.44 x 91.44 mm Weight 141.75 g Laser Cutting None Surface Quality 60-40 scratch-dig Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving Individual Optic Transmitted Wavefront Error < λ (per inch) Length 101.6 mm (4") Width Tolerance +0/-0.1 mm Width 101.6 mm (4") Length Tolerance +0/-0.1 mm Quality Full inspection with interferograms Bevels Break Edge, Safety Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: None Laser Engraving: Individual Optic Laser Cut & Quality Levels: Full inspection with interferograms Quality Levels: Full inspection with interferograms See product details More from Sydor
Wafer	632.8 nm (Metrology, Center Wavelength)	Fused Silica	Ø 165 mm	In stock	$ 253.00
Product Code Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 165 mm Dimensions Ø 165 mm Thickness 1.935 mm Substrate Fused Silica Shape Round Clear Aperture 156.75 mm Weight 68.04 g Thickness Tolerance ±0.025 mm Laser Cutting Semi-Notch Surface Quality 20-10 scratch-dig Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving None Material Grade 0F Reflected Wavefront Error < 5λ (RMS) Bevels Break Edge Safety Edge Finish Fine Ground Supplier Location New York, USA Selected Product Option Laser Cutting: Semi-Notch Laser Cut & Engraving: None Laser Cut & Quality Level: Full inspection with interferograms See product details More from Sydor
Wafer	632 nm (Metrology, Center Wavelength)	Borofloat	Ø 200 mm	In stock	$ 225.00
Product Code Wavelength Range 632 nm (Metrology, Center Wavelength) Center Wavelength 632 nm (Metrology) Diameter 200 mm Dimensions Ø 200 mm Thickness 1.5 mm Substrate Borofloat Shape Round Clear Aperture 170 mm Weight 170.1 g Thickness Tolerance ±0.1 mm Laser Cutting Semi-Notch Surface Quality 40-20 scratch-dig Laser Cut & Quality Levels As is. C of C only Laser Engraving None Diameter Tolerance ±0.2 mm Surface Roughness < 1 nm Transmitted Wavefront Error < λ/4 (per inch) Reflected Wavefront Error < λ Bevels Saftey Bevel Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Semi-Notch Laser Cut & Engraving: None Laser Cut & Quality Level: As is. C of C only See product details More from Sydor
Wafer	632 nm (Metrology, Center Wavelength)	Fused Silica	Ø 100 mm	In stock	$ 320.00
Product Code Wavelength Range 632 nm (Metrology, Center Wavelength) Center Wavelength 632 nm (Metrology) Diameter 100 mm Dimensions Ø 100 mm Thickness 3 mm Substrate Fused Silica Shape Round Clear Aperture 85 mm Weight 170.1 g Thickness Tolerance ±0.1 mm Laser Cutting Standard Semi-Flat Surface Quality 40-20 scratch-dig Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving Individual Optic Diameter Tolerance ±0.2 mm Surface Roughness < 1 nm Transmitted Wavefront Error < λ/4 (per inch) Reflected Wavefront Error < λ Bevels Saftey Bevel Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Standard Semi-Flat Laser Cut & Engraving: Individual Optic Laser Cut & Quality Levels: Full inspection with interferograms See product details More from Sydor
Wafer	-	Fused Quartz	Ø 300 mm	In stock	$ 2166.00
Product Code Diameter 300 mm Dimensions Ø 300 mm Thickness 3 mm Substrate Fused Quartz Shape Round Weight 453.59 g Thickness Tolerance ±0.25 mm Laser Cutting None Surface Quality 60-40 scratch-dig Laser Cut & Quality Levels As is. C of C only Laser Engraving Individual Optic Diameter Tolerance ±0.75 mm Surface Roughness < 1 nm (RMS) Bevels Laser Cut Blended Edges Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: None Laser Engraving: Individual Optic Laser Cut & Quality Level: As is. C of C only See product details More from Sydor
Wafer	632 nm (Metrology, Center Wavelength)	Fused Silica	Ø 300 mm (Specify Laser Cutting Diameter)	In stock	$ 1229.00
Product Code Wavelength Range 632 nm (Metrology, Center Wavelength) Center Wavelength 632 nm (Metrology) Diameter 300 mm Dimensions Ø 300 mm (Specify Laser Cutting Diameter) Thickness 1 mm Substrate Fused Silica Shape Round Clear Aperture 255 mm Weight 283.5 g Thickness Tolerance ±0.1 mm Laser Cutting Diameter Surface Quality 40-20 scratch-dig Laser Cut & Quality Levels As is. C of C only Laser Engraving Individual Optic Diameter Tolerance ±0.2 mm Surface Roughness < 1 nm Transmitted Wavefront Error < λ/4 (per inch) Reflected Wavefront Error < λ Bevels Saftey Bevel Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Diameter Laser Cut & Engraving: Individual Optic Laser Cut & Quality Level: As is. C of C only See product details More from Sydor
Wafer	632.8 nm (Metrology, Center Wavelength)	Fused Silica	101 x 101 mm (Specify Laser Cutting Rectangle)	In stock	$ 545.00
Product Code Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Dimensions 101 x 101 mm (Specify Laser Cutting Rectangle) Thickness 1.1 mm Parallelism < 5'' Substrate Fused Silica Shape Square Clear Aperture 1 mm Weight 141.75 g Thickness Tolerance ±0.02 mm Laser Cutting Rectangle Surface Quality 20-10 scratch-dig Laser Cut & Quality Levels As is. C of C only Laser Engraving None Surface Roughness < 1.5 nm (RMS) Transmitted Wavefront Error < λ/40 (RMS) Length 101 mm Width Tolerance ±0.1 mm Width 101 mm Length Tolerance ±0.1 mm Quality As is. C of C only Bevels Break Edge, Safety Supplier Location New York, USA Selected Product Option Laser Cutting: Rectangle Laser Cut & Engraving: None Laser Cut & Quality Levels: As is. C of C only Quality Levels: As is. C of C only See product details More from Sydor