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Optical Mirrors

Mirrors are optical components that reflect light from their reflective surfaces. Reflectivity can be achieved using metallic substrates or by applying HR dielectric or metallic coatings to otherwise transmissive materials (usually glass).

Product	Wavelength Range	Substrate	Dimensions	Availability	Price (USD)
Wafer	633 nm (Metrology, Center Wavelength)	Suprasil 3001	Ø 150 mm (Specify Laser Cutting Rectangle)	In stock	$ 5268.00
Product Code Wavelength Range 633 nm (Metrology, Center Wavelength) Center Wavelength 633 nm (Metrology) Diameter 150 mm Dimensions Ø 150 mm (Specify Laser Cutting Rectangle) Thickness 3 mm Parallelism < 10'' Substrate Suprasil 3001 Thickness Tolerance ±0.05 mm Clear Aperture 3 mm Weight 198.45 g Diameter Tolerance ±0.2 mm Surface Quality 40-20 scratch-dig Laser Cutting Rectangle Shape Round (Specify Laser Cut Rectangle) Laser Cut & Quality Levels As is. C of C only Laser Engraving Individual Optic Surface Roughness < 800 pm (RMS) Transmitted Wavefront Error 2λ (633 nm) Edge Finish Fine ground Supplier Location New York, USA Selected Product Option Laser Cutting: Rectangle Laser Cut & Engraving: Individual Optic Laser Cut & Quality Levels: As is. C of C only See product details More from Sydor
Wafer	633 nm (Metrology, Center Wavelength)	Fused Silica	Ø 100 mm (Specify Laser Cutting Diameter)	In stock	$ 438.00
Product Code Wavelength Range 633 nm (Metrology, Center Wavelength) Center Wavelength 633 nm (Metrology) Diameter 100 mm Dimensions Ø 100 mm (Specify Laser Cutting Diameter) Thickness 1 mm Substrate Fused Silica Thickness Tolerance ±0.025 mm Clear Aperture 3 mm Weight 14.17 g Diameter Tolerance ±0.2 mm Surface Quality 40-20 scratch-dig Laser Cutting Diameter Shape Round Laser Cut & Quality Levels As is. C of C only Laser Engraving Individual Optic Surface Roughness < 1 nm (RMS) Bow < 0.02 mm Quality As is. C of C only Bevels Break edge FW @ 45 degrees Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Diameter Laser Cut & Engraving: Individual Optic Laser Cut & Quality Levels: As is. C of C only Quality Levels: As is. C of C only See product details More from Sydor
Wafer	632.8 nm (Metrology, Center Wavelength)	Fused Silica	Ø 150 mm	In stock	$ 413.00
Product Code Manufacturer Corning Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 150 mm Dimensions Ø 150 mm Thickness 0.608 mm Parallelism < 10'' Substrate Fused Silica Thickness Tolerance ±0.015 mm Clear Aperture Ø 140 mm Weight 198.45 g Diameter Tolerance ±0.1 mm Surface Quality 60-40 scratch-dig Laser Cutting Standard Semi-Flat Shape Round Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving Individual Optic Surface Roughness < 700 pm (RMS) Material Grade 0F Transmitted Wavefront Error 2λ (per inch) Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Standard Semi-Flat Laser Cut & Engraving: Individual Optic Laser Cut & Quality Levels: Full inspection with interferograms See product details More from Sydor
Wafer	632.8 nm (Metrology, Center Wavelength)	Fused Quartz	Ø 215.138 mm	In stock	$ 590.00
Product Code Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 215.138 mm Dimensions Ø 215.138 mm Thickness 1.956 mm Parallelism < 20'' Substrate Fused Quartz Thickness Tolerance ±0.051 mm Clear Aperture 171.958 mm (Minimum) Weight 340.19 g Diameter Tolerance ±0.076 mm Surface Quality 40-20 scratch-dig Laser Cutting Standard Semi-Flat Shape Round Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving None Bevels Break edge Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Standard Semi-Flat Laser Cut & Engraving: None Laser Cut & Quality Level: Full inspection with interferograms See product details More from Sydor
Wafer	632.8 nm (Metrology, Center Wavelength)	Fused Silica	Ø 152.4 mm (Specify Laser Cutting Rectangle)	In stock	$ 1572.00
Product Code Manufacturer Corning Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 152.4 mm Dimensions Ø 152.4 mm (Specify Laser Cutting Rectangle) Thickness 25.4 mm (1") Parallelism < 3' Substrate Fused Silica Thickness Tolerance ±2 mm Clear Aperture 137.2 mm Weight 453.59 g Diameter Tolerance +0/-1 mm Surface Quality 60-40 scratch-dig (S1) 80-50 scratch-dig (S2) Laser Cutting Rectangle Shape Round (Specify Laser Cut Rectangle) Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving Individual Optic Material Grade 0G Reflected Wavefront Error λ/10 Bevels 1.00mm Max FW @ 45° Edge Finish Fine Edge Ground Supplier Location New York, USA Selected Product Option Laser Cutting: Rectangle Laser Cut & Engraving: Individual Optic Laser Cut & Quality Level: Full inspection with interferograms See product details More from Sydor
Wafer	632.8 nm (Metrology, Center Wavelength)	Borofloat	Ø 76.2 mm (Specify Laser Cutting Diameter)	In stock	$ 438.00
Product Code Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 76.2 mm Dimensions Ø 76.2 mm (Specify Laser Cutting Diameter) Thickness 14.7 mm Substrate Borofloat Thickness Tolerance ±0.254 mm Clear Aperture > 60.96 mm Weight 283.5 g Diameter Tolerance +0/-0.13 mm Surface Quality 15-5 scratch-dig (S1, S2) Laser Cutting Diameter Shape Round Laser Cut & Quality Levels As is. C of C only Laser Engraving Individual Optic Reflected Wavefront Error λ/10 (Surface 1, Surface 2) Bevels 0.015" - 0.045" FW @ 45° ± 15° Edge Finish Fine Edge Ground Supplier Location New York, USA Selected Product Option Laser Cutting: Diameter Laser Cut & Engraving: Individual Optic Laser Cut & Quality Levels: As is. C of C only See product details More from Sydor
Wafer	632 nm (Metrology, Center Wavelength)	Fused Silica	Ø 250 mm (Specify Laser Cutting Rectangle)	In stock	$ 615.00
Product Code Wavelength Range 632 nm (Metrology, Center Wavelength) Center Wavelength 632 nm (Metrology) Diameter 250 mm Dimensions Ø 250 mm (Specify Laser Cutting Rectangle) Thickness 1.04 mm Parallelism < 3'' (1", 25.4 mm) Substrate Fused Silica Thickness Tolerance ±0.04 mm Clear Aperture 237.5 mm Weight 226.8 g Diameter Tolerance +0/-0.25 mm Surface Quality 40-20 scratch-dig Laser Cutting Rectangle Shape Round (Specify Laser Cut Rectangle) Laser Cut & Quality Levels As is. C of C only Laser Engraving Individual Optic Transmitted Wavefront Error < λ/10 (RMS) Reflected Wavefront Error < λ/10 (RMS) Edge Finish Fine ground Supplier Location New York, USA Selected Product Option Laser Cutting: Rectangle Laser Cut & Engraving: Individual Optic Laser Cut & Quality Level: As is. C of C only See product details More from Sydor
Wafer	632 nm (Metrology, Center Wavelength)	Fused Silica	Ø 100 mm (Specify Laser Cutting Diameter)	In stock	$ 363.00
Product Code Manufacturer Corning Wavelength Range 632 nm (Metrology, Center Wavelength) Center Wavelength 632 nm (Metrology) Diameter 100 mm Dimensions Ø 100 mm (Specify Laser Cutting Diameter) Thickness 1.04 mm Parallelism < 30'' Substrate Fused Silica Thickness Tolerance ±0.02 mm Clear Aperture 90 mm Weight 68.04 g Diameter Tolerance +0/-0.25 mm Surface Quality 20-10 scratch-dig Laser Cutting Diameter Shape Round Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving None Surface Roughness < 1 nm (RMS) Material Grade 0A Reflected Wavefront Error < λ Bevels 0.5mm Max FW @ 45° all edges Edge Finish Fine Ground Supplier Location New York, USA Selected Product Option Laser Cutting: Diameter Laser Cut & Engraving: None Laser Cut & Quality Levels: Full inspection with interferograms See product details More from Sydor
Wafer	632 nm (Metrology, Center Wavelength)	Fused Silica	Ø 100 mm	In stock	$ 192.00
Product Code Manufacturer Corning Wavelength Range 632 nm (Metrology, Center Wavelength) Center Wavelength 632 nm (Metrology) Diameter 100 mm Dimensions Ø 100 mm Thickness 1 mm Substrate Fused Silica Thickness Tolerance ±0.05 mm Clear Aperture 85 mm Weight 68.04 g Diameter Tolerance ±0.1 mm Surface Quality 40-20 scratch-dig Laser Cutting None Shape Round Laser Cut & Quality Levels As is. C of C only Laser Engraving Individual Optic Surface Roughness < 1.3 nm (RMS) Material Grade 0F Warp 0.015 mm Bow 0.01 mm Bevels C-Bevel Edge Finish Fine Ground Supplier Location New York, USA Selected Product Option Laser Cutting: None Laser Engraving: Individual Optic Laser Cut & Quality Levels: As is. C of C only See product details More from Sydor
Wafer	632 nm (Metrology, Center Wavelength)	Fused Silica	Ø 100 mm (Specify Laser Cutting Diameter)	In stock	$ 495.00
Product Code Wavelength Range 632 nm (Metrology, Center Wavelength) Center Wavelength 632 nm (Metrology) Diameter 100 mm Dimensions Ø 100 mm (Specify Laser Cutting Diameter) Thickness 3 mm Substrate Fused Silica Thickness Tolerance ±0.1 mm Clear Aperture 85 mm Weight 170.1 g Diameter Tolerance ±0.2 mm Surface Quality 40-20 scratch-dig Laser Cutting Diameter Shape Round Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving Individual Optic Surface Roughness < 1 nm Transmitted Wavefront Error < λ/4 (per inch) Reflected Wavefront Error < λ Bevels Saftey Bevel Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Diameter Laser Cut & Engraving: Individual Optic Laser Cut & Quality Levels: Full inspection with interferograms See product details More from Sydor
Wafer	632.8 nm (Metrology, Center Wavelength)	Borofloat	Ø 76.2 mm	In stock	$ 303.00
Product Code Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 76.2 mm Dimensions Ø 76.2 mm Thickness 14.7 mm Substrate Borofloat Thickness Tolerance ±0.254 mm Clear Aperture > 60.96 mm Weight 283.5 g Diameter Tolerance +0/-0.13 mm Surface Quality 15-5 scratch-dig (S1, S2) Laser Cutting Standard Semi-Flat Shape Round Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving Individual Optic Reflected Wavefront Error λ/10 (Surface 1, Surface 2) Bevels 0.015" - 0.045" FW @ 45° ± 15° Edge Finish Fine Edge Ground Supplier Location New York, USA Selected Product Option Laser Cutting: Standard Semi-Flat Laser Cut & Engraving: Individual Optic Laser Cut & Quality Levels: Full inspection with interferograms See product details More from Sydor
Wafer	195 - 2100 nm	UV Fused Silica	Ø 203 mm (Specify Laser Cutting Diameter)	In stock	$ 1200.00
Product Code Wavelength Range 195 - 2100 nm Diameter 203 mm Dimensions Ø 203 mm (Specify Laser Cutting Diameter) Thickness 1 mm Parallelism < 5'' Substrate UV Fused Silica Thickness Tolerance +0/-0.1 mm Clear Aperture 191 mm Weight 141.75 g Diameter Tolerance ±0.12 mm Surface Quality 40-20 scratch-dig Laser Cutting Diameter Shape Round Laser Cut & Quality Levels As is. C of C only Laser Engraving Individual Optic Surface Roughness < 2 - 180 μm (5 A, RMS) Bevels 0.5mm MAX @ 45° FW Edge Finish Fine ground Supplier Location New York, USA Selected Product Option Laser Cutting: Diameter Laser Cut & Engraving: Individual Optic Laser Cut & Quality Level: As is. C of C only See product details More from Sydor
Wafer	632 nm (Metrology, Center Wavelength)	Fused Silica	Ø 209.55 mm	In stock	$ 2276.00
Product Code Manufacturer Corning Wavelength Range 632 nm (Metrology, Center Wavelength) Center Wavelength 632 nm (Metrology) Diameter 209.55 mm Dimensions Ø 209.55 mm Thickness 5 mm Substrate Fused Silica Thickness Tolerance ±0.25 mm Weight 907.18 g Diameter Tolerance +0/-0.25 mm Surface Quality 60-40 scratch-dig Laser Cutting Semi-Notch Shape Round Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving None Material Grade 0G Transmitted Wavefront Error < λ/4 -3 to 5λ/2 < λ/10 (RMS) Edge Finish Fine Edge Ground Supplier Location New York, USA Selected Product Option Laser Cutting: Semi-Notch Laser Cut & Engraving: None Laser Cut & Quality Level: Full inspection with interferograms See product details More from Sydor
Wafer	632.8 nm (Metrology, Center Wavelength)	Fused Silica	Ø 150 mm (Specify Laser Cutting Diameter)	In stock	$ 1042.00
Product Code Manufacturer Corning Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 150 mm Dimensions Ø 150 mm (Specify Laser Cutting Diameter) Thickness 2.648 mm Parallelism 10'' Substrate Fused Silica Thickness Tolerance ±0.015 mm Clear Aperture Ø 140 mm Weight 226.8 g Diameter Tolerance ±0.1 mm Surface Quality 60-40 scratch-dig Laser Cutting Diameter Shape Round Laser Cut & Quality Levels As is. C of C only Laser Engraving Individual Optic Surface Roughness < 700 pm (RMS) Material Grade 0F Transmitted Wavefront Error < 2λ (per inch) Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Diameter Laser Cut & Engraving: Individual Optic Laser Cut & Quality Levels: As is. C of C only See product details More from Sydor
Wafer	632.8 nm (Metrology, Center Wavelength)	Fused Silica	Ø 300 mm (Specify Laser Cutting Diameter)	In stock	$ 1250.00
Product Code Manufacturer Corning Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 300 mm Dimensions Ø 300 mm (Specify Laser Cutting Diameter) Thickness 2 mm Parallelism < 3'' Substrate Fused Silica Thickness Tolerance ±0.2 mm Clear Aperture 285 mm Weight 283.5 g Diameter Tolerance ±0.2 mm Surface Quality 60-40 scratch-dig Laser Cutting Diameter Shape Round Laser Cut & Quality Levels As is. C of C only Laser Engraving Individual Optic Material Grade 0G Reflected Wavefront Error < λ/10 (1", 25.4 mm, 632.8 nm, RMS) Bevels 0.10mm - 0.40mm face width @ 45° Edge Finish Fine Edge Ground Supplier Location New York, USA Selected Product Option Laser Cutting: Diameter Laser Cut & Engraving: Individual Optic Laser Cut & Quality Level: As is. C of C only See product details More from Sydor
Wafer	632.8 nm (Metrology, Center Wavelength)	Fused Silica	Ø 172 mm	In stock	$ 1353.00
Product Code Manufacturer Corning Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 172 mm Dimensions Ø 172 mm Thickness 8 mm Parallelism < 15'' Substrate Fused Silica Thickness Tolerance ±0.25 mm Clear Aperture 100 mm Weight 68.04 g Diameter Tolerance ±0.2 mm Surface Quality 20-10 scratch-dig Laser Cutting None Shape Round Laser Cut & Quality Levels As is. C of C only Laser Engraving None Surface Roughness < 2 nm (RMS) Material Grade 0F Bevels S1- 4mm ±0.25mm LW @ 45° Edge Finish Fine Ground Supplier Location New York, USA Selected Product Option Laser Cutting: None Laser Engraving: None Laser Cut & Quality Level: As is. C of C only See product details More from Sydor
Wafer	633 nm (Metrology, Center Wavelength)	Fused Silica	Ø 200 mm (Specify Laser Cutting Rectangle)	In stock	$ 622.00
Product Code Wavelength Range 633 nm (Metrology, Center Wavelength) Center Wavelength 633 nm (Metrology) Diameter 200 mm Dimensions Ø 200 mm (Specify Laser Cutting Rectangle) Thickness 1 mm Substrate Fused Silica Thickness Tolerance ±0.025 mm Clear Aperture 5 mm Weight 14.17 g Diameter Tolerance ±0.2 mm Surface Quality 40-20 scratch-dig Laser Cutting Rectangle Shape Round (Specify Laser Cut Rectangle) Laser Cut & Quality Levels As is. C of C only Laser Engraving None Bow < 0.03 mm Quality As is. C of C only Bevels Break edges FW @ 45° Supplier Location New York, USA Selected Product Option Laser Cutting: Rectangle Laser Cut & Engraving: None Laser Cut & Quality Level: As is. C of C only Quality Levels: As is. C of C only See product details More from Sydor
Wafer	632 nm (Metrology, Center Wavelength)	Fused Silica	Ø 200 mm (Specify Laser Cutting Rectangle)	In stock	$ 629.00
Product Code Wavelength Range 632 nm (Metrology, Center Wavelength) Center Wavelength 632 nm (Metrology) Diameter 200 mm Dimensions Ø 200 mm (Specify Laser Cutting Rectangle) Thickness 1 mm Substrate Fused Silica Thickness Tolerance ±0.1 mm Clear Aperture 170 mm Weight 170.1 g Diameter Tolerance ±0.2 mm Surface Quality 40-20 scratch-dig Laser Cutting Rectangle Shape Round (Specify Laser Cut Rectangle) Laser Cut & Quality Levels As is. C of C only Laser Engraving Individual Optic Surface Roughness < 1 nm Transmitted Wavefront Error < λ/4 (per inch) Reflected Wavefront Error < λ Bevels Safety Bevel Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Rectangle Laser Cut & Engraving: Individual Optic Laser Cut & Quality Level: As is. C of C only See product details More from Sydor
Wafer	632.8 nm (Metrology, Center Wavelength)	Fused Silica	Ø 100 mm	In stock	$ 336.00
Product Code Manufacturer Corning Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 100 mm Dimensions Ø 100 mm Thickness 0.4 mm Parallelism < 5'' Substrate Fused Silica Thickness Tolerance ±0.05 mm Clear Aperture 90 mm Weight 141.75 g Diameter Tolerance ±0.2 mm Surface Quality 40-20 scratch-dig Laser Cutting Semi-Notch Shape Round Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving None Material Grade 0F Warp < 0.04 mm Bow < 0.04 mm Bevels Safety Break Edge Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Semi-Notch Laser Cut & Engraving: None Laser Cut & Quality Levels: Full inspection with interferograms See product details More from Sydor
Wafer	632.8 nm (Metrology, Center Wavelength)	Fused Silica	Ø 150 mm	In stock	$ 328.00
Product Code Manufacturer Corning Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 150 mm Dimensions Ø 150 mm Thickness 1.324 mm Parallelism < 10'' Substrate Fused Silica Thickness Tolerance ±0.015 mm Clear Aperture Ø 140 mm Weight 198.45 g Diameter Tolerance ±0.1 mm Surface Quality 60-40 scratch-dig Laser Cutting None Shape Round Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving Individual Optic Surface Roughness < 700 pm (RMS) Material Grade 0F Transmitted Wavefront Error 2λ (per inch) Bevels Safety break edge Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: None Laser Engraving: Individual Optic Laser Cut & Quality Levels: Full inspection with interferograms See product details More from Sydor