Mirror Blanks

Menu
- Home
- Login
- Products
  Optics
  Lasers & Light Sources
  Optomechanics
  Fiber Optics
  Detection Devices
  Electro-Optics & Electronics
  Machines
  Imaging & Microscopy
  Design Software
  Raw materials
  Photonic Integrated Circuits
- Custom Suppliers
- Company
  List your products on MEETOPTICS
  About
  Contact
- Resources
  FAQ
  Academy
  Forum
Notifications
Mark all as read
Your cart is empty. Please add some items.

Also known as flats, blanks are optical components made of bare substrates which will be coated with reflective coatings to create front-surface flat mirrors. Learn More

Product	Dimensions	Shape	Substrate	Availability	Price (USD)
Wafer	Ø 100 mm (Specify Laser Cutting Diameter)	Round	Fused Silica	In stock	$ 448.00
Product Code Manufacturer Corning Wavelength Range 632 nm (Metrology, Center Wavelength) Center Wavelength 632 nm (Metrology) Diameter 100 mm Dimensions Ø 100 mm (Specify Laser Cutting Diameter) Thickness 0.5 mm Shape Round Substrate Fused Silica Clear Aperture 85 mm Thickness Tolerance ±0.01 mm Weight 28.35 g Laser Cutting Diameter Diameter Tolerance ±0.2 mm Surface Quality 20-10 scratch-dig Laser Cut & Quality Levels As is. C of C only Laser Engraving None Surface Roughness < 1.3 nm (RMS) Material Grade 0F Reflected Wavefront Error < 4λ Edge Finish Fine Edge Ground Supplier Location New York, USA Selected Product Option Laser Cutting: Diameter Laser Cut & Engraving: None Laser Cut & Quality Levels: As is. C of C only See product details More from Sydor
Wafer	Ø 100 mm	Round	Fused Silica	In stock	$ 183.00
Product Code Manufacturer Corning Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 100 mm Dimensions Ø 100 mm Thickness 0.3 mm Shape Round Substrate Fused Silica Clear Aperture 85 mm Thickness Tolerance ±0.025 mm Weight 68.04 g Laser Cutting Standard Semi-Flat Diameter Tolerance ±0.2 mm Surface Quality 60-40 scratch-dig Laser Cut & Quality Levels As is. C of C only Laser Engraving None Surface Roughness < 1.3 nm (RMS) Material Grade 0F Warp < 0.04 mm Bow < 0.035 mm Bevels C-bevel radius edges Edge Finish Fine Ground Supplier Location New York, USA Selected Product Option Laser Cutting: Standard Semi-Flat Laser Cut & Engraving: None Laser Cut & Quality Levels: As is. C of C only See product details More from Sydor
Wafer	Ø 150 mm (Specify Laser Cutting Rectangle)	Round (Specify Laser Cut Rectangle)	Fused Silica	In stock	$ 593.00
Product Code Manufacturer Corning Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 150 mm Dimensions Ø 150 mm (Specify Laser Cutting Rectangle) Thickness 1.015 mm Shape Round (Specify Laser Cut Rectangle) Substrate Fused Silica Clear Aperture Ø 127.5 mm Thickness Tolerance ±0.025 mm Weight 68.04 g Laser Cutting Rectangle Diameter Tolerance ±0.1 mm Surface Quality 20-10 scratch-dig Laser Cut & Quality Levels As is. C of C only Laser Engraving Individual Optic Material Grade 0F Bevels Break Edge Safety Edge Finish Fine Ground Supplier Location New York, USA Selected Product Option Laser Cutting: Rectangle Laser Cut & Engraving: Individual Optic Laser Cut & Quality Levels: As is. C of C only See product details More from Sydor
Wafer	Ø 200 mm	Round	Fused Silica	In stock	$ 920.00
Product Code Manufacturer Corning Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 200 mm Dimensions Ø 200 mm Thickness 0.725 mm Parallelism < 5'' Shape Round Substrate Fused Silica Clear Aperture 5 mm Thickness Tolerance ±0.05 mm Weight 283.5 g Laser Cutting Standard Semi-Flat Diameter Tolerance ±0.1 mm Surface Quality 20-10 scratch-dig Laser Cut & Quality Levels As is. C of C only Laser Engraving None Surface Roughness < 100 μm - 1 mm (0.1 mm, 1.5 nm, 0.5 nm, RMS, RMS) Material Grade 0C Transmitted Wavefront Error < λ/4 (RMS) Bevels C-bevel Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Standard Semi-Flat Laser Cut & Engraving: None Laser Cut & Quality Level: As is. C of C only See product details More from Sydor
Wafer	Ø 125 mm	Round	Fused Silica	In stock	$ 352.00
Product Code Manufacturer Corning Wavelength Range 632 nm (Metrology, Center Wavelength) Center Wavelength 632 nm (Metrology) Diameter 125 mm Dimensions Ø 125 mm Thickness 0.5 mm Parallelism < 10'' Shape Round Substrate Fused Silica Clear Aperture 106.25 mm Thickness Tolerance ±0.025 mm Weight 68.04 g Laser Cutting None Diameter Tolerance ±0.1 mm Surface Quality 60-40 scratch-dig Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving None Surface Roughness < 700 pm (RMS) Bevels Break Edge Safety Edge Finish Fine Ground Supplier Location New York, USA Selected Product Option Laser Cutting: None Laser Engraving: None Laser Cut & Quality Levels: Full inspection with interferograms See product details More from Sydor
Wafer	Ø 165 mm (Specify Laser Cutting Rectangle)	Round (Specify Laser Cut Rectangle)	Fused Silica	In stock	$ 543.00
Product Code Manufacturer Corning Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 165 mm Dimensions Ø 165 mm (Specify Laser Cutting Rectangle) Thickness 1.935 mm Shape Round (Specify Laser Cut Rectangle) Substrate Fused Silica Clear Aperture 156.75 mm Thickness Tolerance ±0.025 mm Weight 68.04 g Laser Cutting Rectangle Surface Quality 20-10 scratch-dig Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving None Material Grade 0F Reflected Wavefront Error < 5λ (RMS) Bevels Break Edge Safety Edge Finish Fine Ground Supplier Location New York, USA Selected Product Option Laser Cutting: Rectangle Laser Cut & Engraving: None Laser Cut & Quality Level: Full inspection with interferograms See product details More from Sydor
Wafer	Ø 130 mm (Specify Laser Cutting Diameter)	Round	Fused Silica	In stock	$ 415.00
Product Code Manufacturer Corning Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 130 mm Dimensions Ø 130 mm (Specify Laser Cutting Diameter) Thickness 0.5 mm Shape Round Substrate Fused Silica Thickness Tolerance ±0.1 mm Weight 68.04 g Laser Cutting Diameter Diameter Tolerance +0/-0.25 mm Surface Quality 60-40 scratch-dig Laser Cut & Quality Levels As is. C of C only Laser Engraving None Material Grade 0F Bevels Break Edge Safety Edge Finish Fine Ground Supplier Location New York, USA Selected Product Option Laser Cutting: Diameter Laser Cut & Engraving: None Laser Cut & Quality Levels: As is. C of C only See product details More from Sydor
Wafer	Ø 150 mm	Round	Fused Silica	In stock	$ 691.00
Product Code Manufacturer Corning Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 150 mm Dimensions Ø 150 mm Thickness 0.381 mm Shape Round Substrate Fused Silica Clear Aperture 3 mm Thickness Tolerance ±0.01 mm Weight 68.04 g Laser Cutting Standard Semi-Flat Diameter Tolerance ±0.2 mm Surface Quality 20-10 scratch-dig Laser Cut & Quality Levels As is. C of C only Laser Engraving None Material Grade 0F Transmitted Wavefront Error < λ/5 (6 mm) Bevels C-Bevel Edge Finish Fine Ground Supplier Location New York, USA Selected Product Option Laser Cutting: Standard Semi-Flat Laser Cut & Engraving: None Laser Cut & Quality Levels: As is. C of C only See product details More from Sydor
Wafer	Ø 125 mm	Round	Fused Silica	In stock	$ 392.00
Product Code Manufacturer Corning Wavelength Range 632 nm (Metrology, Center Wavelength) Center Wavelength 632 nm (Metrology) Diameter 125 mm Dimensions Ø 125 mm Thickness 0.5 mm Parallelism < 10'' Shape Round Substrate Fused Silica Clear Aperture 106.25 mm Thickness Tolerance ±0.025 mm Weight 68.04 g Laser Cutting Standard Semi-Flat Diameter Tolerance ±0.1 mm Surface Quality 60-40 scratch-dig Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving None Surface Roughness < 700 pm (RMS) Bevels Break Edge Safety Edge Finish Fine Ground Supplier Location New York, USA Selected Product Option Laser Cutting: Standard Semi-Flat Laser Cut & Engraving: None Laser Cut & Quality Levels: Full inspection with interferograms See product details More from Sydor
Wafer	Ø 100 mm	Round	Fused Silica	In stock	$ 280.00
Product Code Wavelength Range 632 nm (Metrology, Center Wavelength) Center Wavelength 632 nm (Metrology) Diameter 100 mm Dimensions Ø 100 mm Thickness 3 mm Shape Round Substrate Fused Silica Clear Aperture 85 mm Thickness Tolerance ±0.1 mm Weight 170.1 g Laser Cutting Standard Semi-Flat Diameter Tolerance ±0.2 mm Surface Quality 40-20 scratch-dig Laser Cut & Quality Levels As is. C of C only Laser Engraving Individual Optic Surface Roughness < 1 nm Transmitted Wavefront Error < λ/4 (per inch) Reflected Wavefront Error < λ Bevels Saftey Bevel Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Standard Semi-Flat Laser Cut & Engraving: Individual Optic Laser Cut & Quality Levels: As is. C of C only See product details More from Sydor
Wafer	Ø 110 mm	Round	Fused Silica	In stock	$ 231.00
Product Code Manufacturer Corning Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 110 mm Dimensions Ø 110 mm Thickness 3 mm Parallelism < 5' Shape Round Substrate Fused Silica Clear Aperture 93.5 mm Thickness Tolerance ±0.5 mm Weight 68.04 g Laser Cutting Standard Semi-Flat Diameter Tolerance ±0.075 mm Surface Quality 60-40 scratch-dig Laser Cut & Quality Levels As is. C of C only Laser Engraving Individual Optic Surface Roughness 1.5 nm (2.5 μm²) Material Grade 2C Transmitted Wavefront Error λ/2 (per inch) Bevels Break Edge Safety Edge Finish Fine Ground Supplier Location New York, USA Selected Product Option Laser Cutting: Standard Semi-Flat Laser Cut & Engraving: Individual Optic Laser Cut & Quality Levels: As is. C of C only See product details More from Sydor
Wafer	Ø 150 mm	Round	Suprasil 3001	In stock	$ 5028.00
Product Code Wavelength Range 633 nm (Metrology, Center Wavelength) Center Wavelength 633 nm (Metrology) Diameter 150 mm Dimensions Ø 150 mm Thickness 3 mm Parallelism < 10'' Shape Round Substrate Suprasil 3001 Clear Aperture 3 mm Thickness Tolerance ±0.05 mm Weight 198.45 g Laser Cutting Semi-Notch Diameter Tolerance ±0.2 mm Surface Quality 40-20 scratch-dig Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving Individual Optic Surface Roughness < 800 pm (RMS) Transmitted Wavefront Error 2λ (633 nm) Edge Finish Fine ground Supplier Location New York, USA Selected Product Option Laser Cutting: Semi-Notch Laser Cut & Engraving: Individual Optic Laser Cut & Quality Levels: Full inspection with interferograms See product details More from Sydor
Wafer	Ø 100 mm (Specify Laser Cutting Rectangle)	Round (Specify Laser Cut Rectangle)	Fused Silica	In stock	$ 423.00
Product Code Manufacturer Corning Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 100 mm Dimensions Ø 100 mm (Specify Laser Cutting Rectangle) Thickness 0.965 mm Parallelism < 1' Shape Round (Specify Laser Cut Rectangle) Substrate Fused Silica Clear Aperture 92 mm Thickness Tolerance ±0.012 mm Weight 68.04 g Laser Cutting Rectangle Diameter Tolerance ±0.1 mm Surface Quality 40-20 scratch-dig Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving None Surface Roughness < 700 pm Material Grade 0F Transmitted Wavefront Error < 3λ/4 Bevels Visible to 0.30mm max leg dimension Edge Finish Fine Ground Supplier Location New York, USA Selected Product Option Laser Cutting: Rectangle Laser Cut & Engraving: None Laser Cut & Quality Levels: Full inspection with interferograms See product details More from Sydor
Wafer	Ø 200 mm	Round	Fused Silica	In stock	$ 485.00
Product Code Manufacturer Corning Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 200 mm Dimensions Ø 200 mm Thickness 1.25 mm Shape Round Substrate Fused Silica Clear Aperture 195 mm Thickness Tolerance +0.05/-0 mm Weight 68.04 g Laser Cutting Semi-Notch Diameter Tolerance ±0.1 mm Surface Quality 20-10 scratch-dig Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving None Bevels 0.20mm - 0.40mm Edge Finish Fine Ground Supplier Location New York, USA Selected Product Option Laser Cutting: Semi-Notch Laser Cut & Engraving: None Laser Cut & Quality Level: Full inspection with interferograms See product details More from Sydor
Wafer	Ø 150 mm	Round	Fused Silica	In stock	$ 309.00
Product Code Manufacturer Corning Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 150 mm Dimensions Ø 150 mm Thickness 0.2 mm Shape Round Substrate Fused Silica Clear Aperture 140 mm, 139.27 mm Thickness Tolerance ±0.05 mm Weight 198.45 g Laser Cutting Semi-Notch Diameter Tolerance ±0.2 mm Surface Quality 60-40 scratch-dig Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving Individual Optic Material Grade 0G Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Semi-Notch Laser Cut & Engraving: Individual Optic Laser Cut & Quality Levels: Full inspection with interferograms See product details More from Sydor
Wafer	Ø 142 mm	Round	Fused Silica	In stock	$ 513.00
Product Code Manufacturer Corning Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 142 mm Dimensions Ø 142 mm Thickness 6 mm Parallelism < 2' Shape Round Substrate Fused Silica Clear Aperture 128 mm Thickness Tolerance +0/-0.15 mm Weight 68.04 g Laser Cutting None Diameter Tolerance +0/-0.15 mm Surface Quality 40-20 scratch-dig Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving Individual Optic Material Grade 0G Transmitted Wavefront Error < λ/4 (per inch) Bevels 1.00mm Max FW @ 45° Edge Finish Fine Ground Supplier Location New York, USA Selected Product Option Laser Cutting: None Laser Engraving: Individual Optic Laser Cut & Quality Levels: Full inspection with interferograms See product details More from Sydor
Wafer	Ø 100 mm	Round	Fused Silica	In stock	$ 400.00
Product Code Manufacturer Corning Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 100 mm Dimensions Ø 100 mm Thickness 1.879 mm Parallelism < 1' 22.2'' Shape Round Substrate Fused Silica Clear Aperture 92 mm Thickness Tolerance ±0.025 mm Weight 141.75 g Laser Cutting None Diameter Tolerance +0.1/-0.2 mm Surface Quality 60-40 scratch-dig Laser Cut & Quality Levels As is. C of C only Laser Engraving Individual Optic Surface Roughness < 700 pm Bevels Visible to 0.30mm max LW Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: None Laser Engraving: Individual Optic Laser Cut & Quality Levels: As is. C of C only See product details More from Sydor
Wafer	Ø 200 mm (Specify Laser Cutting Rectangle)	Round (Specify Laser Cut Rectangle)	Fused Silica	In stock	$ 695.00
Product Code Wavelength Range 632 nm (Metrology, Center Wavelength) Center Wavelength 632 nm (Metrology) Diameter 200 mm Dimensions Ø 200 mm (Specify Laser Cutting Rectangle) Thickness 0.5 mm Shape Round (Specify Laser Cut Rectangle) Substrate Fused Silica Clear Aperture 170 mm Thickness Tolerance ±0.1 mm Weight 141.75 g Laser Cutting Rectangle Diameter Tolerance ±0.1 mm Surface Quality 40-20 scratch-dig Laser Cut & Quality Levels As is. C of C only Laser Engraving None Surface Roughness < 1 nm Warp < 0.025 mm Bow < 0.025 mm Bevels Saftey Bevel Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Rectangle Laser Cut & Engraving: None Laser Cut & Quality Level: As is. C of C only See product details More from Sydor
Wafer	Ø 200 mm	Round	Fused Silica	In stock	$ 1315.00
Product Code Manufacturer Corning Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 200 mm Dimensions Ø 200 mm Thickness 5.25 mm Shape Round Substrate Fused Silica Clear Aperture 185 mm Thickness Tolerance ±0.05 mm Weight 283.5 g Laser Cutting Semi-Notch Diameter Tolerance ±0.1 mm Surface Quality 20-10 scratch-dig Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving None Reflected Wavefront Error < 20λ Bevels 0.50mm MAX FW @ 45° Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Semi-Notch Laser Cut & Engraving: None Laser Cut & Quality Level: Full inspection with interferograms See product details More from Sydor
Wafer	Ø 100 mm (Specify Laser Cutting Diameter)	Round	Fused Silica	In stock	$ 422.00
Product Code Manufacturer Corning Wavelength Range 632 nm (Metrology, Center Wavelength) Center Wavelength 632 nm (Metrology) Diameter 100 mm Dimensions Ø 100 mm (Specify Laser Cutting Diameter) Thickness 1 mm Shape Round Substrate Fused Silica Clear Aperture 85 mm Thickness Tolerance ±0.05 mm Weight 68.04 g Laser Cutting Diameter Diameter Tolerance ±0.1 mm Surface Quality 40-20 scratch-dig Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving None Surface Roughness < 1.3 nm (RMS) Material Grade 0F Warp 0.015 mm Bow 0.01 mm Bevels C-Bevel Edge Finish Fine Ground Supplier Location New York, USA Selected Product Option Laser Cutting: Diameter Laser Cut & Engraving: None Laser Cut & Quality Levels: Full inspection with interferograms See product details More from Sydor