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Optical Mirrors

Mirrors are optical components that reflect light from their reflective surfaces. Reflectivity can be achieved using metallic substrates or by applying HR dielectric or metallic coatings to otherwise transmissive materials (usually glass).

Product	Wavelength Range	Substrate	Dimensions	Availability	Price (USD)
Wafer	632.8 nm (Metrology, Center Wavelength)	Fused Silica	Ø 152.4 mm (Specify Laser Cutting Diameter)	In stock	$ 1522.00
Product Code Manufacturer Corning Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 152.4 mm Dimensions Ø 152.4 mm (Specify Laser Cutting Diameter) Thickness 25.4 mm (1") Parallelism < 3' Substrate Fused Silica Clear Aperture 137.2 mm Thickness Tolerance ±2 mm Weight 453.59 g Shape Round Surface Quality 60-40 scratch-dig (S1) 80-50 scratch-dig (S2) Laser Cutting Diameter Diameter Tolerance +0/-1 mm Laser Cut & Quality Levels As is. C of C only Laser Engraving Individual Optic Material Grade 0G Reflected Wavefront Error λ/10 Bevels 1.00mm Max FW @ 45° Edge Finish Fine Edge Ground Supplier Location New York, USA Selected Product Option Laser Cutting: Diameter Laser Cut & Engraving: Individual Optic Laser Cut & Quality Level: As is. C of C only See product details More from Sydor
Wafer	632 nm (Metrology, Center Wavelength)	Fused Silica	Ø 125 mm	In stock	$ 366.00
Product Code Manufacturer Corning Wavelength Range 632 nm (Metrology, Center Wavelength) Center Wavelength 632 nm (Metrology) Diameter 125 mm Dimensions Ø 125 mm Thickness 1 mm Parallelism < 10'' Substrate Fused Silica Clear Aperture 106.25 mm Thickness Tolerance ±0.01 mm Weight 198.45 g Shape Round Surface Quality 60-40 scratch-dig Laser Cutting Standard Semi-Flat Diameter Tolerance ±0.1 mm Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving Individual Optic Surface Roughness < 700 pm (RMS) Transmitted Wavefront Error < 2λ (per inch) Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Standard Semi-Flat Laser Cut & Engraving: Individual Optic Laser Cut & Quality Levels: Full inspection with interferograms See product details More from Sydor
Wafer	632 nm (Metrology, Center Wavelength)	Fused Silica	Ø 150 mm	In stock	$ 421.00
Product Code Manufacturer Corning Wavelength Range 632 nm (Metrology, Center Wavelength) Center Wavelength 632 nm (Metrology) Diameter 150 mm Dimensions Ø 150 mm Thickness 1.025 mm Substrate Fused Silica Clear Aperture 3 mm Thickness Tolerance ±0.025 mm Weight 141.75 g Shape Round Surface Quality 20-10 scratch-dig Laser Cutting Semi-Notch Diameter Tolerance ±0.2 mm Laser Cut & Quality Levels As is. C of C only Laser Engraving Individual Optic Surface Roughness < 1 nm (RMS) Material Grade 0A Bevels Polished c-bevel Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Semi-Notch Laser Cut & Engraving: Individual Optic Laser Cut & Quality Levels: As is. C of C only See product details More from Sydor
Wafer	632.8 nm (Metrology, Center Wavelength)	Fused Silica	Ø 150 mm (Specify Laser Cutting Diameter)	In stock	$ 599.00
Product Code Manufacturer Corning Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 150 mm Dimensions Ø 150 mm (Specify Laser Cutting Diameter) Thickness 0.2 mm Substrate Fused Silica Clear Aperture 140 mm, 139.27 mm Thickness Tolerance ±0.05 mm Weight 198.45 g Shape Round Surface Quality 60-40 scratch-dig Laser Cutting Diameter Diameter Tolerance ±0.2 mm Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving Individual Optic Material Grade 0G Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Diameter Laser Cut & Engraving: Individual Optic Laser Cut & Quality Levels: Full inspection with interferograms See product details More from Sydor
Wafer	632.8 nm (Metrology, Center Wavelength)	Fused Silica	Ø 150 mm	In stock	$ 323.00
Product Code Manufacturer Corning Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 150 mm Dimensions Ø 150 mm Thickness 0.608 mm Parallelism < 10'' Substrate Fused Silica Clear Aperture Ø 140 mm Thickness Tolerance ±0.015 mm Weight 198.45 g Shape Round Surface Quality 60-40 scratch-dig Laser Cutting Standard Semi-Flat Diameter Tolerance ±0.1 mm Laser Cut & Quality Levels As is. C of C only Laser Engraving None Surface Roughness < 700 pm (RMS) Material Grade 0F Transmitted Wavefront Error 2λ (per inch) Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Standard Semi-Flat Laser Cut & Engraving: None Laser Cut & Quality Levels: As is. C of C only See product details More from Sydor
Wafer	632 nm (Metrology, Center Wavelength)	Fused Silica	Ø 150 mm	In stock	$ 284.00
Product Code Manufacturer Corning Wavelength Range 632 nm (Metrology, Center Wavelength) Center Wavelength 632 nm (Metrology) Diameter 150 mm Dimensions Ø 150 mm Thickness 1.466 mm Substrate Fused Silica Clear Aperture 140 mm, 139.27 mm Thickness Tolerance ±0.01 mm Weight 141.75 g Shape Round Surface Quality 60-40 scratch-dig Laser Cutting Standard Semi-Flat Diameter Tolerance ±0.2 mm Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving Individual Optic Material Grade 0G Bevels 0.750mm Radius "C" Bevel (SEMI Spec T/4 Tolerance) Edge Finish Fine Edge Ground Supplier Location New York, USA Selected Product Option Laser Cutting: Standard Semi-Flat Laser Cut & Engraving: Individual Optic Laser Cut & Quality Levels: Full inspection with interferograms See product details More from Sydor
Wafer	632.8 nm (Metrology, Center Wavelength)	Fused Silica	Ø 200 mm	In stock	$ 555.00
Product Code Manufacturer Corning Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 200 mm Dimensions Ø 200 mm Thickness 1.25 mm Substrate Fused Silica Clear Aperture 195 mm Thickness Tolerance +0.05/-0 mm Weight 68.04 g Shape Round Surface Quality 20-10 scratch-dig Laser Cutting Standard Semi-Flat Diameter Tolerance ±0.1 mm Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving Individual Optic Bevels 0.20mm - 0.40mm Edge Finish Fine Ground Supplier Location New York, USA Selected Product Option Laser Cutting: Standard Semi-Flat Laser Cut & Engraving: Individual Optic Laser Cut & Quality Level: Full inspection with interferograms See product details More from Sydor
Wafer	632.8 nm (Metrology, Center Wavelength)	Fused Silica	Ø 130 mm (Specify Laser Cutting Diameter)	In stock	$ 415.00
Product Code Manufacturer Corning Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 130 mm Dimensions Ø 130 mm (Specify Laser Cutting Diameter) Thickness 0.5 mm Substrate Fused Silica Thickness Tolerance ±0.1 mm Weight 68.04 g Shape Round Surface Quality 60-40 scratch-dig Laser Cutting Diameter Diameter Tolerance +0/-0.25 mm Laser Cut & Quality Levels As is. C of C only Laser Engraving None Material Grade 0F Bevels Break Edge Safety Edge Finish Fine Ground Supplier Location New York, USA Selected Product Option Laser Cutting: Diameter Laser Cut & Engraving: None Laser Cut & Quality Levels: As is. C of C only See product details More from Sydor
Wafer	632.8 nm (Metrology, Center Wavelength)	Fused Silica	Ø 200 mm (Specify Laser Cutting Rectangle)	In stock	$ 742.00
Product Code Manufacturer Corning Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 200 mm Dimensions Ø 200 mm (Specify Laser Cutting Rectangle) Thickness 2 mm Parallelism < 5'' Substrate Fused Silica Clear Aperture 170 mm Thickness Tolerance ±0.1 mm Weight 283.5 g Shape Round (Specify Laser Cut Rectangle) Surface Quality 60-40 scratch-dig Laser Cutting Rectangle Diameter Tolerance ±0.5 mm Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving Individual Optic Material Grade 0F Transmitted Wavefront Error < λ Bevels C-bevel Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Rectangle Laser Cut & Engraving: Individual Optic Laser Cut & Quality Level: Full inspection with interferograms See product details More from Sydor
Wafer	632.8 nm (Metrology, Center Wavelength)	Fused Silica	Ø 200 mm	In stock	$ 1315.00
Product Code Manufacturer Corning Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 200 mm Dimensions Ø 200 mm Thickness 5.25 mm Substrate Fused Silica Clear Aperture 185 mm Thickness Tolerance ±0.05 mm Weight 283.5 g Shape Round Surface Quality 20-10 scratch-dig Laser Cutting Semi-Notch Diameter Tolerance ±0.1 mm Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving None Reflected Wavefront Error < 20λ Bevels 0.50mm MAX FW @ 45° Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Semi-Notch Laser Cut & Engraving: None Laser Cut & Quality Level: Full inspection with interferograms See product details More from Sydor
Wafer	-	Fused Silica Ultra Low Expansion Glass	36 x 60 mm (Specify Laser Cutting Rectangle)	In stock	$ 2385.00
Product Code Manufacturer Corning Dimensions 36 x 60 mm (Specify Laser Cutting Rectangle) Thickness 4 mm Parallelism < 30'' Substrate Fused Silica Ultra Low Expansion Glass Clear Aperture 34.2 x 57 mm Thickness Tolerance ±0.2 mm Weight 340.19 g Shape Rectangular Surface Quality 20-10 scratch-dig (S1) Laser Cutting Rectangle Laser Cut & Quality Levels As is. C of C only Laser Engraving Individual Optic Surface Roughness < 440 pm (RMS) Reflected Wavefront Error < λ/40 (Surface 1) Length 60 mm Width Tolerance ±0.13 mm Width 36 mm Length Tolerance ±0.13 mm Bevels Break Edge Saftey Supplier Location New York, USA Selected Product Option Laser Cutting: Rectangle Laser Cut & Engraving: Individual Optic Laser Cut & Quality Levels: As is. C of C only See product details More from Sydor
Wafer	632.8 nm (Metrology, Center Wavelength)	Fused Silica	Ø 300 mm (Specify Laser Cutting Rectangle)	In stock	$ 1260.00
Product Code Manufacturer Corning Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 300 mm Dimensions Ø 300 mm (Specify Laser Cutting Rectangle) Thickness 2 mm Parallelism < 3'' Substrate Fused Silica Clear Aperture 285 mm Thickness Tolerance ±0.2 mm Weight 283.5 g Shape Round (Specify Laser Cut Rectangle) Surface Quality 60-40 scratch-dig Laser Cutting Rectangle Diameter Tolerance ±0.2 mm Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving None Material Grade 0G Reflected Wavefront Error < λ/10 (1", 25.4 mm, 632.8 nm, RMS) Bevels 0.10mm - 0.40mm face width @ 45° Edge Finish Fine Edge Ground Supplier Location New York, USA Selected Product Option Laser Cutting: Rectangle Laser Cut & Engraving: None Laser Cut & Quality Level: Full inspection with interferograms See product details More from Sydor
Wafer	632 nm (Metrology, Center Wavelength)	Fused Silica	Ø 200 mm	In stock	$ 289.00
Product Code Wavelength Range 632 nm (Metrology, Center Wavelength) Center Wavelength 632 nm (Metrology) Diameter 200 mm Dimensions Ø 200 mm Thickness 1 mm Substrate Fused Silica Clear Aperture 170 mm Thickness Tolerance ±0.1 mm Weight 170.1 g Shape Round Surface Quality 40-20 scratch-dig Laser Cutting None Diameter Tolerance ±0.2 mm Laser Cut & Quality Levels As is. C of C only Laser Engraving None Surface Roughness < 1 nm Transmitted Wavefront Error < λ/4 (per inch) Reflected Wavefront Error < λ Bevels Safety Bevel Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: None Laser Engraving: None Laser Cut & Quality Level: As is. C of C only See product details More from Sydor
Wafer	195 - 2100 nm	UV Fused Silica	Ø 203 mm (Specify Laser Cutting Rectangle)	In stock	$ 1200.00
Product Code Wavelength Range 195 - 2100 nm Diameter 203 mm Dimensions Ø 203 mm (Specify Laser Cutting Rectangle) Thickness 1 mm Parallelism < 5'' Substrate UV Fused Silica Clear Aperture 191 mm Thickness Tolerance +0/-0.1 mm Weight 141.75 g Shape Round (Specify Laser Cut Rectangle) Surface Quality 40-20 scratch-dig Laser Cutting Rectangle Diameter Tolerance ±0.12 mm Laser Cut & Quality Levels As is. C of C only Laser Engraving Individual Optic Surface Roughness < 2 - 180 μm (5 A, RMS) Bevels 0.5mm MAX @ 45° FW Edge Finish Fine ground Supplier Location New York, USA Selected Product Option Laser Cutting: Rectangle Laser Cut & Engraving: Individual Optic Laser Cut & Quality Level: As is. C of C only See product details More from Sydor
Wafer	632 nm (Metrology, Center Wavelength)	Fused Silica	63.5 x 63.5 mm (2.5 x 2.5")	In stock	$ 108.00
Product Code Manufacturer Corning Wavelength Range 632 nm (Metrology, Center Wavelength) Center Wavelength 632 nm (Metrology) Dimensions 63.5 x 63.5 mm (2.5 x 2.5") Thickness 2.95 mm Parallelism < 30'' Substrate Fused Silica Clear Aperture 57.15 x 57.15 mm Thickness Tolerance ±0.05 mm Weight 226.8 g Shape Square Surface Quality 40-20 scratch-dig Laser Cutting Standard Semi-Flat Laser Cut & Quality Levels As is. C of C only Laser Engraving None Surface Roughness < 1 nm (RMS) Material Grade 0A Reflected Wavefront Error λ/4 Length 63.5 mm (2.5") Width Tolerance +0/-0.25 mm Width 63.5 mm (2.5") Length Tolerance +0/-0.25 mm Edge Finish Fine Edge Ground Supplier Location New York, USA Selected Product Option Laser Cutting: Standard Semi-Flat Laser Cut & Engraving: None Laser Cut & Quality Levels: As is. C of C only See product details More from Sydor
Wafer	632 nm (Metrology, Center Wavelength)	Borofloat	254 x 254 mm (10 x 10", Specify Laser Cutting Diameter)	In stock	$ 611.00
Product Code Wavelength Range 632 nm (Metrology, Center Wavelength) Center Wavelength 632 nm (Metrology) Dimensions 254 x 254 mm (10 x 10", Specify Laser Cutting Diameter) Thickness 4 mm Substrate Borofloat Clear Aperture 10 mm Thickness Tolerance ±0.1 mm Weight 68.04 g Shape Square (Specify Laser Cut Circle Diameter) Surface Quality 60-40 scratch-dig Laser Cutting Diameter Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving None Length 254 mm (10") Width Tolerance ±0.127 mm Width 254 mm (10") Length Tolerance ±0.127 mm Warp < 0.015 mm Bevels Safety - all edges Edge Finish Fine Ground Supplier Location New York, USA Selected Product Option Laser Cutting: Diameter Laser Cut & Engraving: None Laser Cut & Quality Level: Full inspection with interferograms See product details More from Sydor
Wafer	632.8 nm (Metrology, Center Wavelength)	Fused Silica	Ø 150 mm	In stock	$ 191.00
Product Code Manufacturer Corning Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 150 mm Dimensions Ø 150 mm Thickness 1.035 mm Substrate Fused Silica Clear Aperture 140 mm (S1) Thickness Tolerance ±0.01 mm Weight 68.04 g Shape Round Surface Quality 60-40 scratch-dig Laser Cutting Standard Semi-Flat Diameter Tolerance ±0.2 mm Laser Cut & Quality Levels As is. C of C only Laser Engraving None Material Grade 0G Bevels Chamfer: R 0.5mm C-bevel Edge Finish Fine Ground Supplier Location New York, USA Selected Product Option Laser Cutting: Standard Semi-Flat Laser Cut & Engraving: None Laser Cut & Quality Levels: As is. C of C only See product details More from Sydor
Wafer	-	Fused Silica	Ø 110 mm	In stock	$ 2064.00
Product Code Manufacturer Corning Diameter 110 mm Dimensions Ø 110 mm Thickness 2 mm Substrate Fused Silica Clear Aperture > 93.5 mm Thickness Tolerance ±0.1 mm Weight 141.75 g Shape Round Surface Quality 20-10 scratch-dig Laser Cutting Standard Semi-Flat Diameter Tolerance ±0.1 mm Laser Cut & Quality Levels As is. C of C only Laser Engraving None Material Grade 0A Transmitted Wavefront Error < λ/4 Reflected Wavefront Error < λ/4 Bevels Safety bevel Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Standard Semi-Flat Laser Cut & Engraving: None Laser Cut & Quality Levels: As is. C of C only See product details More from Sydor
Wafer	632.8 nm (Metrology, Center Wavelength)	Fused Silica	Ø 100 mm	In stock	$ 183.00
Product Code Manufacturer Corning Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 100 mm Dimensions Ø 100 mm Thickness 0.965 mm Parallelism < 1' Substrate Fused Silica Clear Aperture 92 mm Thickness Tolerance ±0.012 mm Weight 68.04 g Shape Round Surface Quality 40-20 scratch-dig Laser Cutting None Diameter Tolerance ±0.1 mm Laser Cut & Quality Levels As is. C of C only Laser Engraving None Surface Roughness < 700 pm Material Grade 0F Transmitted Wavefront Error < 3λ/4 Bevels Visible to 0.30mm max leg dimension Edge Finish Fine Ground Supplier Location New York, USA Selected Product Option Laser Cutting: None Laser Engraving: None Laser Cut & Quality Levels: As is. C of C only See product details More from Sydor
Wafer	633 nm (Metrology, Center Wavelength)	Fused Silica	Ø 200 mm	In stock	$ 452.00
Product Code Wavelength Range 633 nm (Metrology, Center Wavelength) Center Wavelength 633 nm (Metrology) Diameter 200 mm Dimensions Ø 200 mm Thickness 1 mm Substrate Fused Silica Clear Aperture 5 mm Thickness Tolerance ±0.025 mm Weight 14.17 g Shape Round Surface Quality 40-20 scratch-dig Laser Cutting Standard Semi-Flat Diameter Tolerance ±0.2 mm Laser Cut & Quality Levels As is. C of C only Laser Engraving Individual Optic Bow < 0.03 mm Quality Full inspection with interferograms Bevels Break edges FW @ 45° Supplier Location New York, USA Selected Product Option Laser Cutting: Standard Semi-Flat Laser Cut & Engraving: Individual Optic Laser Cut & Quality Level: As is. C of C only Quality Levels: Full inspection with interferograms See product details More from Sydor