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Optics

Optics are used to alter the state of an incident beam of light. Optical components can transmit, reflect, focus, defocus, polarize or change the path of a beam.

Product	Wavelength Range	Substrate	Dimensions	Availability	Price (USD)
Wafer	-	ArF, Fused Silica	Ø 125 mm (Specify Laser Cutting Rectangle)	In stock	$ 2510.00
Product Code Manufacturer Corning Diameter 125 mm Dimensions Ø 125 mm (Specify Laser Cutting Rectangle) Thickness 2.34 mm Parallelism < 10'' Substrate ArF, Fused Silica Shape Round (Specify Laser Cut Rectangle) Clear Aperture 106.25 mm Thickness Tolerance ±0.05 mm Weight 141.75 g Surface Quality 60-40 scratch-dig Diameter Tolerance ±0.1 mm Laser Cutting Rectangle Laser Cut & Quality Levels As is. C of C only Laser Engraving None Surface Roughness < 700 pm (RMS) Material Grade 1F Bevels >0.5mm, stoned to lessen fracture point Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Rectangle Laser Cut & Engraving: None Laser Cut & Quality Levels: As is. C of C only See product details More from Sydor
Wafer	310 - 2700 nm	N-BK7	Ø 200 mm	In stock	$ 515.00
Product Code Wavelength Range 310 - 2700 nm Diameter 200 mm Dimensions Ø 200 mm Thickness 3.9 mm Parallelism < 20'' Substrate N-BK7 Shape Round Clear Aperture 10.5 mm, 194 mm Thickness Tolerance +0/-0.1 mm Weight 283.5 g Surface Quality 40-20 scratch-dig Diameter Tolerance ±0.1 mm Quality Full inspection with interferograms Bevels Break Edge Edge Finish Fine Edge Ground Supplier Location New York, USA Selected Product Option Quality Levels: Full inspection with interferograms See product details More from Sydor
Wafer	1070 nm (Metrology, Center Wavelength)	Fused Silica	Ø 200 mm	In stock	$ 5119.00
Product Code Wavelength Range 1070 nm (Metrology, Center Wavelength) Center Wavelength 1070 nm (Metrology) Diameter 200 mm Dimensions Ø 200 mm Thickness 2 mm Parallelism < 5'' Substrate Fused Silica Shape Round Clear Aperture 180 mm Thickness Tolerance ±0.1 mm Weight 56.7 g Surface Quality 20-10 scratch-dig Diameter Tolerance ±0.2 mm Laser Cutting Semi-Notch Laser Cut & Quality Levels As is. C of C only Laser Engraving Individual Optic Reflected Wavefront Error < 8λ Bevels <0.5mm FW @ 45° Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Semi-Notch Laser Cut & Engraving: Individual Optic Laser Cut & Quality Level: As is. C of C only See product details More from Sydor
Wafer	632.8 nm (Metrology, Center Wavelength)	Fused Silica	Ø 200 mm (Specify Laser Cutting Rectangle)	In stock	$ 1070.00
Product Code Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 200 mm Dimensions Ø 200 mm (Specify Laser Cutting Rectangle) Thickness 3 mm Parallelism < 5'' Substrate Fused Silica Shape Round (Specify Laser Cut Rectangle) Clear Aperture 180 mm Thickness Tolerance +0/-0.1 mm Weight 283.5 g Surface Quality 60-40 scratch-dig Diameter Tolerance ±0.1 mm Laser Cutting Rectangle Laser Cut & Quality Levels As is. C of C only Laser Engraving None Transmitted Wavefront Error λ/20 (25 mm) Reflected Wavefront Error < λ/10 (25 mm, Surface 1) Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Rectangle Laser Cut & Engraving: None Laser Cut & Quality Level: As is. C of C only See product details More from Sydor
Wafer	632.8 nm (Metrology, Center Wavelength)	Fused Silica	Ø 150 mm (Specify Laser Cutting Diameter)	In stock	$ 1042.00
Product Code Manufacturer Corning Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 150 mm Dimensions Ø 150 mm (Specify Laser Cutting Diameter) Thickness 2.648 mm Parallelism 10'' Substrate Fused Silica Shape Round Clear Aperture Ø 140 mm Thickness Tolerance ±0.015 mm Weight 226.8 g Surface Quality 60-40 scratch-dig Diameter Tolerance ±0.1 mm Laser Cutting Diameter Laser Cut & Quality Levels As is. C of C only Laser Engraving Individual Optic Surface Roughness < 700 pm (RMS) Material Grade 0F Transmitted Wavefront Error < 2λ (per inch) Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Diameter Laser Cut & Engraving: Individual Optic Laser Cut & Quality Levels: As is. C of C only See product details More from Sydor
Wafer	632 nm (Metrology, Center Wavelength)	Fused Silica	Ø 125 mm	In stock	$ 312.00
Product Code Manufacturer Corning Wavelength Range 632 nm (Metrology, Center Wavelength) Center Wavelength 632 nm (Metrology) Diameter 125 mm Dimensions Ø 125 mm Thickness 0.5 mm Parallelism < 10'' Substrate Fused Silica Shape Round Clear Aperture 106.25 mm Thickness Tolerance ±0.025 mm Weight 68.04 g Surface Quality 60-40 scratch-dig Diameter Tolerance ±0.1 mm Laser Cutting None Laser Cut & Quality Levels As is. C of C only Laser Engraving Individual Optic Surface Roughness < 700 pm (RMS) Bevels Break Edge Safety Edge Finish Fine Ground Supplier Location New York, USA Selected Product Option Laser Cutting: None Laser Engraving: Individual Optic Laser Cut & Quality Levels: As is. C of C only See product details More from Sydor
Wafer	632.8 nm (Metrology, Center Wavelength)	ArF, Fused Silica	Ø 150 mm	In stock	$ 1077.00
Product Code Manufacturer Corning Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 150 mm Dimensions Ø 150 mm Thickness 1 mm Parallelism < 10'' Substrate ArF, Fused Silica Shape Round Clear Aperture 127.5 mm Thickness Tolerance ±0.1 mm Weight 226.8 g Surface Quality 20-10 scratch-dig Diameter Tolerance ±0.2 mm Laser Cutting None Laser Cut & Quality Levels As is. C of C only Laser Engraving Individual Optic Material Grade 0F Bevels 0.30mm MAX FW @ 45 degrees, all edges Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: None Laser Engraving: Individual Optic Laser Cut & Quality Levels: As is. C of C only See product details More from Sydor
Wafer	-	Fused Silica	Ø 110 mm	In stock	$ 2104.00
Product Code Manufacturer Corning Diameter 110 mm Dimensions Ø 110 mm Thickness 2 mm Substrate Fused Silica Shape Round Clear Aperture > 93.5 mm Thickness Tolerance ±0.1 mm Weight 141.75 g Surface Quality 20-10 scratch-dig Diameter Tolerance ±0.1 mm Laser Cutting Standard Semi-Flat Laser Cut & Quality Levels As is. C of C only Laser Engraving Individual Optic Material Grade 0A Transmitted Wavefront Error < λ/4 Reflected Wavefront Error < λ/4 Bevels Safety bevel Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Standard Semi-Flat Laser Cut & Engraving: Individual Optic Laser Cut & Quality Levels: As is. C of C only See product details More from Sydor
Wafer	632.8 nm (Metrology, Center Wavelength)	Fused Silica	Ø 292 mm (Specify Laser Cutting Diameter)	In stock	$ 2638.00
Product Code Manufacturer Corning Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 292 mm Dimensions Ø 292 mm (Specify Laser Cutting Diameter) Thickness 5.3 mm Substrate Fused Silica Shape Round Clear Aperture 248.2 mm Thickness Tolerance ±0.05 mm Weight 68.04 g Surface Quality 60-40 scratch-dig Diameter Tolerance ±0.25 mm Laser Cutting Diameter Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving Individual Optic Material Grade 0F Transmitted Wavefront Error λ/10 (RMS) Bevels Safety bevels & corner safety chamfers Edge Finish Fine Ground Supplier Location New York, USA Selected Product Option Laser Cutting: Diameter Laser Cut & Engraving: Individual Optic Laser Cut & Quality Level: Full inspection with interferograms See product details More from Sydor
Wafer	632.8 nm (Metrology, Center Wavelength)	Fused Silica	101 x 101 mm	In stock	$ 335.00
Product Code Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Dimensions 101 x 101 mm Thickness 1.1 mm Parallelism < 5'' Substrate Fused Silica Shape Square Clear Aperture 1 mm Thickness Tolerance ±0.02 mm Weight 141.75 g Surface Quality 20-10 scratch-dig Laser Cutting Standard Semi-Flat Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving None Surface Roughness < 1.5 nm (RMS) Transmitted Wavefront Error < λ/40 (RMS) Length 101 mm Width Tolerance ±0.1 mm Width 101 mm Length Tolerance ±0.1 mm Quality As is. C of C only Bevels Break Edge, Safety Supplier Location New York, USA Selected Product Option Laser Cutting: Standard Semi-Flat Laser Cut & Engraving: None Laser Cut & Quality Levels: Full inspection with interferograms Quality Levels: As is. C of C only See product details More from Sydor
Wafer	632 nm (Metrology, Center Wavelength)	Fused Silica	Ø 158 mm (Specify Laser Cutting Diameter)	In stock	$ 563.00
Product Code Manufacturer Corning Wavelength Range 632 nm (Metrology, Center Wavelength) Center Wavelength 632 nm (Metrology) Diameter 158 mm Dimensions Ø 158 mm (Specify Laser Cutting Diameter) Thickness 2.325 mm Substrate Fused Silica Shape Round Clear Aperture 134.3 mm Thickness Tolerance ±0.05 mm Weight 68.04 g Surface Quality 20-10 scratch-dig Diameter Tolerance ±0.2 mm Laser Cutting Diameter Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving Individual Optic Surface Roughness < 1 nm (RMS) Material Grade 0G Reflected Wavefront Error λ/2 (25 mm, 12 mm) Warp < 0.02 mm Bow < 0.015 mm Bevels Break Edge Safety Edge Finish Fine Ground Supplier Location New York, USA Selected Product Option Laser Cutting: Diameter Laser Cut & Engraving: Individual Optic Laser Cut & Quality Level: Full inspection with interferograms See product details More from Sydor
Wafer	632.8 nm (Metrology, Center Wavelength)	Fused Silica	Ø 150 mm	In stock	$ 802.00
Product Code Manufacturer Corning Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 150 mm Dimensions Ø 150 mm Thickness 2.648 mm Parallelism 10'' Substrate Fused Silica Shape Round Clear Aperture Ø 140 mm Thickness Tolerance ±0.015 mm Weight 226.8 g Surface Quality 60-40 scratch-dig Diameter Tolerance ±0.1 mm Laser Cutting Semi-Notch Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving Individual Optic Surface Roughness < 700 pm (RMS) Material Grade 0F Transmitted Wavefront Error < 2λ (per inch) Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Semi-Notch Laser Cut & Engraving: Individual Optic Laser Cut & Quality Levels: Full inspection with interferograms See product details More from Sydor
Wafer	632.8 nm (Metrology, Center Wavelength)	Fused Silica	Ø 300 mm (Specify Laser Cutting Diameter)	In stock	$ 1250.00
Product Code Manufacturer Corning Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 300 mm Dimensions Ø 300 mm (Specify Laser Cutting Diameter) Thickness 2 mm Parallelism < 3'' Substrate Fused Silica Shape Round Clear Aperture 285 mm Thickness Tolerance ±0.2 mm Weight 283.5 g Surface Quality 60-40 scratch-dig Diameter Tolerance ±0.2 mm Laser Cutting Diameter Laser Cut & Quality Levels As is. C of C only Laser Engraving Individual Optic Material Grade 0G Reflected Wavefront Error < λ/10 (1", 25.4 mm, 632.8 nm, RMS) Bevels 0.10mm - 0.40mm face width @ 45° Edge Finish Fine Edge Ground Supplier Location New York, USA Selected Product Option Laser Cutting: Diameter Laser Cut & Engraving: Individual Optic Laser Cut & Quality Level: As is. C of C only See product details More from Sydor
Wafer	632.8 nm (Metrology, Center Wavelength)	Fused Silica	101.6 x 101.6 mm (Specify Laser Cutting Diameter)	In stock	$ 483.00
Product Code Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Dimensions 101.6 x 101.6 mm (Specify Laser Cutting Diameter) Substrate Fused Silica Shape Square (Specify Laser Cut Circle Diameter) Clear Aperture 91.44 x 91.44 mm Weight 141.75 g Surface Quality 60-40 scratch-dig Laser Cutting Diameter Laser Cut & Quality Levels As is. C of C only Laser Engraving None Transmitted Wavefront Error < λ (per inch) Length 101.6 mm (4") Width Tolerance +0/-0.1 mm Width 101.6 mm (4") Length Tolerance +0/-0.1 mm Quality As is. C of C only Bevels Break Edge, Safety Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Diameter Laser Cut & Engraving: None Laser Cut & Quality Levels: As is. C of C only Quality Levels: As is. C of C only See product details More from Sydor
Wafer	632.8 nm (Metrology, Center Wavelength)	-	Ø 50.8 mm (2")	In stock	$ 264.00
Product Code Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 50.8 mm (2") Dimensions Ø 50.8 mm (2") Thickness 12.7 mm (0.5") Shape Round Clear Aperture > 40.64 mm Thickness Tolerance ±0.254 mm Weight 283.5 g Surface Quality 10-5 scratch-dig (S1, S2) Diameter Tolerance +0/-0.13 mm Reflected Wavefront Error λ/20 Quality As is. C of C only Bevels 0.015" - 0.045" FW @ 45° ± 15° Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Quality Levels: As is. C of C only See product details More from Sydor
Wafer	632.8 nm (Metrology, Center Wavelength)	Fused Silica	Ø 200 mm (Specify Laser Cutting Diameter)	In stock	$ 1645.00
Product Code Manufacturer Corning Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 200 mm Dimensions Ø 200 mm (Specify Laser Cutting Diameter) Thickness 5.25 mm Substrate Fused Silica Shape Round Clear Aperture 185 mm Thickness Tolerance ±0.05 mm Weight 283.5 g Surface Quality 20-10 scratch-dig Diameter Tolerance ±0.1 mm Laser Cutting Diameter Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving Individual Optic Reflected Wavefront Error < 20λ Bevels 0.50mm MAX FW @ 45° Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Diameter Laser Cut & Engraving: Individual Optic Laser Cut & Quality Level: Full inspection with interferograms See product details More from Sydor
Wafer	632.8 nm (Metrology, Center Wavelength)	Fused Silica	Ø 101.6 mm (4")	In stock	$ 467.00
Product Code Manufacturer Corning Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 101.6 mm (4") Dimensions Ø 101.6 mm (4") Thickness 19.1 mm Parallelism < 3' Substrate Fused Silica Shape Round Clear Aperture 91.44 mm Thickness Tolerance ±1.5 mm Weight 566.99 g Surface Quality 40-40 scratch-dig (S1) Diameter Tolerance +0/-1 mm Material Grade 0G Reflected Wavefront Error λ/20 (Surface 1) Quality As is. C of C only Bevels 1.00mm max FW @ 45° Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Quality Levels: As is. C of C only See product details More from Sydor
Wafer	632.8 nm (Metrology, Center Wavelength)	Fused Silica	Ø 100 mm	In stock	$ 336.00
Product Code Manufacturer Corning Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 100 mm Dimensions Ø 100 mm Thickness 0.4 mm Parallelism < 5'' Substrate Fused Silica Shape Round Clear Aperture 90 mm Thickness Tolerance ±0.05 mm Weight 141.75 g Surface Quality 40-20 scratch-dig Diameter Tolerance ±0.2 mm Laser Cutting Semi-Notch Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving None Material Grade 0F Warp < 0.04 mm Bow < 0.04 mm Bevels Safety Break Edge Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Semi-Notch Laser Cut & Engraving: None Laser Cut & Quality Levels: Full inspection with interferograms See product details More from Sydor
Wafer	632.8 nm (Metrology, Center Wavelength)	Fused Silica	Ø 150 mm	In stock	$ 762.00
Product Code Manufacturer Corning Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 150 mm Dimensions Ø 150 mm Thickness 2.648 mm Parallelism 10'' Substrate Fused Silica Shape Round Clear Aperture Ø 140 mm Thickness Tolerance ±0.015 mm Weight 226.8 g Surface Quality 60-40 scratch-dig Diameter Tolerance ±0.1 mm Laser Cutting Semi-Notch Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving None Surface Roughness < 700 pm (RMS) Material Grade 0F Transmitted Wavefront Error < 2λ (per inch) Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Semi-Notch Laser Cut & Engraving: None Laser Cut & Quality Levels: Full inspection with interferograms See product details More from Sydor
Wafer	-	Fused Silica	Ø 110 mm	In stock	$ 2074.00
Product Code Manufacturer Corning Diameter 110 mm Dimensions Ø 110 mm Thickness 2 mm Substrate Fused Silica Shape Round Clear Aperture > 93.5 mm Thickness Tolerance ±0.1 mm Weight 141.75 g Surface Quality 20-10 scratch-dig Diameter Tolerance ±0.1 mm Laser Cutting Semi-Notch Laser Cut & Quality Levels As is. C of C only Laser Engraving Individual Optic Material Grade 0A Transmitted Wavefront Error < λ/4 Reflected Wavefront Error < λ/4 Bevels Safety bevel Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Semi-Notch Laser Cut & Engraving: Individual Optic Laser Cut & Quality Levels: As is. C of C only See product details More from Sydor