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WAFER TESTLINE - WAFER TESTLINE

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WAFER TESTLINE

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Product Details
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Product Line

The WAFER TESTLINE product line is a versatile electro-optical test and measurement system platform designed for wafer-level photonic device testing. It features a re-configurable probe-wafer layout that accommodates multiple photonic integrated circuit (PIC) designs on a multi-project wafer (MPW). Ideal for R&D proof-of-concept device testing, WAFER TESTLINE offers state-of-the-art, multi-channel electro-optical testing for on-wafer waveguides and PIC input/output. It includes custom 3D-printed fiber tips that support edge-coupling, enabling low-loss coupling for all optical coupling mechanisms. The system is equally effective for testing multiple singulated devices on suitable carrier formats. In volume manufacturing, WAFER TESTLINE allows for fully automatic testing of all identical devices on a wafer. Its built-in device cataloging and traceability provide comprehensive yield and performance data across entire wafers, offering invaluable feedback for wafer fabrication processes.

Product Specifications

The ficonTEC WAFER TESTLINE is a versatile electro-optical test and measurement system designed for wafer-level photonic device testing. It features a high-precision motion system with 6-axis alignment for optical probing and 3-axis alignment for electrical probing. The system can handle wafers up to 12 inches with various rotation and translation capabilities. Temperature control is maintained with a chuck ranging from +15 to +80 °C. Handling options vary from manual to automated loading, and the system is compliant with ISO 6 cleanroom standards. Available in different configurations, the WAFER TESTLINE is suitable for both R&D and volume manufacturing, offering valuable yield data and device traceability.

Product Code
Angular Travel
±100°
Applications
3D Scanning
Sensors
Construction
Rugged steel base production cell
Housing Dimensions
1800 x 1200 x 2000 mm (WT2000)
1200 x 1200 x 2000 mm (WT1200)
1600 x 1200 x 2000 mm (WT1600)
800 x 1200 x 2000 mm (WT800)
Key Features
Superior Test Data Acquisition Over Manual Approach
Wafer Fabs Receive PIC Yield Data Across Entire Wafer
Machine Vision
System referencing and observation camera options
Device and I/O port referencing
Maximum Alignment Time
4 s (Vertical, Edge)
Minimum Connections
120 VAC (or country specific)
Air/vacuum
100 Mbit/s network
Motion System
Multiple optical probing with 6-axis high-precision alignment
Electrical probing with 3-axis alignment
Operating Temperature
15 - 80 °C
Software Features
Flexible and powerful process programming
Extended operator-less control
Supported Wafer Size
< 304.8 mm (12", WT1600, WT2000, WT1200)
< 101.6 mm (4", WT800)
Temperature Accuracy
±0.1 °C
Type of Movement
Rotary, XY Translation
Supplier Location
Germany

Technical Documents

WAFER TESTLINE PDF
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