Mirror Blanks

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Also known as flats, blanks are optical components made of bare substrates which will be coated with reflective coatings to create front-surface flat mirrors. Learn More

Product	Dimensions	Shape	Substrate	Availability	Price (USD)
Wafer	Ø 300 mm	Round	Fused Silica	In stock	$ 1666.00
Product Code Manufacturer Corning Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 300 mm Dimensions Ø 300 mm Thickness 5.93 mm Parallelism < 3'' Shape Round Substrate Fused Silica Clear Aperture 285 mm Thickness Tolerance +0/-0.04 mm Weight 68.04 g Surface Quality 20-10 scratch-dig Laser Cutting Standard Semi-Flat Diameter Tolerance +0/-0.25 mm Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving None Surface Roughness < 1.5 nm (RMS) Material Grade 0G Transmitted Wavefront Error < λ/10, λ/4 Reflected Wavefront Error < 0.15λ (Surface 2) Bevels 0.50mm FW max @ 45° Edge Finish Fine Ground Supplier Location New York, USA Selected Product Option Laser Cutting: Standard Semi-Flat Laser Cut & Engraving: None Laser Cut & Quality Level: Full inspection with interferograms See product details More from Sydor
Wafer	330 x 330 mm	Square	Fused Silica	In stock	$ 2992.00
Product Code Manufacturer Corning Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Dimensions 330 x 330 mm Thickness 7.5 mm Shape Square Substrate Fused Silica Clear Aperture Ø 101.6 mm (4") Thickness Tolerance ±0.05 mm Weight 566.99 g Surface Quality 60-40 scratch-dig Material Grade 0G Transmitted Wavefront Error λ/10 (RMS) Length 330 mm Width Tolerance ±0.1 mm Width 330 mm Length Tolerance ±0.1 mm Quality As is. C of C only Bevels Minimum Safety Bevel Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Quality Levels: As is. C of C only See product details More from Sydor
Wafer	Ø 150 mm	Round	N-BK7	In stock	$ 325.00
Product Code Manufacturer SCHOTT Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 150 mm Dimensions Ø 150 mm Thickness 1.964 mm Parallelism < 30'' Shape Round Substrate N-BK7 Clear Aperture 135 mm Thickness Tolerance ±0.01 mm Weight 170.1 g Surface Quality 40-20 scratch-dig Diameter Tolerance +0/-0.1 mm Surface Roughness < 700 pm (RMS) Transmitted Wavefront Error λ/8 (26 mm) Reflected Wavefront Error < λ Quality As is. C of C only Bevels 0.50mm max FW @ 45°; all edges Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Quality Levels: As is. C of C only See product details More from Sydor
Wafer	Ø 25.4 mm (1", Specify Laser Cutting Rectangle)	Round (Specify Laser Cut Rectangle)	Fused Silica	In stock	$ 340.00
Product Code Wavelength Range 633 nm (Metrology, Center Wavelength) Center Wavelength 633 nm (Metrology) Diameter 25.4 mm (1") Dimensions Ø 25.4 mm (1", Specify Laser Cutting Rectangle) Thickness 3.048 mm Shape Round (Specify Laser Cut Rectangle) Substrate Fused Silica Clear Aperture 20.32 mm Thickness Tolerance ±0.127 mm Weight 14.17 g Surface Quality 60-40 scratch-dig Laser Cutting Rectangle Diameter Tolerance ±0.127 mm Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving None Quality Full inspection with interferograms Bevels Break Edge Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Rectangle Laser Cut & Engraving: None Laser Cut & Quality Levels: Full inspection with interferograms Quality Levels: Full inspection with interferograms See product details More from Sydor
Wafer	Ø 203 mm	Round	UV Fused Silica	In stock	$ 870.00
Product Code Wavelength Range 195 - 2100 nm Diameter 203 mm Dimensions Ø 203 mm Thickness 1 mm Parallelism < 5'' Shape Round Substrate UV Fused Silica Clear Aperture 191 mm Thickness Tolerance +0/-0.1 mm Weight 141.75 g Surface Quality 40-20 scratch-dig Laser Cutting None Diameter Tolerance ±0.12 mm Laser Cut & Quality Levels As is. C of C only Laser Engraving Individual Optic Surface Roughness < 2 - 180 μm (5 A, RMS) Bevels 0.5mm MAX @ 45° FW Edge Finish Fine ground Supplier Location New York, USA Selected Product Option Laser Cutting: None Laser Engraving: Individual Optic Laser Cut & Quality Level: As is. C of C only See product details More from Sydor
Wafer	160 x 160 mm	Square	Borofloat	In stock	$ 298.00
Product Code Manufacturer SCHOTT Wavelength Range 633 nm (Metrology, Center Wavelength) Center Wavelength 633 nm (Metrology) Dimensions 160 x 160 mm Thickness 2 mm Shape Square Substrate Borofloat Clear Aperture 156 mm Thickness Tolerance ±0.035 mm Weight 226.8 g Surface Quality 40-20 scratch-dig Laser Cutting Standard Semi-Flat Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving None Length 160 mm Width Tolerance ±1 mm Width 160 mm Length Tolerance ±1 mm Bevels 0.3mm ±0.2mm LW @ 45° ±5° Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Standard Semi-Flat Laser Cut & Engraving: None Laser Cut & Quality Level: Full inspection with interferograms See product details More from Sydor
Wafer	Ø 200 mm (Specify Laser Cutting Diameter)	Round	Fused Silica	In stock	$ 735.00
Product Code Wavelength Range 632 nm (Metrology, Center Wavelength) Center Wavelength 632 nm (Metrology) Diameter 200 mm Dimensions Ø 200 mm (Specify Laser Cutting Diameter) Thickness 0.5 mm Shape Round Substrate Fused Silica Clear Aperture 170 mm Thickness Tolerance ±0.1 mm Weight 141.75 g Surface Quality 40-20 scratch-dig Laser Cutting Diameter Diameter Tolerance ±0.1 mm Laser Cut & Quality Levels As is. C of C only Laser Engraving Individual Optic Surface Roughness < 1 nm Warp < 0.025 mm Bow < 0.025 mm Bevels Saftey Bevel Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Diameter Laser Cut & Engraving: Individual Optic Laser Cut & Quality Level: As is. C of C only See product details More from Sydor
Wafer	Ø 150 mm (Specify Laser Cutting Rectangle)	Round (Specify Laser Cut Rectangle)	Fused Silica	In stock	$ 687.00
Product Code Manufacturer Corning Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 150 mm Dimensions Ø 150 mm (Specify Laser Cutting Rectangle) Thickness 1 mm Shape Round (Specify Laser Cut Rectangle) Substrate Fused Silica Clear Aperture 140 mm Thickness Tolerance ±0.01 mm Weight 68.04 g Surface Quality 60-40 scratch-dig Laser Cutting Rectangle Diameter Tolerance ±0.1 mm Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving None Surface Roughness < 700 pm (RMS) Material Grade 0F Bevels Break edge safety Edge Finish Fine Ground Supplier Location New York, USA Selected Product Option Laser Cutting: Rectangle Laser Cut & Engraving: None Laser Cut & Quality Levels: Full inspection with interferograms See product details More from Sydor
Wafer	Ø 100 mm (Specify Laser Cutting Diameter)	Round	Fused Silica	In stock	$ 465.00
Product Code Wavelength Range 633 nm (Metrology, Center Wavelength) Center Wavelength 633 nm (Metrology) Diameter 100 mm Dimensions Ø 100 mm (Specify Laser Cutting Diameter) Thickness 1.5 mm Parallelism < 10'' Shape Round Substrate Fused Silica Clear Aperture 90 mm Thickness Tolerance ±0.05 mm Weight 85.05 g Surface Quality 60-40 scratch-dig Laser Cutting Diameter Diameter Tolerance ±0.1 mm Laser Cut & Quality Levels As is. C of C only Laser Engraving Individual Optic Bevels C-bevel Edge Finish Fine ground Supplier Location New York, USA Selected Product Option Laser Cutting: Diameter Laser Cut & Engraving: Individual Optic Laser Cut & Quality Levels: As is. C of C only See product details More from Sydor
Wafer	Ø 165 mm (Specify Laser Cutting Diameter)	Round	Fused Silica	In stock	$ 493.00
Product Code Manufacturer Corning Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 165 mm Dimensions Ø 165 mm (Specify Laser Cutting Diameter) Thickness 1.935 mm Shape Round Substrate Fused Silica Clear Aperture 156.75 mm Thickness Tolerance ±0.025 mm Weight 68.04 g Surface Quality 20-10 scratch-dig Laser Cutting Diameter Laser Cut & Quality Levels As is. C of C only Laser Engraving None Material Grade 0F Reflected Wavefront Error < 5λ (RMS) Bevels Break Edge Safety Edge Finish Fine Ground Supplier Location New York, USA Selected Product Option Laser Cutting: Diameter Laser Cut & Engraving: None Laser Cut & Quality Level: As is. C of C only See product details More from Sydor
Wafer	Ø 209.55 mm (Specify Laser Cutting Rectangle)	Round (Specify Laser Cut Rectangle)	Fused Silica	In stock	$ 2556.00
Product Code Manufacturer Corning Wavelength Range 632 nm (Metrology, Center Wavelength) Center Wavelength 632 nm (Metrology) Diameter 209.55 mm Dimensions Ø 209.55 mm (Specify Laser Cutting Rectangle) Thickness 5 mm Shape Round (Specify Laser Cut Rectangle) Substrate Fused Silica Thickness Tolerance ±0.25 mm Weight 907.18 g Surface Quality 60-40 scratch-dig Laser Cutting Rectangle Diameter Tolerance +0/-0.25 mm Laser Cut & Quality Levels As is. C of C only Laser Engraving Individual Optic Material Grade 0G Transmitted Wavefront Error < λ/4 -3 to 5λ/2 < λ/10 (RMS) Edge Finish Fine Edge Ground Supplier Location New York, USA Selected Product Option Laser Cutting: Rectangle Laser Cut & Engraving: Individual Optic Laser Cut & Quality Level: As is. C of C only See product details More from Sydor
Wafer	Ø 200 mm	Round	Fused Silica	In stock	$ 1315.00
Product Code Manufacturer Corning Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 200 mm Dimensions Ø 200 mm Thickness 5.25 mm Shape Round Substrate Fused Silica Clear Aperture 185 mm Thickness Tolerance ±0.05 mm Weight 283.5 g Surface Quality 20-10 scratch-dig Laser Cutting None Diameter Tolerance ±0.1 mm Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving Individual Optic Reflected Wavefront Error < 20λ Bevels 0.50mm MAX FW @ 45° Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: None Laser Engraving: Individual Optic Laser Cut & Quality Level: Full inspection with interferograms See product details More from Sydor
Wafer	Ø 172 mm (Specify Laser Cutting Diameter)	Round	Fused Silica	In stock	$ 1653.00
Product Code Manufacturer Corning Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 172 mm Dimensions Ø 172 mm (Specify Laser Cutting Diameter) Thickness 8 mm Parallelism < 15'' Shape Round Substrate Fused Silica Clear Aperture 100 mm Thickness Tolerance ±0.25 mm Weight 68.04 g Surface Quality 20-10 scratch-dig Laser Cutting Diameter Diameter Tolerance ±0.2 mm Laser Cut & Quality Levels As is. C of C only Laser Engraving None Surface Roughness < 2 nm (RMS) Material Grade 0F Bevels S1- 4mm ±0.25mm LW @ 45° Edge Finish Fine Ground Supplier Location New York, USA Selected Product Option Laser Cutting: Diameter Laser Cut & Engraving: None Laser Cut & Quality Level: As is. C of C only See product details More from Sydor
Wafer	Ø 100 mm	Round	Fused Silica	In stock	$ 313.00
Product Code Wavelength Range 633 nm (Metrology, Center Wavelength) Center Wavelength 633 nm (Metrology) Diameter 100 mm Dimensions Ø 100 mm Thickness 1 mm Shape Round Substrate Fused Silica Clear Aperture 3 mm Thickness Tolerance ±0.025 mm Weight 14.17 g Surface Quality 40-20 scratch-dig Laser Cutting Standard Semi-Flat Diameter Tolerance ±0.2 mm Laser Cut & Quality Levels As is. C of C only Laser Engraving Individual Optic Surface Roughness < 1 nm (RMS) Bow < 0.02 mm Quality Full inspection with interferograms Bevels Break edge FW @ 45 degrees Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Standard Semi-Flat Laser Cut & Engraving: Individual Optic Laser Cut & Quality Levels: As is. C of C only Quality Levels: Full inspection with interferograms See product details More from Sydor
Wafer	Ø 100 mm	Round	Fused Silica	In stock	$ 190.00
Product Code Manufacturer Corning Wavelength Range 632 nm (Metrology, Center Wavelength) Center Wavelength 632 nm (Metrology) Diameter 100 mm Dimensions Ø 100 mm Thickness 1 mm Parallelism 10'' Shape Round Substrate Fused Silica Clear Aperture 85 mm Thickness Tolerance ±0.05 mm Weight 68.04 g Surface Quality 40-20 scratch-dig Laser Cutting Semi-Notch Diameter Tolerance ±0.1 mm Laser Cut & Quality Levels As is. C of C only Laser Engraving None Surface Roughness < 1 nm (RMS) Material Grade 0G Reflected Wavefront Error 2λ Bevels C-Bevel Edge Finish Fine Ground Supplier Location New York, USA Selected Product Option Laser Cutting: Semi-Notch Laser Cut & Engraving: None Laser Cut & Quality Levels: As is. C of C only See product details More from Sydor
Wafer	Ø 150 mm (Specify Laser Cutting Rectangle)	Round (Specify Laser Cut Rectangle)	Fused Silica	In stock	$ 1052.00
Product Code Manufacturer Corning Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 150 mm Dimensions Ø 150 mm (Specify Laser Cutting Rectangle) Thickness 2.648 mm Parallelism 10'' Shape Round (Specify Laser Cut Rectangle) Substrate Fused Silica Clear Aperture Ø 140 mm Thickness Tolerance ±0.015 mm Weight 226.8 g Surface Quality 60-40 scratch-dig Laser Cutting Rectangle Diameter Tolerance ±0.1 mm Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving None Surface Roughness < 700 pm (RMS) Material Grade 0F Transmitted Wavefront Error < 2λ (per inch) Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Rectangle Laser Cut & Engraving: None Laser Cut & Quality Levels: Full inspection with interferograms See product details More from Sydor
Wafer	304.8 x 304.8 mm	Square	Fused Silica	In stock	$ 6300.00
Product Code Wavelength Range 632 nm (Metrology, Center Wavelength) Center Wavelength 632 nm (Metrology) Dimensions 304.8 x 304.8 mm Thickness 6.35 mm (0.25") Shape Square Substrate Fused Silica Clear Aperture 12.7 mm (0.5") Thickness Tolerance ±0.254 mm (0.01") Weight 907.18 g Surface Quality 60-40 scratch-dig Reflected Wavefront Error < 2λ Length 304.8 mm (12") Width Tolerance ±0.254 mm (0.01") Width 304.8 mm (12") Length Tolerance ±0.254 mm (0.01") Quality As is. C of C only Bevels 0.010"-0.020" FW @ 45° Edge Finish Fine Edge Ground Supplier Location New York, USA Selected Product Option Quality Levels: As is. C of C only See product details More from Sydor
Wafer	254 x 254 mm (10 x 10")	Square	Borofloat	In stock	$ 261.00
Product Code Wavelength Range 632 nm (Metrology, Center Wavelength) Center Wavelength 632 nm (Metrology) Dimensions 254 x 254 mm (10 x 10") Thickness 4 mm Shape Square Substrate Borofloat Clear Aperture 10 mm Thickness Tolerance ±0.1 mm Weight 68.04 g Surface Quality 60-40 scratch-dig Laser Cutting None Laser Cut & Quality Levels As is. C of C only Laser Engraving None Length 254 mm (10") Width Tolerance ±0.127 mm Width 254 mm (10") Length Tolerance ±0.127 mm Warp < 0.015 mm Bevels Safety - all edges Edge Finish Fine Ground Supplier Location New York, USA Selected Product Option Laser Cutting: None Laser Engraving: None Laser Cut & Quality Level: As is. C of C only See product details More from Sydor
Wafer	Ø 200 mm	Round	Fused Silica	In stock	$ 578.00
Product Code Wavelength Range 632 nm (Metrology, Center Wavelength) Center Wavelength 632 nm (Metrology) Diameter 200 mm Dimensions Ø 200 mm Thickness 3 mm Shape Round Substrate Fused Silica Clear Aperture 170 mm Thickness Tolerance ±0.2 mm Weight 226.8 g Surface Quality 40-20 scratch-dig Laser Cutting Standard Semi-Flat Diameter Tolerance ±0.2 mm Laser Cut & Quality Levels As is. C of C only Laser Engraving Individual Optic Surface Roughness < 1 nm Transmitted Wavefront Error < λ/4 (per inch) Reflected Wavefront Error < λ Bevels Saftey Bevel Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Standard Semi-Flat Laser Cut & Engraving: Individual Optic Laser Cut & Quality Level: As is. C of C only See product details More from Sydor
Wafer	Ø 150 mm	Round	N-BK7	In stock	$ 375.00
Product Code Manufacturer SCHOTT Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 150 mm Dimensions Ø 150 mm Thickness 1.964 mm Parallelism < 30'' Shape Round Substrate N-BK7 Clear Aperture 135 mm Thickness Tolerance ±0.01 mm Weight 170.1 g Surface Quality 40-20 scratch-dig Diameter Tolerance +0/-0.1 mm Surface Roughness < 700 pm (RMS) Transmitted Wavefront Error λ/8 (26 mm) Reflected Wavefront Error < λ Quality Full inspection with interferograms Bevels 0.50mm max FW @ 45°; all edges Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Quality Levels: Full inspection with interferograms See product details More from Sydor