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Optics

Optics are used to alter the state of an incident beam of light. Optical components can transmit, reflect, focus, defocus, polarize or change the path of a beam.

Product	Wavelength Range	Substrate	Dimensions	Availability	Price (USD)
Wafer	632.8 nm (Metrology, Center Wavelength)	Fused Silica	Ø 142 mm	In stock	$ 513.00
Product Code Manufacturer Corning Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 142 mm Dimensions Ø 142 mm Thickness 6 mm Parallelism < 2' Substrate Fused Silica Shape Round Clear Aperture 128 mm Thickness Tolerance +0/-0.15 mm Weight 68.04 g Diameter Tolerance +0/-0.15 mm Surface Quality 40-20 scratch-dig Laser Cutting None Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving Individual Optic Material Grade 0G Transmitted Wavefront Error < λ/4 (per inch) Bevels 1.00mm Max FW @ 45° Edge Finish Fine Ground Supplier Location New York, USA Selected Product Option Laser Cutting: None Laser Engraving: Individual Optic Laser Cut & Quality Levels: Full inspection with interferograms See product details More from Sydor
Wafer	632.8 nm (Metrology, Center Wavelength)	Fused Silica	Ø 100 mm	In stock	$ 400.00
Product Code Manufacturer Corning Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 100 mm Dimensions Ø 100 mm Thickness 1.879 mm Parallelism < 1' 22.2'' Substrate Fused Silica Shape Round Clear Aperture 92 mm Thickness Tolerance ±0.025 mm Weight 141.75 g Diameter Tolerance +0.1/-0.2 mm Surface Quality 60-40 scratch-dig Laser Cutting None Laser Cut & Quality Levels As is. C of C only Laser Engraving Individual Optic Surface Roughness < 700 pm Bevels Visible to 0.30mm max LW Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: None Laser Engraving: Individual Optic Laser Cut & Quality Levels: As is. C of C only See product details More from Sydor
Wafer	632 nm (Metrology, Center Wavelength)	Fused Silica	Ø 200 mm (Specify Laser Cutting Rectangle)	In stock	$ 695.00
Product Code Wavelength Range 632 nm (Metrology, Center Wavelength) Center Wavelength 632 nm (Metrology) Diameter 200 mm Dimensions Ø 200 mm (Specify Laser Cutting Rectangle) Thickness 0.5 mm Substrate Fused Silica Shape Round (Specify Laser Cut Rectangle) Clear Aperture 170 mm Thickness Tolerance ±0.1 mm Weight 141.75 g Diameter Tolerance ±0.1 mm Surface Quality 40-20 scratch-dig Laser Cutting Rectangle Laser Cut & Quality Levels As is. C of C only Laser Engraving None Surface Roughness < 1 nm Warp < 0.025 mm Bow < 0.025 mm Bevels Saftey Bevel Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Rectangle Laser Cut & Engraving: None Laser Cut & Quality Level: As is. C of C only See product details More from Sydor
Wafer	632.8 nm (Metrology, Center Wavelength)	Fused Silica	Ø 200 mm	In stock	$ 1315.00
Product Code Manufacturer Corning Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 200 mm Dimensions Ø 200 mm Thickness 5.25 mm Substrate Fused Silica Shape Round Clear Aperture 185 mm Thickness Tolerance ±0.05 mm Weight 283.5 g Diameter Tolerance ±0.1 mm Surface Quality 20-10 scratch-dig Laser Cutting Semi-Notch Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving None Reflected Wavefront Error < 20λ Bevels 0.50mm MAX FW @ 45° Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Semi-Notch Laser Cut & Engraving: None Laser Cut & Quality Level: Full inspection with interferograms See product details More from Sydor
Wafer	632 nm (Metrology, Center Wavelength)	Fused Silica	Ø 100 mm (Specify Laser Cutting Diameter)	In stock	$ 422.00
Product Code Manufacturer Corning Wavelength Range 632 nm (Metrology, Center Wavelength) Center Wavelength 632 nm (Metrology) Diameter 100 mm Dimensions Ø 100 mm (Specify Laser Cutting Diameter) Thickness 1 mm Substrate Fused Silica Shape Round Clear Aperture 85 mm Thickness Tolerance ±0.05 mm Weight 68.04 g Diameter Tolerance ±0.1 mm Surface Quality 40-20 scratch-dig Laser Cutting Diameter Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving None Surface Roughness < 1.3 nm (RMS) Material Grade 0F Warp 0.015 mm Bow 0.01 mm Bevels C-Bevel Edge Finish Fine Ground Supplier Location New York, USA Selected Product Option Laser Cutting: Diameter Laser Cut & Engraving: None Laser Cut & Quality Levels: Full inspection with interferograms See product details More from Sydor
Wafer	632.8 nm (Metrology, Center Wavelength)	Fused Silica	Ø 300 mm	In stock	$ 1666.00
Product Code Manufacturer Corning Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 300 mm Dimensions Ø 300 mm Thickness 5.93 mm Parallelism < 3'' Substrate Fused Silica Shape Round Clear Aperture 285 mm Thickness Tolerance +0/-0.04 mm Weight 68.04 g Diameter Tolerance +0/-0.25 mm Surface Quality 20-10 scratch-dig Laser Cutting Standard Semi-Flat Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving None Surface Roughness < 1.5 nm (RMS) Material Grade 0G Transmitted Wavefront Error < λ/10, λ/4 Reflected Wavefront Error < 0.15λ (Surface 2) Bevels 0.50mm FW max @ 45° Edge Finish Fine Ground Supplier Location New York, USA Selected Product Option Laser Cutting: Standard Semi-Flat Laser Cut & Engraving: None Laser Cut & Quality Level: Full inspection with interferograms See product details More from Sydor
Wafer	632.8 nm (Metrology, Center Wavelength)	Fused Silica	330 x 330 mm	In stock	$ 2992.00
Product Code Manufacturer Corning Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Dimensions 330 x 330 mm Thickness 7.5 mm Substrate Fused Silica Shape Square Clear Aperture Ø 101.6 mm (4") Thickness Tolerance ±0.05 mm Weight 566.99 g Surface Quality 60-40 scratch-dig Material Grade 0G Transmitted Wavefront Error λ/10 (RMS) Length 330 mm Width Tolerance ±0.1 mm Width 330 mm Length Tolerance ±0.1 mm Quality As is. C of C only Bevels Minimum Safety Bevel Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Quality Levels: As is. C of C only See product details More from Sydor
Wafer	632.8 nm (Metrology, Center Wavelength)	N-BK7	Ø 150 mm	In stock	$ 325.00
Product Code Manufacturer SCHOTT Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 150 mm Dimensions Ø 150 mm Thickness 1.964 mm Parallelism < 30'' Substrate N-BK7 Shape Round Clear Aperture 135 mm Thickness Tolerance ±0.01 mm Weight 170.1 g Diameter Tolerance +0/-0.1 mm Surface Quality 40-20 scratch-dig Surface Roughness < 700 pm (RMS) Transmitted Wavefront Error λ/8 (26 mm) Reflected Wavefront Error < λ Quality As is. C of C only Bevels 0.50mm max FW @ 45°; all edges Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Quality Levels: As is. C of C only See product details More from Sydor
Wafer	633 nm (Metrology, Center Wavelength)	Fused Silica	Ø 25.4 mm (1", Specify Laser Cutting Rectangle)	In stock	$ 340.00
Product Code Wavelength Range 633 nm (Metrology, Center Wavelength) Center Wavelength 633 nm (Metrology) Diameter 25.4 mm (1") Dimensions Ø 25.4 mm (1", Specify Laser Cutting Rectangle) Thickness 3.048 mm Substrate Fused Silica Shape Round (Specify Laser Cut Rectangle) Clear Aperture 20.32 mm Thickness Tolerance ±0.127 mm Weight 14.17 g Diameter Tolerance ±0.127 mm Surface Quality 60-40 scratch-dig Laser Cutting Rectangle Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving None Quality Full inspection with interferograms Bevels Break Edge Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Rectangle Laser Cut & Engraving: None Laser Cut & Quality Levels: Full inspection with interferograms Quality Levels: Full inspection with interferograms See product details More from Sydor
Wafer	195 - 2100 nm	UV Fused Silica	Ø 203 mm	In stock	$ 870.00
Product Code Wavelength Range 195 - 2100 nm Diameter 203 mm Dimensions Ø 203 mm Thickness 1 mm Parallelism < 5'' Substrate UV Fused Silica Shape Round Clear Aperture 191 mm Thickness Tolerance +0/-0.1 mm Weight 141.75 g Diameter Tolerance ±0.12 mm Surface Quality 40-20 scratch-dig Laser Cutting None Laser Cut & Quality Levels As is. C of C only Laser Engraving Individual Optic Surface Roughness < 2 - 180 μm (5 A, RMS) Bevels 0.5mm MAX @ 45° FW Edge Finish Fine ground Supplier Location New York, USA Selected Product Option Laser Cutting: None Laser Engraving: Individual Optic Laser Cut & Quality Level: As is. C of C only See product details More from Sydor
Wafer	633 nm (Metrology, Center Wavelength)	Borofloat	160 x 160 mm	In stock	$ 298.00
Product Code Manufacturer SCHOTT Wavelength Range 633 nm (Metrology, Center Wavelength) Center Wavelength 633 nm (Metrology) Dimensions 160 x 160 mm Thickness 2 mm Substrate Borofloat Shape Square Clear Aperture 156 mm Thickness Tolerance ±0.035 mm Weight 226.8 g Surface Quality 40-20 scratch-dig Laser Cutting Standard Semi-Flat Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving None Length 160 mm Width Tolerance ±1 mm Width 160 mm Length Tolerance ±1 mm Bevels 0.3mm ±0.2mm LW @ 45° ±5° Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Standard Semi-Flat Laser Cut & Engraving: None Laser Cut & Quality Level: Full inspection with interferograms See product details More from Sydor
Wafer	632 nm (Metrology, Center Wavelength)	Fused Silica	Ø 200 mm (Specify Laser Cutting Diameter)	In stock	$ 735.00
Product Code Wavelength Range 632 nm (Metrology, Center Wavelength) Center Wavelength 632 nm (Metrology) Diameter 200 mm Dimensions Ø 200 mm (Specify Laser Cutting Diameter) Thickness 0.5 mm Substrate Fused Silica Shape Round Clear Aperture 170 mm Thickness Tolerance ±0.1 mm Weight 141.75 g Diameter Tolerance ±0.1 mm Surface Quality 40-20 scratch-dig Laser Cutting Diameter Laser Cut & Quality Levels As is. C of C only Laser Engraving Individual Optic Surface Roughness < 1 nm Warp < 0.025 mm Bow < 0.025 mm Bevels Saftey Bevel Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Diameter Laser Cut & Engraving: Individual Optic Laser Cut & Quality Level: As is. C of C only See product details More from Sydor
Wafer	632.8 nm (Metrology, Center Wavelength)	Fused Silica	Ø 150 mm (Specify Laser Cutting Rectangle)	In stock	$ 687.00
Product Code Manufacturer Corning Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 150 mm Dimensions Ø 150 mm (Specify Laser Cutting Rectangle) Thickness 1 mm Substrate Fused Silica Shape Round (Specify Laser Cut Rectangle) Clear Aperture 140 mm Thickness Tolerance ±0.01 mm Weight 68.04 g Diameter Tolerance ±0.1 mm Surface Quality 60-40 scratch-dig Laser Cutting Rectangle Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving None Surface Roughness < 700 pm (RMS) Material Grade 0F Bevels Break edge safety Edge Finish Fine Ground Supplier Location New York, USA Selected Product Option Laser Cutting: Rectangle Laser Cut & Engraving: None Laser Cut & Quality Levels: Full inspection with interferograms See product details More from Sydor
Wafer	633 nm (Metrology, Center Wavelength)	Fused Silica	Ø 100 mm (Specify Laser Cutting Diameter)	In stock	$ 465.00
Product Code Wavelength Range 633 nm (Metrology, Center Wavelength) Center Wavelength 633 nm (Metrology) Diameter 100 mm Dimensions Ø 100 mm (Specify Laser Cutting Diameter) Thickness 1.5 mm Parallelism < 10'' Substrate Fused Silica Shape Round Clear Aperture 90 mm Thickness Tolerance ±0.05 mm Weight 85.05 g Diameter Tolerance ±0.1 mm Surface Quality 60-40 scratch-dig Laser Cutting Diameter Laser Cut & Quality Levels As is. C of C only Laser Engraving Individual Optic Bevels C-bevel Edge Finish Fine ground Supplier Location New York, USA Selected Product Option Laser Cutting: Diameter Laser Cut & Engraving: Individual Optic Laser Cut & Quality Levels: As is. C of C only See product details More from Sydor
Wafer	632.8 nm (Metrology, Center Wavelength)	Fused Silica	Ø 165 mm (Specify Laser Cutting Diameter)	In stock	$ 493.00
Product Code Manufacturer Corning Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 165 mm Dimensions Ø 165 mm (Specify Laser Cutting Diameter) Thickness 1.935 mm Substrate Fused Silica Shape Round Clear Aperture 156.75 mm Thickness Tolerance ±0.025 mm Weight 68.04 g Surface Quality 20-10 scratch-dig Laser Cutting Diameter Laser Cut & Quality Levels As is. C of C only Laser Engraving None Material Grade 0F Reflected Wavefront Error < 5λ (RMS) Bevels Break Edge Safety Edge Finish Fine Ground Supplier Location New York, USA Selected Product Option Laser Cutting: Diameter Laser Cut & Engraving: None Laser Cut & Quality Level: As is. C of C only See product details More from Sydor
Wafer	632 nm (Metrology, Center Wavelength)	Fused Silica	Ø 209.55 mm (Specify Laser Cutting Rectangle)	In stock	$ 2556.00
Product Code Manufacturer Corning Wavelength Range 632 nm (Metrology, Center Wavelength) Center Wavelength 632 nm (Metrology) Diameter 209.55 mm Dimensions Ø 209.55 mm (Specify Laser Cutting Rectangle) Thickness 5 mm Substrate Fused Silica Shape Round (Specify Laser Cut Rectangle) Thickness Tolerance ±0.25 mm Weight 907.18 g Diameter Tolerance +0/-0.25 mm Surface Quality 60-40 scratch-dig Laser Cutting Rectangle Laser Cut & Quality Levels As is. C of C only Laser Engraving Individual Optic Material Grade 0G Transmitted Wavefront Error < λ/4 -3 to 5λ/2 < λ/10 (RMS) Edge Finish Fine Edge Ground Supplier Location New York, USA Selected Product Option Laser Cutting: Rectangle Laser Cut & Engraving: Individual Optic Laser Cut & Quality Level: As is. C of C only See product details More from Sydor
Wafer	632.8 nm (Metrology, Center Wavelength)	Fused Silica	Ø 200 mm	In stock	$ 1315.00
Product Code Manufacturer Corning Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 200 mm Dimensions Ø 200 mm Thickness 5.25 mm Substrate Fused Silica Shape Round Clear Aperture 185 mm Thickness Tolerance ±0.05 mm Weight 283.5 g Diameter Tolerance ±0.1 mm Surface Quality 20-10 scratch-dig Laser Cutting None Laser Cut & Quality Levels Full Inspection with Interferograms Laser Engraving Individual Optic Reflected Wavefront Error < 20λ Bevels 0.50mm MAX FW @ 45° Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: None Laser Engraving: Individual Optic Laser Cut & Quality Level: Full inspection with interferograms See product details More from Sydor
Wafer	632.8 nm (Metrology, Center Wavelength)	Fused Silica	Ø 172 mm (Specify Laser Cutting Diameter)	In stock	$ 1653.00
Product Code Manufacturer Corning Wavelength Range 632.8 nm (Metrology, Center Wavelength) Center Wavelength 632.8 nm (Metrology) Diameter 172 mm Dimensions Ø 172 mm (Specify Laser Cutting Diameter) Thickness 8 mm Parallelism < 15'' Substrate Fused Silica Shape Round Clear Aperture 100 mm Thickness Tolerance ±0.25 mm Weight 68.04 g Diameter Tolerance ±0.2 mm Surface Quality 20-10 scratch-dig Laser Cutting Diameter Laser Cut & Quality Levels As is. C of C only Laser Engraving None Surface Roughness < 2 nm (RMS) Material Grade 0F Bevels S1- 4mm ±0.25mm LW @ 45° Edge Finish Fine Ground Supplier Location New York, USA Selected Product Option Laser Cutting: Diameter Laser Cut & Engraving: None Laser Cut & Quality Level: As is. C of C only See product details More from Sydor
Wafer	633 nm (Metrology, Center Wavelength)	Fused Silica	Ø 100 mm	In stock	$ 313.00
Product Code Wavelength Range 633 nm (Metrology, Center Wavelength) Center Wavelength 633 nm (Metrology) Diameter 100 mm Dimensions Ø 100 mm Thickness 1 mm Substrate Fused Silica Shape Round Clear Aperture 3 mm Thickness Tolerance ±0.025 mm Weight 14.17 g Diameter Tolerance ±0.2 mm Surface Quality 40-20 scratch-dig Laser Cutting Standard Semi-Flat Laser Cut & Quality Levels As is. C of C only Laser Engraving Individual Optic Surface Roughness < 1 nm (RMS) Bow < 0.02 mm Quality Full inspection with interferograms Bevels Break edge FW @ 45 degrees Edge Finish Fine edge ground Supplier Location New York, USA Selected Product Option Laser Cutting: Standard Semi-Flat Laser Cut & Engraving: Individual Optic Laser Cut & Quality Levels: As is. C of C only Quality Levels: Full inspection with interferograms See product details More from Sydor
Wafer	632 nm (Metrology, Center Wavelength)	Fused Silica	Ø 100 mm	In stock	$ 190.00
Product Code Manufacturer Corning Wavelength Range 632 nm (Metrology, Center Wavelength) Center Wavelength 632 nm (Metrology) Diameter 100 mm Dimensions Ø 100 mm Thickness 1 mm Parallelism 10'' Substrate Fused Silica Shape Round Clear Aperture 85 mm Thickness Tolerance ±0.05 mm Weight 68.04 g Diameter Tolerance ±0.1 mm Surface Quality 40-20 scratch-dig Laser Cutting Semi-Notch Laser Cut & Quality Levels As is. C of C only Laser Engraving None Surface Roughness < 1 nm (RMS) Material Grade 0G Reflected Wavefront Error 2λ Bevels C-Bevel Edge Finish Fine Ground Supplier Location New York, USA Selected Product Option Laser Cutting: Semi-Notch Laser Cut & Engraving: None Laser Cut & Quality Levels: As is. C of C only See product details More from Sydor