Mirror Blanks

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Also known as flats, blanks are optical components made of bare substrates which will be coated with reflective coatings to create front-surface flat mirrors. Learn More

Product	Dimensions	Shape	Substrate	Availability	Price (USD)
Wafer	Ø 200 mm	Round	Fused Silica	In stock	$ 299.00
Product Code Wavelength Range 632 nm (Metrology, Center Wavelength) Center Wavelength 632 nm (Metrology) Diameter 200 mm Dimensions Ø 200 mm Thickness 1 mm Shape Round Substrate Fused Silica Clear Aperture 170 mm Thickness Tolerance ±0.1 mm Weight 170.1 g Diameter Tolerance ±0.2 mm Laser Cutting None Surface Quality 40-20 scratch-dig Laser Cut & Quality Levels As is. C of C only Laser Engraving Individual Optic Surface Roughness < 1 nm Transmitted Wavefront Error < λ/4 (per inch) Reflected Wavefront Error < λ Bevels Safety Bevel Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: None Laser Engraving: Individual Optic Laser Cut & Quality Level: As is. C of C only See product details More from Sydor
Wafer	101.6 x 101.6 mm (Specify Laser Cutting Rectangle)	Square	Fused Silica	In stock	$ 523.00
Product Code Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Dimensions 101.6 x 101.6 mm (Specify Laser Cutting Rectangle) Shape Square Substrate Fused Silica Clear Aperture 91.44 x 91.44 mm Weight 141.75 g Laser Cutting Rectangle Surface Quality 60-40 scratch-dig Laser Cut & Quality Levels As is. C of C only Laser Engraving Individual Optic Transmitted Wavefront Error < λ (per inch) Length 101.6 mm (4") Width Tolerance +0/-0.1 mm Width 101.6 mm (4") Length Tolerance +0/-0.1 mm Quality As is. C of C only Bevels Break Edge, Safety Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Rectangle Laser Cut & Engraving: Individual Optic Laser Cut & Quality Levels: As is. C of C only Quality Levels: As is. C of C only See product details More from Sydor
Wafer	Ø 150 mm	Round	RG715	In stock	$ 1413.00
Product Code Manufacturer SCHOTT Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 150 mm Dimensions Ø 150 mm Thickness 5.054 mm Parallelism < 40.8'' Shape Round Substrate RG715 Clear Aperture 142 mm Thickness Tolerance +0.05/-0.025 mm Weight 198.45 g Diameter Tolerance +0.1/-0.2 mm Surface Quality 60-40 scratch-dig Quality As is. C of C only Bevels Visible to 0.40mm max. leg Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Quality Levels: As is. C of C only See product details More from Sydor
Wafer	Ø 250 mm (Specify Laser Cutting Rectangle)	Round (Specify Laser Cut Rectangle)	-	In stock	$ 3888.00
Product Code Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 250 mm Dimensions Ø 250 mm (Specify Laser Cutting Rectangle) Thickness 3 mm Shape Round (Specify Laser Cut Rectangle) Clear Aperture 216 mm Thickness Tolerance ±0.1 mm Weight 141.75 g Diameter Tolerance +0/-0.1 mm Laser Cutting Rectangle Surface Quality 60-40 scratch-dig Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving Individual Optic Surface Roughness < 1 nm (RMS) Quality As is. C of C only Bevels 0.30mm to 1.00mm FW @ 45° Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Rectangle Laser Cut & Engraving: Individual Optic Laser Cut & Quality Level: Full inspection with interferograms Quality Levels: As is. C of C only See product details More from Sydor
Wafer	Ø 150 mm	Round	Fused Silica	In stock	$ 277.00
Product Code Wavelength Range 632 nm (Metrology, Center Wavelength) Center Wavelength 632 nm (Metrology) Diameter 150 mm Dimensions Ø 150 mm Thickness 1.5 mm Shape Round Substrate Fused Silica Clear Aperture 140 mm (S1) Thickness Tolerance ±0.01 mm Weight 68.04 g Diameter Tolerance ±0.2 mm Laser Cutting Standard Semi-Flat Surface Quality 60-40 scratch-dig Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving None Bevels 0.750mm Radius C-bevel Edge Finish Fine Ground Supplier Location New York, USA Selected Product Option Laser Cutting: Standard Semi-Flat Laser Cut & Engraving: None Laser Cut & Quality Levels: Full inspection with interferograms See product details More from Sydor
Wafer	Ø 158 mm (Specify Laser Cutting Rectangle)	Round (Specify Laser Cut Rectangle)	Fused Silica	In stock	$ 473.00
Product Code Manufacturer Corning Wavelength Range 632 nm (Metrology, Center Wavelength) Center Wavelength 632 nm (Metrology) Diameter 158 mm Dimensions Ø 158 mm (Specify Laser Cutting Rectangle) Thickness 2.325 mm Shape Round (Specify Laser Cut Rectangle) Substrate Fused Silica Clear Aperture 134.3 mm Thickness Tolerance ±0.05 mm Weight 68.04 g Diameter Tolerance ±0.2 mm Laser Cutting Rectangle Surface Quality 20-10 scratch-dig Laser Cut & Quality Levels As is. C of C only Laser Engraving None Surface Roughness < 1 nm (RMS) Material Grade 0G Reflected Wavefront Error λ/2 (25 mm, 12 mm) Warp < 0.02 mm Bow < 0.015 mm Bevels Break Edge Safety Edge Finish Fine Ground Supplier Location New York, USA Selected Product Option Laser Cutting: Rectangle Laser Cut & Engraving: None Laser Cut & Quality Level: As is. C of C only See product details More from Sydor
Wafer	Ø 203 mm	Round	UV Fused Silica	In stock	$ 960.00
Product Code Wavelength Range 195 - 2100 nm Diameter 203 mm Dimensions Ø 203 mm Thickness 1 mm Parallelism < 5'' Shape Round Substrate UV Fused Silica Clear Aperture 191 mm Thickness Tolerance +0/-0.1 mm Weight 141.75 g Diameter Tolerance ±0.12 mm Laser Cutting Semi-Notch Surface Quality 40-20 scratch-dig Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving Individual Optic Surface Roughness < 2 - 180 μm (5 A, RMS) Bevels 0.5mm MAX @ 45° FW Edge Finish Fine ground Supplier Location New York, USA Selected Product Option Laser Cutting: Semi-Notch Laser Cut & Engraving: Individual Optic Laser Cut & Quality Level: Full inspection with interferograms See product details More from Sydor
Wafer	Ø 200 mm (Specify Laser Cutting Rectangle)	Round (Specify Laser Cut Rectangle)	Fused Silica	In stock	$ 652.00
Product Code Manufacturer Corning Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 200 mm Dimensions Ø 200 mm (Specify Laser Cutting Rectangle) Thickness 2 mm Parallelism < 5'' Shape Round (Specify Laser Cut Rectangle) Substrate Fused Silica Clear Aperture 170 mm Thickness Tolerance ±0.1 mm Weight 283.5 g Diameter Tolerance ±0.5 mm Laser Cutting Rectangle Surface Quality 60-40 scratch-dig Laser Cut & Quality Levels As is. C of C only Laser Engraving None Material Grade 0F Transmitted Wavefront Error < λ Bevels C-bevel Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Rectangle Laser Cut & Engraving: None Laser Cut & Quality Level: As is. C of C only See product details More from Sydor
Wafer	Ø 300 mm	Round	Fused Silica	In stock	$ 939.00
Product Code Wavelength Range 632 nm (Metrology, Center Wavelength) Center Wavelength 632 nm (Metrology) Diameter 300 mm Dimensions Ø 300 mm Thickness 1 mm Shape Round Substrate Fused Silica Clear Aperture 255 mm Thickness Tolerance ±0.1 mm Weight 283.5 g Diameter Tolerance ±0.2 mm Laser Cutting Semi-Notch Surface Quality 40-20 scratch-dig Laser Cut & Quality Levels As is. C of C only Laser Engraving Individual Optic Surface Roughness < 1 nm Transmitted Wavefront Error < λ/4 (per inch) Reflected Wavefront Error < λ Bevels Saftey Bevel Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Semi-Notch Laser Cut & Engraving: Individual Optic Laser Cut & Quality Level: As is. C of C only See product details More from Sydor
Wafer	Ø 200 mm	Round	Fused Silica	In stock	$ 532.00
Product Code Wavelength Range 632 nm (Metrology, Center Wavelength) Center Wavelength 632 nm (Metrology) Diameter 200 mm Dimensions Ø 200 mm Thickness 2 mm Shape Round Substrate Fused Silica Clear Aperture 170 mm Thickness Tolerance ±0.1 mm Weight 198.45 g Diameter Tolerance ±0.2 mm Laser Cutting Standard Semi-Flat Surface Quality 40-20 scratch-dig Laser Cut & Quality Levels As is. C of C only Laser Engraving Individual Optic Surface Roughness < 1 nm Transmitted Wavefront Error < λ/4 (per inch) Reflected Wavefront Error < λ Bevels Saftey Bevel Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Standard Semi-Flat Laser Cut & Engraving: Individual Optic Laser Cut & Quality Level: As is. C of C only See product details More from Sydor
Wafer	Ø 300 mm	Round	Fused Silica	In stock	$ 1636.00
Product Code Manufacturer Corning Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 300 mm Dimensions Ø 300 mm Thickness 5.93 mm Parallelism < 3'' Shape Round Substrate Fused Silica Clear Aperture 285 mm Thickness Tolerance +0/-0.04 mm Weight 68.04 g Diameter Tolerance +0/-0.25 mm Laser Cutting Semi-Notch Surface Quality 20-10 scratch-dig Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving None Surface Roughness < 1.5 nm (RMS) Material Grade 0G Transmitted Wavefront Error < λ/10, λ/4 Reflected Wavefront Error < 0.15λ (Surface 2) Bevels 0.50mm FW max @ 45° Edge Finish Fine Ground Supplier Location New York, USA Selected Product Option Laser Cutting: Semi-Notch Laser Cut & Engraving: None Laser Cut & Quality Level: Full inspection with interferograms See product details More from Sydor
Wafer	Ø 200 mm (Specify Laser Cutting Rectangle)	Round (Specify Laser Cut Rectangle)	Fused Silica	In stock	$ 1595.00
Product Code Manufacturer Corning Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 200 mm Dimensions Ø 200 mm (Specify Laser Cutting Rectangle) Thickness 5.25 mm Shape Round (Specify Laser Cut Rectangle) Substrate Fused Silica Clear Aperture 185 mm Thickness Tolerance ±0.05 mm Weight 283.5 g Diameter Tolerance ±0.1 mm Laser Cutting Rectangle Surface Quality 20-10 scratch-dig Laser Cut & Quality Levels As is. C of C only Laser Engraving Individual Optic Reflected Wavefront Error < 20λ Bevels 0.50mm MAX FW @ 45° Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Rectangle Laser Cut & Engraving: Individual Optic Laser Cut & Quality Level: As is. C of C only See product details More from Sydor
Wafer	Ø 100 mm (Specify Laser Cutting Rectangle)	Round (Specify Laser Cut Rectangle)	Fused Silica	In stock	$ 488.00
Product Code Manufacturer Corning Wavelength Range 632 nm (Metrology, Center Wavelength) Center Wavelength 632 nm (Metrology) Diameter 100 mm Dimensions Ø 100 mm (Specify Laser Cutting Rectangle) Thickness 0.5 mm Shape Round (Specify Laser Cut Rectangle) Substrate Fused Silica Clear Aperture 85 mm Thickness Tolerance ±0.01 mm Weight 28.35 g Diameter Tolerance ±0.2 mm Laser Cutting Rectangle Surface Quality 20-10 scratch-dig Laser Cut & Quality Levels As is. C of C only Laser Engraving Individual Optic Surface Roughness < 1.3 nm (RMS) Material Grade 0F Reflected Wavefront Error < 4λ Edge Finish Fine Edge Ground Supplier Location New York, USA Selected Product Option Laser Cutting: Rectangle Laser Cut & Engraving: Individual Optic Laser Cut & Quality Levels: As is. C of C only See product details More from Sydor
Wafer	Ø 209.55 mm (Specify Laser Cutting Rectangle)	Round (Specify Laser Cut Rectangle)	Fused Silica	In stock	$ 2556.00
Product Code Manufacturer Corning Wavelength Range 632 nm (Metrology, Center Wavelength) Center Wavelength 632 nm (Metrology) Diameter 209.55 mm Dimensions Ø 209.55 mm (Specify Laser Cutting Rectangle) Thickness 5 mm Shape Round (Specify Laser Cut Rectangle) Substrate Fused Silica Thickness Tolerance ±0.25 mm Weight 907.18 g Diameter Tolerance +0/-0.25 mm Laser Cutting Rectangle Surface Quality 60-40 scratch-dig Laser Cut & Quality Levels As is. C of C only Laser Engraving Individual Optic Material Grade 0G Transmitted Wavefront Error < λ/4 -3 to 5λ/2 < λ/10 (RMS) Edge Finish Fine Edge Ground Supplier Location New York, USA Selected Product Option Laser Cutting: Rectangle Laser Cut & Engraving: Individual Optic Laser Cut & Quality Level: As is. C of C only See product details More from Sydor
Wafer	Ø 250 mm	Round	-	In stock	$ 3548.00
Product Code Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 250 mm Dimensions Ø 250 mm Thickness 3 mm Shape Round Clear Aperture 216 mm Thickness Tolerance ±0.1 mm Weight 141.75 g Diameter Tolerance +0/-0.1 mm Laser Cutting None Surface Quality 60-40 scratch-dig Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving None Surface Roughness < 1 nm (RMS) Quality As is. C of C only Bevels 0.30mm to 1.00mm FW @ 45° Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: None Laser Engraving: None Laser Cut & Quality Level: Full inspection with interferograms Quality Levels: As is. C of C only See product details More from Sydor
Wafer	Ø 158 mm (Specify Laser Cutting Diameter)	Round	Fused Silica	In stock	$ 513.00
Product Code Manufacturer Corning Wavelength Range 632 nm (Metrology, Center Wavelength) Center Wavelength 632 nm (Metrology) Diameter 158 mm Dimensions Ø 158 mm (Specify Laser Cutting Diameter) Thickness 2.325 mm Shape Round Substrate Fused Silica Clear Aperture 134.3 mm Thickness Tolerance ±0.05 mm Weight 68.04 g Diameter Tolerance ±0.2 mm Laser Cutting Diameter Surface Quality 20-10 scratch-dig Laser Cut & Quality Levels As is. C of C only Laser Engraving Individual Optic Surface Roughness < 1 nm (RMS) Material Grade 0G Reflected Wavefront Error λ/2 (25 mm, 12 mm) Warp < 0.02 mm Bow < 0.015 mm Bevels Break Edge Safety Edge Finish Fine Ground Supplier Location New York, USA Selected Product Option Laser Cutting: Diameter Laser Cut & Engraving: Individual Optic Laser Cut & Quality Level: As is. C of C only See product details More from Sydor
Wafer	Ø 100 mm (Specify Laser Cutting Rectangle)	Round (Specify Laser Cut Rectangle)	Fused Silica	In stock	$ 363.00
Product Code Manufacturer Corning Wavelength Range 632 nm (Metrology, Center Wavelength) Center Wavelength 632 nm (Metrology) Diameter 100 mm Dimensions Ø 100 mm (Specify Laser Cutting Rectangle) Thickness 1.04 mm Parallelism < 30'' Shape Round (Specify Laser Cut Rectangle) Substrate Fused Silica Clear Aperture 90 mm Thickness Tolerance ±0.02 mm Weight 68.04 g Diameter Tolerance +0/-0.25 mm Laser Cutting Rectangle Surface Quality 20-10 scratch-dig Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving None Surface Roughness < 1 nm (RMS) Material Grade 0A Reflected Wavefront Error < λ Bevels 0.5mm Max FW @ 45° all edges Edge Finish Fine Ground Supplier Location New York, USA Selected Product Option Laser Cutting: Rectangle Laser Cut & Engraving: None Laser Cut & Quality Levels: Full inspection with interferograms See product details More from Sydor
Wafer	Ø 100 mm	Round	Fused Silica	In stock	$ 248.00
Product Code Wavelength Range 632 nm (Metrology, Center Wavelength) Center Wavelength 632 nm (Metrology) Diameter 100 mm Dimensions Ø 100 mm Thickness 2 mm Shape Round Substrate Fused Silica Clear Aperture 85 mm Thickness Tolerance ±0.1 mm Weight 141.75 g Diameter Tolerance ±0.2 mm Laser Cutting Semi-Notch Surface Quality 40-20 scratch-dig Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving None Surface Roughness < 1 nm Transmitted Wavefront Error < λ/4 (per inch) Reflected Wavefront Error < λ Bevels Saftey Bevel Supplier Location New York, USA Selected Product Option Laser Cutting: Semi-Notch Laser Cut & Engraving: None Laser Cut & Quality Levels: Full inspection with interferograms See product details More from Sydor
Wafer	Ø 110 mm	Round	Fused Silica	In stock	$ 191.00
Product Code Manufacturer Corning Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 110 mm Dimensions Ø 110 mm Thickness 3 mm Parallelism < 5' Shape Round Substrate Fused Silica Clear Aperture 93.5 mm Thickness Tolerance ±0.5 mm Weight 68.04 g Diameter Tolerance ±0.075 mm Laser Cutting Standard Semi-Flat Surface Quality 60-40 scratch-dig Laser Cut & Quality Levels As is. C of C only Laser Engraving None Surface Roughness 1.5 nm (2.5 μm²) Material Grade 2C Transmitted Wavefront Error λ/2 (per inch) Bevels Break Edge Safety Edge Finish Fine Ground Supplier Location New York, USA Selected Product Option Laser Cutting: Standard Semi-Flat Laser Cut & Engraving: None Laser Cut & Quality Levels: As is. C of C only See product details More from Sydor
Wafer	Ø 150 mm	Round	Fused Silica	In stock	$ 661.00
Product Code Manufacturer Corning Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 150 mm Dimensions Ø 150 mm Thickness 0.381 mm Shape Round Substrate Fused Silica Clear Aperture 3 mm Thickness Tolerance ±0.01 mm Weight 68.04 g Diameter Tolerance ±0.2 mm Laser Cutting Semi-Notch Surface Quality 20-10 scratch-dig Laser Cut & Quality Levels As is. C of C only Laser Engraving None Material Grade 0F Transmitted Wavefront Error < λ/5 (6 mm) Bevels C-Bevel Edge Finish Fine Ground Supplier Location New York, USA Selected Product Option Laser Cutting: Semi-Notch Laser Cut & Engraving: None Laser Cut & Quality Levels: As is. C of C only See product details More from Sydor