Mirror Blanks

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Also known as flats, blanks are optical components made of bare substrates which will be coated with reflective coatings to create front-surface flat mirrors. Learn More

Product	Dimensions	Shape	Substrate	Availability	Price (USD)
Wafer	Ø 130 mm (Specify Laser Cutting Rectangle)	Round (Specify Laser Cut Rectangle)	Fused Silica	In stock	$ 505.00
Product Code Manufacturer Corning Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 130 mm Dimensions Ø 130 mm (Specify Laser Cutting Rectangle) Thickness 0.5 mm Shape Round (Specify Laser Cut Rectangle) Substrate Fused Silica Thickness Tolerance ±0.1 mm Weight 68.04 g Laser Cutting Rectangle Diameter Tolerance +0/-0.25 mm Surface Quality 60-40 scratch-dig Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving Individual Optic Material Grade 0F Bevels Break Edge Safety Edge Finish Fine Ground Supplier Location New York, USA Selected Product Option Laser Cutting: Rectangle Laser Cut & Engraving: Individual Optic Laser Cut & Quality Levels: Full inspection with interferograms See product details More from Sydor
Wafer	Ø 200 mm	Round	Borofloat	In stock	$ 305.00
Product Code Wavelength Range 632 nm (Metrology, Center Wavelength) Center Wavelength 632 nm (Metrology) Diameter 200 mm Dimensions Ø 200 mm Thickness 1.5 mm Shape Round Substrate Borofloat Thickness Tolerance ±0.1 mm Clear Aperture 170 mm Weight 170.1 g Laser Cutting Standard Semi-Flat Diameter Tolerance ±0.2 mm Surface Quality 40-20 scratch-dig Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving None Surface Roughness < 1 nm Transmitted Wavefront Error < λ/4 (per inch) Reflected Wavefront Error < λ Bevels Saftey Bevel Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Standard Semi-Flat Laser Cut & Engraving: None Laser Cut & Quality Level: Full inspection with interferograms See product details More from Sydor
Wafer	Ø 300 mm	Round	Fused Quartz	In stock	$ 2236.00
Product Code Diameter 300 mm Dimensions Ø 300 mm Thickness 3 mm Shape Round Substrate Fused Quartz Thickness Tolerance ±0.25 mm Weight 453.59 g Laser Cutting Standard Semi-Flat Diameter Tolerance ±0.75 mm Surface Quality 60-40 scratch-dig Laser Cut & Quality Levels As is. C of C only Laser Engraving Individual Optic Surface Roughness < 1 nm (RMS) Bevels Laser Cut Blended Edges Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Standard Semi-Flat Laser Cut & Engraving: Individual Optic Laser Cut & Quality Level: As is. C of C only See product details More from Sydor
Wafer	Ø 130 mm (Specify Laser Cutting Diameter)	Round	Fused Silica	In stock	$ 505.00
Product Code Manufacturer Corning Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 130 mm Dimensions Ø 130 mm (Specify Laser Cutting Diameter) Thickness 0.5 mm Shape Round Substrate Fused Silica Thickness Tolerance ±0.1 mm Weight 68.04 g Laser Cutting Diameter Diameter Tolerance +0/-0.25 mm Surface Quality 60-40 scratch-dig Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving Individual Optic Material Grade 0F Bevels Break Edge Safety Edge Finish Fine Ground Supplier Location New York, USA Selected Product Option Laser Cutting: Diameter Laser Cut & Engraving: Individual Optic Laser Cut & Quality Levels: Full inspection with interferograms See product details More from Sydor
Wafer	Ø 203 mm	Round	UV Fused Silica	In stock	$ 870.00
Product Code Wavelength Range 195 - 2100 nm Diameter 203 mm Dimensions Ø 203 mm Thickness 1 mm Parallelism < 5'' Shape Round Substrate UV Fused Silica Thickness Tolerance +0/-0.1 mm Clear Aperture 191 mm Weight 141.75 g Laser Cutting Semi-Notch Diameter Tolerance ±0.12 mm Surface Quality 40-20 scratch-dig Laser Cut & Quality Levels As is. C of C only Laser Engraving None Surface Roughness < 2 - 180 μm (5 A, RMS) Bevels 0.5mm MAX @ 45° FW Edge Finish Fine ground Supplier Location New York, USA Selected Product Option Laser Cutting: Semi-Notch Laser Cut & Engraving: None Laser Cut & Quality Level: As is. C of C only See product details More from Sydor
Wafer	Ø 158 mm	Round	Fused Silica	In stock	$ 253.00
Product Code Manufacturer Corning Wavelength Range 632 nm (Metrology, Center Wavelength) Center Wavelength 632 nm (Metrology) Diameter 158 mm Dimensions Ø 158 mm Thickness 2.325 mm Shape Round Substrate Fused Silica Thickness Tolerance ±0.05 mm Clear Aperture 134.3 mm Weight 68.04 g Laser Cutting Standard Semi-Flat Diameter Tolerance ±0.2 mm Surface Quality 20-10 scratch-dig Laser Cut & Quality Levels As is. C of C only Laser Engraving Individual Optic Surface Roughness < 1 nm (RMS) Material Grade 0G Reflected Wavefront Error λ/2 (25 mm, 12 mm) Warp < 0.02 mm Bow < 0.015 mm Bevels Break Edge Safety Edge Finish Fine Ground Supplier Location New York, USA Selected Product Option Laser Cutting: Standard Semi-Flat Laser Cut & Engraving: Individual Optic Laser Cut & Quality Level: As is. C of C only See product details More from Sydor
Wafer	101 x 101 mm	Square	Fused Silica	In stock	$ 375.00
Product Code Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Dimensions 101 x 101 mm Thickness 1.1 mm Parallelism < 5'' Shape Square Substrate Fused Silica Thickness Tolerance ±0.02 mm Clear Aperture 1 mm Weight 141.75 g Laser Cutting Standard Semi-Flat Surface Quality 20-10 scratch-dig Laser Cut & Quality Levels As is. C of C only Laser Engraving Individual Optic Surface Roughness < 1.5 nm (RMS) Transmitted Wavefront Error < λ/40 (RMS) Length 101 mm Width Tolerance ±0.1 mm Width 101 mm Length Tolerance ±0.1 mm Quality Full inspection with interferograms Bevels Break Edge, Safety Supplier Location New York, USA Selected Product Option Laser Cutting: Standard Semi-Flat Laser Cut & Engraving: Individual Optic Laser Cut & Quality Levels: As is. C of C only Quality Levels: Full inspection with interferograms See product details More from Sydor
Wafer	Ø 150 mm (Specify Laser Cutting Diameter)	Round	ArF, Fused Silica	In stock	$ 1417.00
Product Code Manufacturer Corning Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 150 mm Dimensions Ø 150 mm (Specify Laser Cutting Diameter) Thickness 1 mm Parallelism < 10'' Shape Round Substrate ArF, Fused Silica Thickness Tolerance ±0.1 mm Clear Aperture 127.5 mm Weight 226.8 g Laser Cutting Diameter Diameter Tolerance ±0.2 mm Surface Quality 20-10 scratch-dig Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving None Material Grade 0F Bevels 0.30mm MAX FW @ 45 degrees, all edges Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Diameter Laser Cut & Engraving: None Laser Cut & Quality Levels: Full inspection with interferograms See product details More from Sydor
Wafer	101 x 101 mm	Square	Fused Silica	In stock	$ 255.00
Product Code Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Dimensions 101 x 101 mm Thickness 1.1 mm Parallelism < 5'' Shape Square Substrate Fused Silica Thickness Tolerance ±0.02 mm Clear Aperture 1 mm Weight 141.75 g Laser Cutting None Surface Quality 20-10 scratch-dig Laser Cut & Quality Levels As is. C of C only Laser Engraving Individual Optic Surface Roughness < 1.5 nm (RMS) Transmitted Wavefront Error < λ/40 (RMS) Length 101 mm Width Tolerance ±0.1 mm Width 101 mm Length Tolerance ±0.1 mm Quality As is. C of C only Bevels Break Edge, Safety Supplier Location New York, USA Selected Product Option Laser Cutting: None Laser Engraving: Individual Optic Laser Cut & Quality Levels: As is. C of C only Quality Levels: As is. C of C only See product details More from Sydor
Wafer	Ø 300 mm (Specify Laser Cutting Rectangle)	Round (Specify Laser Cut Rectangle)	Fused Quartz	In stock	$ 2506.00
Product Code Diameter 300 mm Dimensions Ø 300 mm (Specify Laser Cutting Rectangle) Thickness 3 mm Shape Round (Specify Laser Cut Rectangle) Substrate Fused Quartz Thickness Tolerance ±0.25 mm Weight 453.59 g Laser Cutting Rectangle Diameter Tolerance ±0.75 mm Surface Quality 60-40 scratch-dig Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving None Surface Roughness < 1 nm (RMS) Bevels Laser Cut Blended Edges Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Rectangle Laser Cut & Engraving: None Laser Cut & Quality Level: Full inspection with interferograms See product details More from Sydor
Wafer	63.5 x 63.5 mm (2.5 x 2.5")	Square	N-BK7	In stock	$ 44.00
Product Code Manufacturer SCHOTT Wavelength Range 632 nm (Metrology, Center Wavelength) Center Wavelength 632 nm (Metrology) Dimensions 63.5 x 63.5 mm (2.5 x 2.5") Thickness 3 mm Parallelism < 30'' Shape Square Substrate N-BK7 Thickness Tolerance ±0.1 mm Clear Aperture 57.15 x 57.15 mm Weight 226.8 g Surface Quality 40-20 scratch-dig Surface Roughness < 1 nm Reflected Wavefront Error λ/4 Length 63.5 mm (2.5") Width Tolerance +0/-0.25 mm Width 63.5 mm (2.5") Length Tolerance +0/-0.25 mm Quality As is. C of C only Bevels 0.5mm (0.020")max FW X 45 ° Edge Finish Fine Edge Ground Supplier Location New York, USA Selected Product Option Quality Levels: As is. C of C only See product details More from Sydor
Wafer	Ø 215.138 mm	Round	Fused Quartz	In stock	$ 510.00
Product Code Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 215.138 mm Dimensions Ø 215.138 mm Thickness 1.956 mm Parallelism < 20'' Shape Round Substrate Fused Quartz Thickness Tolerance ±0.051 mm Clear Aperture 171.958 mm (Minimum) Weight 340.19 g Laser Cutting Semi-Notch Diameter Tolerance ±0.076 mm Surface Quality 40-20 scratch-dig Laser Cut & Quality Levels As is. C of C only Laser Engraving None Bevels Break edge Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Semi-Notch Laser Cut & Engraving: None Laser Cut & Quality Level: As is. C of C only See product details More from Sydor
Wafer	Ø 110 mm	Round	Fused Silica	In stock	$ 2034.00
Product Code Manufacturer Corning Diameter 110 mm Dimensions Ø 110 mm Thickness 2 mm Shape Round Substrate Fused Silica Thickness Tolerance ±0.1 mm Clear Aperture > 93.5 mm Weight 141.75 g Laser Cutting Semi-Notch Diameter Tolerance ±0.1 mm Surface Quality 20-10 scratch-dig Laser Cut & Quality Levels As is. C of C only Laser Engraving None Material Grade 0A Transmitted Wavefront Error < λ/4 Reflected Wavefront Error < λ/4 Bevels Safety bevel Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Semi-Notch Laser Cut & Engraving: None Laser Cut & Quality Levels: As is. C of C only See product details More from Sydor
Wafer	Ø 200 mm	Round	Fused Silica	In stock	$ 445.00
Product Code Wavelength Range 632 nm (Metrology, Center Wavelength) Center Wavelength 632 nm (Metrology) Diameter 200 mm Dimensions Ø 200 mm Thickness 0.5 mm Shape Round Substrate Fused Silica Thickness Tolerance ±0.1 mm Clear Aperture 170 mm Weight 141.75 g Laser Cutting None Diameter Tolerance ±0.1 mm Surface Quality 40-20 scratch-dig Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving None Surface Roughness < 1 nm Warp < 0.025 mm Bow < 0.025 mm Bevels Saftey Bevel Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: None Laser Engraving: None Laser Cut & Quality Level: Full inspection with interferograms See product details More from Sydor
Wafer	Ø 125 mm	Round	Fused Silica	In stock	$ 286.00
Product Code Manufacturer Corning Wavelength Range 632 nm (Metrology, Center Wavelength) Center Wavelength 632 nm (Metrology) Diameter 125 mm Dimensions Ø 125 mm Thickness 1 mm Parallelism < 10'' Shape Round Substrate Fused Silica Thickness Tolerance ±0.01 mm Clear Aperture 106.25 mm Weight 198.45 g Laser Cutting None Diameter Tolerance ±0.1 mm Surface Quality 60-40 scratch-dig Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving None Surface Roughness < 700 pm (RMS) Transmitted Wavefront Error < 2λ (per inch) Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: None Laser Engraving: None Laser Cut & Quality Levels: Full inspection with interferograms See product details More from Sydor
Wafer	Ø 200 mm (Specify Laser Cutting Rectangle)	Round (Specify Laser Cut Rectangle)	Borofloat	In stock	$ 670.00
Product Code Wavelength Range 632 nm (Metrology, Center Wavelength) Center Wavelength 632 nm (Metrology) Diameter 200 mm Dimensions Ø 200 mm (Specify Laser Cutting Rectangle) Thickness 0.7 mm Shape Round (Specify Laser Cut Rectangle) Substrate Borofloat Thickness Tolerance ±0.1 mm Clear Aperture 170 mm Weight 141.75 g Laser Cutting Rectangle Diameter Tolerance ±0.2 mm Surface Quality 40-20 scratch-dig Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving Individual Optic Surface Roughness < 1 nm Transmitted Wavefront Error < λ/4 (per inch) Reflected Wavefront Error < λ Bevels C-Bevel Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Rectangle Laser Cut & Engraving: Individual Optic Laser Cut & Quality Level: Full inspection with interferograms See product details More from Sydor
Wafer	Ø 200 mm (Specify Laser Cutting Rectangle)	Round (Specify Laser Cut Rectangle)	Fused Silica	In stock	$ 775.00
Product Code Manufacturer Corning Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 200 mm Dimensions Ø 200 mm (Specify Laser Cutting Rectangle) Thickness 1.25 mm Shape Round (Specify Laser Cut Rectangle) Substrate Fused Silica Thickness Tolerance +0.05/-0 mm Clear Aperture 195 mm Weight 68.04 g Laser Cutting Rectangle Diameter Tolerance ±0.1 mm Surface Quality 20-10 scratch-dig Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving None Bevels 0.20mm - 0.40mm Edge Finish Fine Ground Supplier Location New York, USA Selected Product Option Laser Cutting: Rectangle Laser Cut & Engraving: None Laser Cut & Quality Level: Full inspection with interferograms See product details More from Sydor
Wafer	Ø 250 mm	Round	-	In stock	$ 3558.00
Product Code Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 250 mm Dimensions Ø 250 mm Thickness 3 mm Shape Round Thickness Tolerance ±0.1 mm Clear Aperture 216 mm Weight 141.75 g Laser Cutting None Diameter Tolerance +0/-0.1 mm Surface Quality 60-40 scratch-dig Laser Cut & Quality Levels As is. C of C only Laser Engraving Individual Optic Surface Roughness < 1 nm (RMS) Quality Full inspection with interferograms Bevels 0.30mm to 1.00mm FW @ 45° Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: None Laser Engraving: Individual Optic Laser Cut & Quality Level: As is. C of C only Quality Levels: Full inspection with interferograms See product details More from Sydor
Wafer	Ø 150 mm (Specify Laser Cutting Rectangle)	Round (Specify Laser Cut Rectangle)	Fused Silica	In stock	$ 599.00
Product Code Manufacturer Corning Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 150 mm Dimensions Ø 150 mm (Specify Laser Cutting Rectangle) Thickness 0.2 mm Shape Round (Specify Laser Cut Rectangle) Substrate Fused Silica Thickness Tolerance ±0.05 mm Clear Aperture 140 mm, 139.27 mm Weight 198.45 g Laser Cutting Rectangle Diameter Tolerance ±0.2 mm Surface Quality 60-40 scratch-dig Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving Individual Optic Material Grade 0G Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Rectangle Laser Cut & Engraving: Individual Optic Laser Cut & Quality Levels: Full inspection with interferograms See product details More from Sydor
Wafer	Ø 200 mm (Specify Laser Cutting Rectangle)	Round (Specify Laser Cut Rectangle)	Borofloat	In stock	$ 515.00
Product Code Wavelength Range 632 nm (Metrology, Center Wavelength) Center Wavelength 632 nm (Metrology) Diameter 200 mm Dimensions Ø 200 mm (Specify Laser Cutting Rectangle) Thickness 1.5 mm Shape Round (Specify Laser Cut Rectangle) Substrate Borofloat Thickness Tolerance ±0.1 mm Clear Aperture 170 mm Weight 170.1 g Laser Cutting Rectangle Diameter Tolerance ±0.2 mm Surface Quality 40-20 scratch-dig Laser Cut & Quality Levels As is. C of C only Laser Engraving None Surface Roughness < 1 nm Transmitted Wavefront Error < λ/4 (per inch) Reflected Wavefront Error < λ Bevels Saftey Bevel Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Rectangle Laser Cut & Engraving: None Laser Cut & Quality Level: As is. C of C only See product details More from Sydor